Heat Spreader Research Articles

Elliptical pillars for the thermal performance enhancement of micro-structured evaporators

In this study, we propose and investigate the employment of elliptical micropillars as a novel evaporator wick structure to boost the performance of capillarity-driven two-phase heat spreaders through high-fidelity numerical modeling that accounts for all pertinent transport mechanisms, including thermocapillary convection. Results reveal that transforming cylindrical micropillars to elliptical ones significantly enhances the overall evaporator performance by improving the hydraulic performance associated with decreased flow resistance and boosted capillary pumping and by improving the thermal performance associated with increased contact (triple) line length. Among the scenarios tested and elliptical aspect ratios swept, it is demonstrated that the heat capacity and heat transfer coefficient can be increased by up to 350% and 52%, respectively. Overall, this study paves the way for the utilization of stretched geometries in the capillary flow direction of pillar-type evaporators by using elliptical micropillars as a demonstrator showcase.

An improved method for monitoring the junction temperature of 1200V / 50A IGBT modules used in power conversion systems

Abstract Insulated gate bipolar transistor (IGBT) is one of the most used devices for high-power-density and high-voltage applications such as wind turbines, electric vehicles, and smart grids. However, the field of IGBT research is still in its infancy owing to the failures that can happen to the module due to its temperature rise. Hence, the junction temperature T j measurement of the active region is essential for analyzing and predicting the degradation state of the IGBT device. In this paper, an overall study, including uses of the governing thermal equation to estimate the junction temperature T j, experimental analysis of the IGBT component during operation, and a numerical finite element (FE) study, was conducted. The thermal management FE model is conducted to predict temperature variation along time and heat spreading inside the IGBT layers. To investigate the material’s properties and structure change during operation impacting the junction temperature, scanning electron microscopy (SEM) and energy X-ray dispersive spectroscopy (EDS) were performed on the IGBT power module. Results were used to interpret the difference between the experimental and the predicted temperature values. For effectiveness validation purposes, results obtained from the proposed FE model are compared with the results of the experimental thermo-sensitive electrical parameters (TSEP) method. Good agreement was found between the experiment and the proposed FE model.

A new fractional Cattaneo model for enhancing the thermal performance of photovoltaic panels using heat spreader: energy, exergy, economic and enviroeconomic (4E) analysis

A new fractional non-Fourier (Cattaneo) photovoltaic (PV) model is presented to enhance the thermal performance of a PV system combined with a heat spreader (HS). The fractional Cattaneo model is shown to be effective in examining transient processes across the entirety of a PV system, in contrast to the conventional Fourier model’s inability to predict system performance. Consequently, a comparison is conducted between the classical Fourier model with the fractional Fourier and fractional Cattaneo models for the PV system. The impact of using an aluminum heat spreader, with rectangular and trapezoidal shapes, has been developed under hot and cold climate conditions. The findings show that adding a trapezoidal heat spreader reduced the cell temperature by 20 K in summer and 12 K in winter. The reduction in the PV temperature led to an enhancement in daily average power by approximately 28% and 37% in hot and cold weather, respectively. Moreover, economic, exergoeconomic, and enviroeconomic assessment is introduced. The outcomes revealed that the electrical production costs of the rectangular and trapezoidal HS systems are 0.272 and 0.214 $/kWh, respectively, while about 0.286 $/kWh for the conventional PV panel. Based on the environmental study, the estimated CO2 reduction for PV, PV with rectangular HS, and PV with trapezoidal spreader is 0.5504, 0.7704, and 0.8012 tons, respectively. Finally, real experimental data are used to validate the fractional Cattaneo model. The results demonstrate that there is a great fitting with the measured data, with errors in PV power and exergy efficiency of just 0.628% and 3.84%, respectively, whereas their corresponding values for the classical model are 5.72 and 13.13%.

Experimental and numerical investigation on thermal characteristics of the heat sink integrating 3D vapor chamber heat spreader and liquid cooling fins

The traditional vapor chamber/ heat pipe heat sink in high-power chip heat dissipation structures consists of two separate parts. The contact thermal resistance between these parts leads to an increase in thermal resistance during the heat transfer process. To mitigate the contact thermal resistance and improve the heat dissipation performance of vapor chamber heat sinks, this paper proposes a heat sink integrating a 3D vapor chamber heat spreader and liquid cooling fins. Experiments and simulations were carried out to analyze the heat transfer characteristics under different heating powers. The pressure drop and thermal resistance were calculated to analyze the internal phase-change heat transfer process and capillary heat transfer limit. The simulation results were in close agreement with the experimental data for heating powers ranging from 397 to 795 W, with the thermal resistance of the proposed heat sink of about 0.04℃/W. Compared to three traditional vapor chamber heat sinks operating under the same heat flux, the proposed type exhibited a noteworthy enhancement in the heat transfer performance, leading to a reduction in thermal resistance by approximately 44% to 67%.

