Vacuum diffusion bonding of TC4 titanium alloy (TC4) to T2 copper (T2) using nickel foil as transition interlayer was explored. Ti3Ni, Ti2Ni, TiNi, AlNi2Ti and TiNi3 phases arose at the TC4/Ni bonded interface, and Cu-Ni solid solution appeared in the Ni/T2 interface. Thereinto, AlNi2Ti was a kind of discontinuous nano precipitated phase, which distributed between TiNi and TiNi3 phases. The crystallographic orientations of Ti2Ni, TiNi, AlNi2Ti and TiNi3 phases were (201), (020), (11¯1) and (031), respectively. The interplanar spacing of (031), (11¯1) and (020) was correspondingly d(031) = 0.144 nm, d11¯1 = 0.275 nm and d(020) = 0.137 nm. The lattice mismatch between TiNi3 and TiNi was calculated to be 2.5 %, with low strain energy. The order of effective formation enthalpies for TiNi3, TiNi and Ti2Ni phases formed between titanium and nickel was ∆H′NiTi2 > ∆H′NiTi > ∆H′Ni3Ti. The growth activation energy of TiNi3, TiNi and Ti2Ni phases was correspondingly 35.8 kJ/mol, 180.6 kJ/mol and 347.1 kJ/mol. When welding at 880 °C for 60 min, the highest shear strength of the joints could achieve 150 MPa. The joints fractured along the Ni/T2 interface, the fracture surface of joint was composed of elongated dimples and cellular pits, presenting a shear ductile fracture mode. FCC-Cu, FCC-Ni and (Ni, Cu)ss phases were detected on TC4 and T2 fracture surfaces by XRD. The interdiffusion coefficient ratio of (Ni in Cu)/(Cu in Ni) and (Ni in Ti)/(Ti in Ni) decreased gradually with increasing temperature.
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