Intermetallic Growth Research Articles

Prototyping Ti2Cu intermetallic grain growth heterogeneously in Ti6Al4V matrix through laser additive manufacturing

The Ti2Cu intermetallics compound possessing an ability to release Cu2+ ions has promising antibacterial properties. This research integrates experimental and computational techniques to delve into the interfacial intermetallic (IMC) formation within the Ti6Al4V/Cu system. Heat transfer analysis is performed to numerically outline the thermal history within the microstructure during laser surface alloying (power = 1000 W and scan speed = 200 mm/s), while the phase field method is employed to describe the Ti2Cu IMC grain growth in the Ti6Al4V matrix. As the IMC and the matrix phases respectively have free energy minima of -68.52 and -61.35 kJ/mol at Taverage=1250.0 K, the growth of Ti2Cu IMC grains at the Ti6Al4V matrix located around the depth of 5 μm from the top surface is thermodynamically favorable. Laser processing can cause the nucleation of IMC precipitates of irregular sizes and curvature profiles, in which case the curvature driven effects between the adjacent grains can additionally affect their growth kinetics. Furthermore, microbiological assays underscore the superior antibacterial efficacy of the Ti6Al4V+Ti2Cu heterostructures as compared to the control (Ti6Al4V) counterpart.

The Evolution of Interfacial Intermetallic Compound Growth and Solder Joint Strength of Sn-40Pb/Cu under Thermal Aging

The Evolution of Interfacial Intermetallic Compound Growth and Solder Joint Strength of Sn-40Pb/Cu under Thermal Aging

Study of faceted Al2Cu intermetallic compounds growth during solidification under strong static magnetic field via X-ray computed tomography

This study explored the influence of strong static magnetic field (SSMF, > 20 T) on growth behavior of faceted Al2Cu intermetallic compounds (IMCs) in Al-40 wt%Cu alloy by using X-ray computed tomography. The growth process of Al2Cu IMCs is influenced by both cooling rates and SSMF. In the absent of SSMF, morphologies of Al2Cu showed four types which were L-shaped, U-shaped, rectangular and stacked clusters at low cooling rate, while high cooling rates led to dendritic shape. In the present of magnetic field, IMCs tended to maintain the rod-like shape despite the increase in cooling rate. With the increase of magnetic flux density at a constant cooling rate, the size of Al2Cu initially increases and then remains constant. Variations in interface growth supercooling at the growth front and magnetic crystalline anisotropy of IMCs are the causes of changes in morphology and size of Al2Cu. The diffusive melt condition created by SSMF slowed down the coarsening process. These findings not only provide a deeper understanding of alloys solidification under the SSMF but also open the avenues for manipulation strategies of innovative IMCs.

Evaluation of Solidification and Interfacial Reaction of Sn-Bi and Sn-Bi-In Solder Alloys in Copper and Nickel Interfaces

Although there are studies devoted to lower Indium (In) addition, Sn-Bi alloys containing 10 wt.% In or more have been barely investigated so far. Higher In contents may offer the potential for improved joint production, better control over the growth of interfacial layers, and enhanced mechanical strength. The present article focuses on the solidification, wettability, adhesion strength, and interfacial intermetallic growth in the Sn-40%Bi-10%In alloy soldered on Cu and Ni pads. SEM-EDS, wettability tests, and tensile tests were performed. The contact angles were measured in Cu and Ni as 24° and 26°, respectively. Indium addition promoted coarsening of the as-solidified microstructure due to an increase in the alloy solidification range. The Bi spacing was increased at least three times, with a strong segregation of Bi towards the interface. The formation and growth of alloy/Cu reaction layers were also evaluated under the different aging conditions of the as-soldered joints, simulating real service. A growth kinetics model of the reaction layer showed that In increases the activation energy, thereby reducing the layer growth. The adhesions of the formed intermetallics films in Cu and Ni were analyzed using tensile tests. It was observed that the alloy/Ni couple exhibited better adhesion. Premature fracturing appears to happen in the alloy/Cu joint due to the higher intermetallic compound’s (IMC) thickness, rough morphology, and coarser microstructure. Both ductile fracture features with dimples and cleavage zones associated with Bi, Cu6(Sn,In)5, and Ni3Sn4 intermetallics were observed.