Thermal Characterization of Metal-Diamond Composite Heat Spreaders Using Low-Frequency-Domain Thermoreflectance.

High thermal conductivity and an appropriate coefficient of thermal expansion are the key features of a perfect heat spreader for electronic device packaging, especially for applications with increased power density and the increasing demand for higher reliability and semiconductor device performance. For the past decade, metal-diamond composites have been thoroughly studied as a heat spreader, thanks to their high thermal conductivities and tailored coefficients of thermal expansion. While existing thermal characterization methods are good for quality control purposes, a more accurate method is needed to determine detailed thermal properties of these composite materials, especially if clad with metal. Low-frequency-range-domain thermoreflectance has been adopted to measure the thermal conductivity of a metal-diamond composite sandwiched between metal cladding layers. Due to this technique's low modulation frequencies, from 10 Hz to 10 kHz, multiple layers can be probed and measured at depths ranging from tens of micrometers to a few millimeters.

Dimension effect on thermal conductivity of hexagonal boron nitride/titanium dioxide reinforced hybrid PEEK composites developed with a scalable compounding approach

AbstractFor the removal of elevated thermal flux in high‐temperature applications, there is an urgent need for robust and lightweight thermally conductive thermoplastic materials with suitable mechanical integrity. In current work, multiscale hexagonal boron nitride (hBN) and titanium dioxide (TiO2) fillers are integrated into polyetheretherketone (PEEK) polymer to create a synergistic effect regarding thermal conductivity. An optimized twin‐screw extrusion is utilized to disperse the fillers uniformly in the host polymer by changing the screw design in terms of kneading, mixing, and reverse elements, feeding zones of the fillers/polymer, and the feeding cycles. Various specimens were developed by systematically varying the relative filler amount of the thermally anisotropic hBN and the thermally isotropic TiO2, while the total filler content was fixed to 60 wt%. As a result, 50B‐10T composite exhibited an ultrahigh thermal conductivity of 8.195 W/(m.K), with a 3139% enhancement compared to unfilled PEEK. Moreover, as the PEEK‐mediated regions are occupied with nano‐sized TiO2, efficient channels for phonon transport are formed between hybrid fillers, and the through‐plane thermal conductivity reached 1.704 W/(m.K) in 50B‐10T sample. The potential application of prepared composites as a heat spreader is demonstrated by monitoring surface temperature distribution and numerical simulation. Meanwhile, we achieved a synchronous improvement in mechanical stiffness within hybrid composites; and failure mechanisms including crack bridging at TiO2‐PEEK interface, and debonding at hBN‐PEEK interface are observed in hybrid composites. Lastly, the high thermal stability makes the PEEK/hBN/TiO2 specimens suitable for heat dissipation in demanding applications in the energy and aerospace sectors.Highlights Bespoke screw design developed for scalable manufacturing of Polyetheretherketone (PEEK) matrix composites reinforced with Hexagonal Boron Nitride (hBN) and Titanium Dioxide (TiO2) via twin‐screw melt compounding. Interconnected 3D filler networks were achieved due to the filler dimension effect, allowing us to reach an ultrahigh in‐plane thermal conductivity value of 8.2 W/(m.K) and through‐plane thermal conductivity value of 1.7 W/(m.K) for 50B‐10T specimen. Manufactured hybrid PEEK/hBN/TiO2 composite specimens possess excellent mechanical stiffness.

Experimental study on heat transfer characteristics of the phase change chambers for heat flux enhancement

One promising way to increase the output power and the thermoelectric conversion efficiency of an automotive exhaust thermoelectric generator (TEG) is to add a phase change chamber between the exhaust channel and the thermoelectric (TE) modules with the chamber surface contacting with the exhaust channel where boiling occurs being larger than that with the module surfaces where the condensation occurs. The power is increased because a phase change chamber significantly increases the heat flux through the modules; thus, increasing the temperature difference between the module hot and cold sides. Although there is a significant body of literature on phase change chambers, most prior research has focused on chambers with larger condensation areas than boiling areas since they act as heat spreaders, while little is on chambers with condensation areas smaller than boiling areas for heat flux enhancement. These chambers have great potential to improve TEG power generation by enhancing the heat flux, therefore, more studies are needed to understand the chamber heat transfer characteristics. This research experimentally investigated the heat transfer characteristics of three chambers with condensation to boiling area ratios of 1/5, 2/5, and 3/5 for boiling heat fluxes from 4.50 to 22.70 kW/m2 and deionized water filling ratios from 33 to 50%. The results show that the boiling heat transfer coefficient increases with increasing heat flux or decreasing area ratio and is weakly influenced by the filling ratio. The condensation heat transfer characteristics depend on the distribution of droplets which is strongly affected by both the heat flux and the area ratio. The influence of the filling ratio on the condensation heat transfer coefficient increases with increasing area ratio. The thermal resistance of the chamber decreases with increasing heat flux and the lowest thermal resistance is obtained at 1/5 area ratio at lower heat fluxes and at 2/5 or 3/5 area ratio at higher heat fluxes.

