Optimization of Wire-bonding Process Parameters for Gold Wire and Aluminium Substrate using Response Surface Method

Abstract

Wire bonding is a connecting technique that uses a combination of temperature, force, ultrasonic power, and time to attach two metallic materials, a wire, and a bond pad. In electronics, gold-aluminium (Au-Al) contact wire bonds are widespread due to corrosion resistance and great conductivity of both metals. However, due to the large contact-potential difference, the intermetallic compound growth at the metal’s interaction boundary has considerably worsened the advantageous properties of Au-Al intermetallic system. This intermetallic exhibit low toughness, and possibly low corrosion resistance, which would result in poor bonding quality. In this work, the materials used are 4x8 aluminium substrates and a 100-meter-long gold wire spool. This study aims to investigate the most optimised set of parameters to be used in Au-Al wire bond system, due to how problematic this system could have towards bonding quality. The experimental array was created using a response surface methodology (RSM)-based design of experiments. The effect of parameters and their significance to bonding quality in the Au-Al bond system were studied using analysis of variance (ANOVA). A correlation model was created for the wire bond strength data. The findings suggest that, within the range of parameters examined, the proposed correlation model can be utilized to predict performance measures. The optimum value of Au-Al wire bond system parameters was established at the time of bond at the first bonding site selected for 300 milliseconds (ms), wire looping height selected for 1200 micrometre (μm), wire bond Y-axis length selected for 996 micrometre (μm), and ultrasonic force at second bonding site selected for 300 milli Newton (mN). The outcomes of this research add to our understanding of the Au-Al wire bonding contact, in addition, to enhancing the wire bond's quality.