Understanding intermetallic compound growth at Ag/Zn interfaces: Kinetics and mechanisms

This study explores the growth behavior and rate-controlling processes of intermetallic compounds at Ag/Zn diffusion couple interfaces. Through experimental observations and quantitative analysis, we identify three distinct intermetallic compounds: β-AgZn, γ-Ag5Zn8, and ε-AgZn3. We analyze the kinetics of intermetallic compound growth to elucidate the mechanisms governing thickness growth in terms of interdiffusion and interface reactions. The rate-controlling process varies with temperature; volume diffusion controls layer growth at 573–593 K, while both volume diffusion and interface reaction contribute at 623–673 K. Additionally, we evaluate the activation enthalpies of parabolic coefficients, providing insights into the temperature dependence of growth kinetics and quantitation. This comprehensive analysis clarifies the intricate mechanisms underlying intermetallic compound formation, offering valuable implications for material performance and processing optimization in various applications.

Thermal and compositional fields to maneuver Cu6Sn5 intermetallic growth on (111) nanotwinned copper substrate

The microstructure of the Cu6Sn5 phase plays a pivotal role in the functionality of microbumps utilized in 3D packaging. In this study, we present an experimental methodology aimed at maneuvering the orientation and morphology of Cu6Sn5 grains formed on (111) nanotwinned Cu substrate, achieved through variations in reflow temperatures (260∘C and 300∘C) and initial Cu proportion in solder (ranging from 0 to 3.0 wt%). At 300∘C and lower initial Cu concentrations (0 and 0.7 wt%), irregularly arranged roof-type Cu6Sn5 grains exhibiting a pronounced {21¯1¯0} texture were observed. Conversely, typical scallop-type Cu6Sn5 grains displaying a specific preferential {21¯1¯3} texture were identified at this temperature for Cu concentrations of 1.5 and 3.0 wt% At 260∘C, the scallop-type morphology was solely present at all Cu composition variants. The differing rates of solute controlled intermetallic phase clustering mechanism at altered solubility limits and magnitudes of thermodynamic driving force for different temperatures, can decide the relative loss of interface coherency and subsequently change the preferred orientation direction of evolving interfacial structures. Our findings demonstrate that the precise control over soldering temperature, solder Cu composition, and the microstructure of Cu UBM can enable the attainment of Cu6Sn5 microstructure with a designated orientation and morphology.

The Effect of Isothermal Aging on the Intermetallic Growth between SN100C Lead-Free Solders and ENIG Surface Finish

The selection of substrate material depends on solder joint requirements and will influence intermetallic compound (IMC) layer formation and reliability of the solder joints. Besides, using different solder materials can also affect the microstructure of IMCs formed during soldering and isothermal ageing process. This study investigated the effect of the IMC formation and microstructure evolution during reflow soldering and isothermal ageing using SN100C lead-free solders and ENIG surface finish. The characterization of the IMC formed during both reflow soldering and isothermal ageing in terms of the type, morphology, and thickness is then analyzed by using the Optical Microscope (OM), Scanning Electron Microscope (SEM) and Energy Dispersive X-ray (EDX). The result reveals that there are two IMC formed at an interface between SN100C and ENIG which are (Cu, Ni)6Sn5 and (Ni, Cu)3Sn4 where (Ni, Cu)3Sn4 grows beneath (Cu, Ni)6Sn5. The thickness of the IMC formation in the SN100C/ENIG solder joint is also directly proportional to the ageing duration, indicating that the longer the time of the IMC exposed to high temperature affects the thickness of the IMC.