Spatially-Resolved Thermometry of Filamentary Nanoscale Hot Spots in TiO2 Resistive Random Access Memories to Address Device Variability.

Resistive random access memories (RRAM), based on the formation and rupture of conductive nanoscale filaments, have attracted increased attention for application in neuromorphic and in-memory computing. However, this technology is, in part, limited by its variability, which originates from the stochastic formation and extreme heating of its nanoscale filaments. In this study, we used scanning thermal microscopy (SThM) to assess the effect of filament-induced heat spreading on the surface of metal oxide RRAMs with different device designs. We evaluate the variability of TiO2 RRAM devices with area sizes of 2 × 2 and 5 × 5 μm2. Electrical characterization shows that the variability indicated by the standard deviation of the forming voltage is ∼2 times larger for 5 × 5 μm2 devices than for the 2 × 2 μm2 ones. Further knowledge on the reason for this variability is gained through the SThM thermal maps. These maps show that for 2 × 2 μm2 devices the formation of one filament, i.e., hot spot at the device surface, happens reliably at the same location, while the filament location varies for the 5 × 5 μm2 devices. The thermal information, combined with the electrical, interfacial, and geometric characteristics of the device, provides additional insights into the operation and variability of RRAMs. This work suggests thermal engineering and characterization routes to optimize the efficiency and reliability of these devices.

Thermal performance comparison of flat plate pulsating heat pipes of different material thermal conductivity using ethanol-water mixtures

A flat plate pulsating heat pipe (FPPHP) consists of mini/micro capillary channels machined on a flat plate in a serpentine manner. The working fluid oscillates in the form of liquid slugs and vapor plugs transferring heat. The slug-plug oscillations, internal flow regimes, startup heat requirement, thermal resistance, and evaporator dry-out depend on the thermal conductivity of the flat plate. High thermal conductivity material has larger heat spreading through it with a possibility of pressure homogenizing in the system, low working fluid oscillations, and early dry-out of the working fluid. No study has compared the thermal conductivity of the different plate materials suitable with various working fluids in an FPPHP, and the present work fills this gap in the literature. In this work, the thermal characteristics of a high thermal conductivity copper and a comparatively low thermal conductivity steel FPPHPs are experimentally investigated and compared using different ethanol–water mixtures as the working fluid. Results are reported for pure water and ethanol and mixtures of ethanol:water in the ratio 1:1, 3:1, 5:1, 9:1, and 30:1 as the working fluids, filled at 60%. The power inputs are given from 40 to 200 W. The ethanol–water mixed in an ideal ratio compared to pure water or ethanol as the working fluid gives smaller thermal resistances, larger slug-plug oscillations, and lesser evaporator drying-out occurrences. The working fluid oscillations mainly influence the total thermal resistance in the steel FPPHP, and the fluid resistance is the minimum at all power inputs. In copper FPPHP, the spreading (dry) resistance through the plate primarily influences the total thermal resistance. At the optimum ethanol–water mixture ratio of 9:1, steel FPPHP has lower thermal resistance and larger slug velocities than copper FPPHP in the wide range of power inputs of 60 to 140 W. The present work on the effect of thermal conductivity and binary mixtures on the thermal performance of the FPPHP will help to design suitable FPPHP for different applications.

Effect of Frequency on Heat Spread by Interstitial Hypertemia Treatment Method for The Treatment of Sarcoma Tumors

