The surface measurements of strain components in high temperature creep of a coarse grained Cu - 30% Zn alloy were carried out in order to determine the contributions to creep strain of participating processes—grain interior deformation, grain boundary sliding and intercrystalline void formation. An equation describing the contribution of intercrystalline void formation was developed on the basis of detailed metallographic observations. Grain boundary sliding and grain interior deformation were found to be mutually independent processes, whereas intercrystalline void formation, consisting of intercrystalline cracking preceded by cavitation, represents a process accommodating stress concentrations created by grain boundary sliding and grain interior deformation. The relative importance of these three processes strongly depends on testing conditions. Thus, at applied stresses not exceeding 1.0 kg/mm 2 the contribution to creep strain of grain interior deformation is almost negligible at temperatures lower than about 500°C while it predominates at temperatures higher than about 700°C. The contribution to creep strain of intercrystalline void formation is proportional to the sum of the contributions of grain interior deformation and grain boundary sliding.