Al-Cu intermetallic phase growth in hybrid metal extrusion & bonding welds exposed to isothermal annealing or direct current cycling

Joining of aluminium (Al) to copper (Cu) is of great interest to power generation, transportation and electronic industry. However, dissimilar metal joining often promotes intermetallic phase formation at the joined interface, which in redundancy can cause mechanical degradation and increased electrical resistance. The welding technique hybrid metal extrusion & bonding (HYB) is proven capable of joining dissimilar metals with a total intermetallic phase layer thickness <▪. To test how Al-Cu HYB joints perform as electrical conductors, a 6101 Al alloy HYB-welded to Cu is exposed to heat treatment at ▪ or cycling of direct current density up to ▪. In-depth micro- and nanostructure characterisation by (scanning) transmission electron microscopy and atom probe tomography are used to describe the structure and chemistry of the formed intermetallic phases.The Al-Cu HYB joints exhibited resilience against intermetallic phase growth during isothermal heat treatment or exposure to electric current. However, a non-symmetry is observed dependent on the current direction, creating voids in Cu near, and in the intermetallic layers when the current goes from Al to Cu. Detailed microstructure characterisation unveils Si and Mg in the intermetallic phase layers. Their origin and role in intermetallic phase growth are discussed.

Influence behavior and mechanism of crystal orientation of Cu6Sn5 coating on interfacial intermetallic compounds growth in Sn-0.7Cu/Cu solder joint

Herein, the Cu6Sn5 coatings with principal crystal orientations were prepared on the Cu substrate using magnetron sputtering to inhibit the growth of interfacial intermetallic compounds (IMCs) in Sn-0.7Cu/Cu solder joint. The effect of sputtering parameter on the principal crystal orientation of Cu6Sn5 coating was researched firstly, followed by the investigation on the influence of Cu6Sn5 coating principal orientation on the interfacial IMCs growth kinetics. The influence mechanisms were studied using molecular dynamics simulations and first-principles calculations. The results revealed that the increasing sputtering power from 40 W to 60 W and 80 W can not only improve the bonding property between the prepared Cu6Sn5 coating and Cu substrate, but also promote the transformation of the coating principal orientation from (132) to (132)/(22-1) and (132)/(22-1)/(42-2). Moreover, the three prepared Cu6Sn5 coatings can inhibit IMC growth at SC07/Cu solder joint, and the Cu6Sn5 coatings with (132)/(22-1) and (132)/(22-1)/(42-2) principal orientations exhibit more significant inhibitory effects on IMC growth than that with (132) principal orientation. It can be proved in this work that the growth of interfacial IMCs in Sn-0.7Cu/Cu solder joint at aging stage is mainly caused by the diffusion of Cu from Cu substrate toward Cu6Sn5 phase. The difference in the growth behavior of IMCs can be attributed to the fact that when the Cu atoms diffuse across Cu6Sn5 (22-1) and Cu6Sn5 (42-2), the bonding strength between the Cu atom at the saddle point and its surrounding atoms is significantly larger than when diffusing across Cu6Sn5 (132), leading to the smaller diffusion coefficients and a slower interfacial IMCs growth rate.

Influence of carbon nanotubes on the morphology of Cu6Sn5 in Cu/(Sn–Ag–Cu) solder joints

This study delves into the intricate interaction between multi-walled carbon nanotubes (MWCNTs) and the Sn–Ag–Cu solder system, highlighting its relevance in lead-free soldering applications. Reflow and isothermal aging induce the formation of intermetallic layers at the joint interface, including Cu6Sn5, Cu3Sn, and irregularly shaped Ag3Sn particles. The addition of MWCNTs leads to the flattening of Cu6Sn5 grains, restraining their growth and potentially improving mechanical strength. Notably, MWCNTs exhibit a relatively high affinity with Ag3Sn. Grain size distribution analysis indicates that MWCNTs reduce particle size, effectively suppressing intermetallic compound growth. Over time, grain size increases due to simultaneous coarsening and growth during isothermal aging. In the growth kinetics analysis of intermetallic compounds in SAC305-MWCNTs solder joints, stable behavior is observed for Cu3Sn growth, driven by solid-state diffusion between Cu6Sn5 and Cu. In contrast, Cu6Sn5 exhibits significant variations in growth behavior with temperature changes. Furthermore, the evaluation of activation enthalpy for Cu3Sn growth in the Cu/(SAC305-MWCNTs) and Cu/SAC305 diffusion couples reveals similar n and k values of the power function for the layer growth, indicating a comparable rate-controlling process for Cu3Sn growth. The presence of MWCNTs in the solder does not significantly influence the rate-controlling process or activation enthalpy for Cu3Sn growth, contrasting with the observed effects on Cu6Sn5 growth. This study provides valuable insights into the interactions within the SAC305-MWCNTs solder system, offering significant implications for lead-free soldering applications.

A simulation of Al-Si coating growth under various hot stamping austenitization parameters: An artificial neural network model

22MnB5 hot stamping steels are pre-coated with an Al-Si layer to prevent oxidation and decarburization during the austenitization process, which includes heating and soaking within a furnace. Above ∼577 °C, the Al-Si coating transforms into Fe-Al and Fe-Al-Si intermetallic phases because of diffusion and solidification. In the present work, a deep neural network (DNN) model was developed to predict coating intermetallic growth under various heating rates and soaking conditions. The DNN model was trained using experimental data (energy dispersive x-ray spectroscopy chemical scans) collected from our coating growth characterization work. The heating rate (r), heating time (th), soaking time (ts), and the distance of each measured point away from the coating surface (d) are defined as input parameters, and the outputs are the weight percentage of Al, Fe, and Si. The model successfully predicted the chemical composition of the training dataset, which consisted of a single-stage heating process, followed by a soaking stage at a constant temperature. To validate the model, complex two-stage heating tests were conducted, and the intermetallic coating growth was quantified. The DNN model successfully predicted the two-stage heating test coating profiles, despite a minimal error that was due to the variation in as-received coating thickness. The DNN model predicts the overall experimental trends that show the heating rate has little effect on the transformed intermetallic species, but it affects the transformation rate of the intermetallic phases. Moreover, the higher heating rate test (after 750℃) resulted in the formation of the island shaped τ1 and/or τ2 phase, while the heating rate before 750℃ does not affect the morphology of the τ1 and/or τ2 phase.

Interfacial intermetallic compounds growth kinetics and mechanical characteristics of Ga-Cu interconnects prepared via transient liquid phase bonding

Driven by continuous miniaturization, higher performance, and functional robustness in three-dimensional (3D) embodiments of electronic devices, Ga which possesses a low melting point (29.8°C) has shown its potential uses in electronics packaging and integration. The use of Ga metal as a solder material to achieve low-temperature transient liquid phase bonding (TLPB) has emerged as a viable solution for reliable interconnections of future-generation products. This study investigates the interfacial intermetallic compounds (IMCs) structure, growth kinetics, and mechanical characteristics of Ga-Cu TLPB joints in the temperature range of 150–220°C. The Cu9Ga4 phase were observed and the growth rate of Ga-Cu IMCs has been investigated. The research findings indicate that the growth mechanism of interface IMCs is primarily diffusion-controlled, with CuGa2 grains exhibiting anisotropic growth. Their shear strength has reached 23.8 MPa, with a porosity of 1.82±0.07%. Furthermore, the fracture interface is presented and correlated with the experimental observations.

Improvement of PbSn Solder Reliability with Ge Microalloying-Induced Optimization of Intermetallic Compounds Growth.

PbSn solders are used in semiconductor devices for aerospace or military purposes with high levels of reliability requirements. Microalloying has been widely adopted to improve the reliability for Pb-free solders, but its application in PbSn solders is scarce. In this article, the optimization of PbSn solder reliability with Ge microalloying was investigated using both experimental and calculation methods. Intermetallic compounds (IMC) growth and morphologies evolution during reliability tests were considered to be the main factors of device failure. Through first-principle calculation, the growth mechanism of interfacial Ni3Sn4 was discussed, including the formation of vacancies, the Ni-vacancies exchange diffusion and the dominant Ni diffusion along the [1 0 0] direction. The doping of Ge in the cell increased the exchange energy barrier and thus inhibited the IMC development and coarsening trend. In three reliability tests, only 0.013 wt% Ge microalloying in Pb60Sn40 was able to reduce IMC thickness by an increment of 22.6~38.7%. The proposed Ge microalloying method in traditional PbSn solder could yield a prospective candidate for highly reliable applications.

Extremely thin intermetallic layer in dissimilar AA6061-T6 and mild steel friction stir lap welding using a hemispherical tool

The dissimilar friction stir lap welding of AA6061-T6 and mild steel using the hemispherical tool tilted towards the retreating side is investigated. Critical defects such as hook features and internal voids are avoided by limiting the plunge depth in the lower plate to a tenth of a millimeter. The low heat generation guaranteed by the hemispherical tool produces a nanoscale intermetallic compound layer alternatively composed of an Al-rich and a ternary Al–Fe–Mg phases. The complex and extremely thin interlayers strengthen the Al–Fe mechanical bonding, guaranteeing high mechanical properties and rupture within the Al-stirred zone. Thermomechanical phenomena governing friction stir lap welding with the hemispherical tool drastically limit the growth of intermetallics, leading to the high mechanical strength of the lap joint.

Intermetallic compounds growth and morphology evolution of Al6061/SS304 electromagnetic pulse welding joint interface during post-weld heat treatment

The effects of heat treatment on the intermetallic compounds (IMCs) and morphology at the interface of stainless steel 304 bonded to aluminum 6061 by electromagnetic pulse welding (EMPW) were investigated in this study. A thin discontinuous non-uniform wavy transition layer with an average thickness of 1.144 μm was formed at the interface of the as-welded joint. After heat treatment, the average grain size of the Al/SS304 interface grew from 6.85 μm to 7.42 μm. The thickness of the transition layer increased significantly, reaching an average thickness of 4.109 μm after heating at 210 °C for 4 h. In addition, the wavy interface grew gradually and became smooth with increasing heating temperature, suggesting the growth rate of the IMCs at the trough was greater than that at the adjacent crest. Then the effect of heating time on the growth of IMCs was studied. According to the characteristics of the transition layer and the diffusion law, the IMCs grew faster at the trough than at the crest of the transition layer. Differences in element concentration, crystal deformation, grain boundaries, dislocation density, and energy storage were observed at the trough and crest of the interface as a result of the different growth rates of the IMCs.

Intermetallic compound growth behavior and mechanical performance in Sn58Bi/Cu solder joint bearing Mg particles incorporation during thermal aging

The microstructure and intermetallic compound (IMC) growth in Sn58Bi/Cu and Sn58Bi-0.4 Mg/Cu solder joints were examined in this study under varied thermal aging time (6, 12, 18, 24, and 30 h) at 120 °C. The Shear test was conducted to assess the solder joint mechanical performance. The results indicated that the precipitation of the Bi phase in Sn58Bi/Cu and Sn58Bi-0.4 Mg/Cu solder joints was not significantly inhibited by adding Mg as aging time increased. The IMC layer thickness of both solder joints increased as the aging time increased, but the Cu3Sn IMC thickness in Sn58Bi-0.4 Mg/Cu solder joint was consistently thinner than that in Sn58Bi/Cu joint. The temporal evolution of the Cu3Sn IMC layer was investigated, and it was found that the inclusion of Mg particles reduced the diffusion coefficient of Cu3Sn IMC. Furthermore, the shear test revealed that throughout the initial phases of thermal aging, fractures occurred within the solder matrix for both joints. As thermal aging time increased, fractures extended into the IMC layer, accompanied by transgranular and intergranular fractures. Simultaneously, adding Mg particles delayed brittle fracture in the solder joints, enhancing their mechanical properties.

Optimization of Wire-bonding Process Parameters for Gold Wire and Aluminium Substrate using Response Surface Method

Wire bonding is a connecting technique that uses a combination of temperature, force, ultrasonic power, and time to attach two metallic materials, a wire, and a bond pad. In electronics, gold-aluminium (Au-Al) contact wire bonds are widespread due to corrosion resistance and great conductivity of both metals. However, due to the large contact-potential difference, the intermetallic compound growth at the metal’s interaction boundary has considerably worsened the advantageous properties of Au-Al intermetallic system. This intermetallic exhibit low toughness, and possibly low corrosion resistance, which would result in poor bonding quality. In this work, the materials used are 4x8 aluminium substrates and a 100-meter-long gold wire spool. This study aims to investigate the most optimised set of parameters to be used in Au-Al wire bond system, due to how problematic this system could have towards bonding quality. The experimental array was created using a response surface methodology (RSM)-based design of experiments. The effect of parameters and their significance to bonding quality in the Au-Al bond system were studied using analysis of variance (ANOVA). A correlation model was created for the wire bond strength data. The findings suggest that, within the range of parameters examined, the proposed correlation model can be utilized to predict performance measures. The optimum value of Au-Al wire bond system parameters was established at the time of bond at the first bonding site selected for 300 milliseconds (ms), wire looping height selected for 1200 micrometre (μm), wire bond Y-axis length selected for 996 micrometre (μm), and ultrasonic force at second bonding site selected for 300 milli Newton (mN). The outcomes of this research add to our understanding of the Au-Al wire bonding contact, in addition, to enhancing the wire bond's quality.

Synchrotron X-ray operando study and multiphysics modelling of the solidification dynamics of intermetallic phases under electromagnetic pulses

In this paper, we used synchrotron X-ray radiography and tomography to study systematically and in operando conditions the growth dynamics of the primary Al3Ni intermetallic phases in an Al-15wt%Ni alloy in the solidification process with magnetic pulses of up to 1.5 T. The real-time observations clearly revealed the growth dynamics of the intermetallics in time scale from millisecond to minutes, including phase growth instability, side branching, fragmentation and orientation alignment under different magnetic pulse fluxes. A multiphysics numerical model was also developed to calculate the alternating and cyclic Lorentz forces and stresses acting on the Al3Ni phases and the nearby melt due to the applied pulses. Combining the results of the operando experiments and modelling, for the first time, the differential forces between the growing Al3Ni phases and the nearby melt were quantified. The forces can create slip dislocations at the growing crystal front which can further develop into nm and µm crystal steps for initiating phase branching. Furthermore, the magnitudes of the shear stresses are strongly related to the size, morphological and geometric features of the growing Al3Ni phases. Dependent on the magnitude of the shear stresses, phase fragmentation could occur in a single pulse period or in multiple pulse periods via fatigue mechanism. This systematic research work elucidate some of the long-time debated hypotheses concerning intermetallic phases growth instability and phase fragmentation in pulse magnetic fields. The research establishes a robust theoretical framework for quantitative understanding of the intermetallic phase growth dynamics in solidification under pulse magnetic fields.

Effect of non-standard SnAg surface finishes on properties of solder joints

In this study, the effects of nonstandard near-eutectic SnAg surfaces on the wettability, intermetallic compound growth and mechanical properties of solder joints were investigated. Four types of surface finishes based on near-eutectic SnAg alloys with different compositions and numbers of layers were analyzed. Design/methodology/approachThe effect of surface-finishes SnAg5NiP and SnAg7NiP, which were prepared with and without a Ni-P diffusion barrier, was tested. The Ni-P layer was produced either chemically or electrochemically. The effect of the SnAg surface finish on wettability, formation, and growth of intermetallic compound in the solder joint was analyzed. We further explored the impact of different PCB finishes on the quality of soldered joints. This investigation involved a comparative analysis of the behavior of SnAg finishes in comparison to pure copper, as well as the commonly employed HASL, ENIG, and ImSn finishes. FindingsIt was found that SnAg surface finishes with a Ni-P diffusion barrier are wetted by molten solder faster than surface finishes without a diffusion barrier. The mechanical properties of the joints on both surfaces are comparable to those on ENIG. SnAg that include a chemically created Ni-P diffusion layer is characterized by the formation of more thermally stable ternary intermetallic compounds based on (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4. On the contrary, the electrochemically formed Ni layer supports the increase in the rate of intermetallic compound formation, which affects the properties of the soldered joints. OriginalityNonstandard near-eutectic SnAg finishes, which contains a Ni-P diffusion layer can be used as promising replacement of ENIG or other standard finishes.

The Effect of Joint Thickness on Intermetallic Growth in the In52Sn48(Liquid)/Cu(Solid) Diffusion Couple

Intermetallic growth can simultaneously enable low-resistance electrical pathways and determine the lifetime of a solder joint. Motivating this work is a demountable linear bilateral solder joint application, enabled via a vacuum pressure impregnation process. The effect of the initial solder joint thickness δj=25-125\\documentclass[12pt]{minimal} \\usepackage{amsmath} \\usepackage{wasysym} \\usepackage{amsfonts} \\usepackage{amssymb} \\usepackage{amsbsy} \\usepackage{mathrsfs} \\usepackage{upgreek} \\setlength{\\oddsidemargin}{-69pt} \\begin{document}$$\\delta _j = 25 - 125$$\\end{document}μ\\documentclass[12pt]{minimal} \\usepackage{amsmath} \\usepackage{wasysym} \\usepackage{amsfonts} \\usepackage{amssymb} \\usepackage{amsbsy} \\usepackage{mathrsfs} \\usepackage{upgreek} \\setlength{\\oddsidemargin}{-69pt} \\begin{document}$$\\mu $$\\end{document}m on intermetallic growth in this configuration is investigated for the In52Sn48\\documentclass[12pt]{minimal} \\usepackage{amsmath} \\usepackage{wasysym} \\usepackage{amsfonts} \\usepackage{amssymb} \\usepackage{amsbsy} \\usepackage{mathrsfs} \\usepackage{upgreek} \\setlength{\\oddsidemargin}{-69pt} \\begin{document}$$\ ext{In}_{52}\ ext{Sn}_{48}$$\\end{document}(liquid)/Cu(solid) diffusion couple for temperatures T = 393, 413 and 433 K, in the range just above the In52Sn48\\documentclass[12pt]{minimal} \\usepackage{amsmath} \\usepackage{wasysym} \\usepackage{amsfonts} \\usepackage{amssymb} \\usepackage{amsbsy} \\usepackage{mathrsfs} \\usepackage{upgreek} \\setlength{\\oddsidemargin}{-69pt} \\begin{document}$$\ ext{In}_{52}\ ext{Sn}_{48}$$\\end{document} melting temperature of 391 K. It was found that beyond a critical time ∼1-15\\documentclass[12pt]{minimal} \\usepackage{amsmath} \\usepackage{wasysym} \\usepackage{amsfonts} \\usepackage{amssymb} \\usepackage{amsbsy} \\usepackage{mathrsfs} \\usepackage{upgreek} \\setlength{\\oddsidemargin}{-69pt} \\begin{document}$$\\sim 1-15$$\\end{document} min into the kinetic reaction, thicker solder joints had more intermetallic growth. There are two intermetallic phases identified in this temperature range: Cu6(In,Sn)5\\documentclass[12pt]{minimal} \\usepackage{amsmath} \\usepackage{wasysym} \\usepackage{amsfonts} \\usepackage{amssymb} \\usepackage{amsbsy} \\usepackage{mathrsfs} \\usepackage{upgreek} \\setlength{\\oddsidemargin}{-69pt} \\begin{document}$$\ ext{Cu}_{6}\ ext{(In,Sn)}{_5}$$\\end{document} closer to the Cu substrate, and Cu(In,Sn)2\\documentclass[12pt]{minimal} \\usepackage{amsmath} \\usepackage{wasysym} \\usepackage{amsfonts} \\usepackage{amssymb} \\usepackage{amsbsy} \\usepackage{mathrsfs} \\usepackage{upgreek} \\setlength{\\oddsidemargin}{-69pt} \\begin{document}$$\ ext{Cu(In,Sn)}_{2}$$\\end{document} closer to the solder bulk. The intermetallic growth fits give temporal growth exponents between n=0.25-0.29\\documentclass[12pt]{minimal} \\usepackage{amsmath} \\usepackage{wasysym} \\usepackage{amsfonts} \\usepackage{amssymb} \\usepackage{amsbsy} \\usepackage{mathrsfs} \\usepackage{upgreek} \\setlength{\\oddsidemargin}{-69pt} \\begin{document}$$n = 0.25 - 0.29$$\\end{document}, indicating that grain boundary diffusion rather than volume diffusion is the predominant growth mechanism. Growth in thicker joints is associated with higher temporal growth exponents; this is attributed to suppressed grain coarsening, as there is Cu dissolution from the intermetallic into the solder bulk in the early stages of the reaction, in more highly unsaturated environments. In addition, there is on average a decrease in the intermetallic phase activation energy with increasing joint thickness. In combination with the literature, the results suggest the linear bilateral joint geometry has a growth constraining effect, and the liquid solder phase state strongly affects the morphology and coarsening of grains, leading to the intermetallic growth trends observed.