Frequency is a thing to calculate a wave. In biomedical science, frequency plays an important role in delivering heat as in bioheat transfer. In bioheat transfer studies, heat transfer in the human body can be used as one way of treatment such as therapy. At high temperatures that are usually above 40oC, the cell will die and cannot develop again this is called hyperthemia therapy. This therapy is commonly used in medicine with the function to kill tumor cells. There are 3 differences in hyperthemia therapy there are external, cavity and intersitital and interstitial hyperthermia therapy has better healing ability because heatis directly delivered to the tumor tissue to minimize tissue that no tumor is exposed to therapeutic temperature (40-46oC). Then the author will conduct a study with an analysis of heat transfer carried out on five layers of the human body, namely the epidermis, dermis, fat, muscle, and bones by applying the interstitial method of hyperthermia therapy and influenced by frequencies with a value of 434; 915; 2450 MHz completed using finite element method with unsteady state conditions in two axial dimensions. This study showed that frequency affects the value of temperature distribution in the five layers of the body. The greater the frequency value given, the more easily distributed the temperature will be because the frequency will provide greater electromagnetic waves if the frequency is increased.With interstitial hyperthermia would be optimize the therapeutic temperature more stable because of the needle as the media of the heat transfer. The methods of the interstitial treatment research areinsert the needle to the sarcoma hand tumor. This look very simple but need more preparation like, voltage, frequency, measure the metabolic and blood perfusion of the patient and made a analytics measure to do the treatment. The result of the research is heat that spread by interstitial hyperthermia are stable at 40-46oC which is the therapeutic temperature of tumor treatment,and the temperature will be increase with upgrade the power input of the source and the frequencies. The research has a conclusion that interstitial hyperthermia on sarcoma tumor especially on hand tumor sarcoma is effectively because the heat is spread well on the tumor at therapeutic temperature and frequencies that applied in this research is optimal for the treatment because it could keep the temperature steady on around 40-46oC.

Photothermal superhydrophobic copper nanowire assemblies: fabrication and deicing/defrosting applications

Ice and frost buildup continuously pose significant challenges to multiple fields. As a promising de-icing/defrosting alternative, designing photothermal coatings that leverage on the abundant sunlight source on the earth to facilitate ice/frost melting has attracted tremendous attention recently. However, previous designs suffered from either localized surface heating owing to the limited thermal conductivity or unsatisfied meltwater removal rate due to strong water/substrate interaction. Herein, we developed a facile approach to fabricate surfaces that combine photothermal, heat-conducting, and superhydrophobic properties into one to achieve efficient de-icing and defrosting. Featuring copper nanowire assemblies, such surfaces were fabricated via the simple template-assisted electrodeposition method, allowing us to tune the nanowire assembly geometry by adjusting the template dimensions and electrodeposition time. The highly ordered copper nanowire assemblies facilitated efficient sunlight absorption and lateral heat spreading, resulting in a fast overall temperature rise to enable the thawing of ice and frost. Further promoted by the excellent water repellency of the surface, the thawed ice and frost could be spontaneously and promptly removed. In this way, the all-in-one design enabled highly enhanced de-icing and defrosting performance compared to other nanostructured surfaces merely with superhydrophobicity, photothermal effect, or the combination of both. In particular, the defrosting efficiency could approach ∼100%, which was the highest compared to previous studies. Overall, our approach demonstrates a promising path toward designing highly effective artificial deicing/defrosting surfaces.

The Effect of Cryogenic Temperatures on the Lateral Heat Spreading in InGaAs/InP HEMTs

The Effect of Cryogenic Temperatures on the Lateral Heat Spreading in InGaAs/InP HEMTs

Construction of waterborne flame-retardant itaconate-based unsaturated polyesters and application for UV-curable hybrid coatings on wood

Developing a strategy to improve the flame retardancy and water resistance of waterborne bio-based coatings on wood is an effective route to enhance safety and applicability of timbers. In this work, the waterborne itaconate-based unsaturated polyester (IAF) were synthesized from biomass-derived itaconic acid (IA) and flame retardants FRC-6 by melt polycondensation in one pot, which was investigated as an ideal waterborne resin for UV-curable coating applications. A series of UV-cured hybrid coatings on wood were prepared consisting of IAF, N-(Hydroxymethyl) acrylamide (NMA), and γ-methacryloxypropyltrimethoxysilane (MPS) in various proportions via UV-curing and sol-gel process. The incorporation of MPS enhanced the rigidity, cross-linkage, and water resistance of UV-cured hybrid coatings, but the excessive silicone gel limited the further improvement of coating performances due to the phase separation and reduced film-forming property. Moreover, the UV-cured hybrid coatings appeared exceptional charring properties and endowed wood with superior flame retardancy. It was noticed that P/N/Si synergistically promoted the formation of remarkable, dense, and stable char layer on wood as a barrier, retarding the spread of heat, oxygen, or flammable volatile and the further combustion of substrates. Besides, the free radical capture of phosphorus and the dilution effect of inert gas played an essential role in gas-phase flame retardancy.

In-plane lattice thermal conductivity predictions of thin films within columnar grains

Polycrystalline thin films are widely used for devices and energy-related applications, such as power electronics, solar cells, and thermal management of devices. In many cases, large-scale crystallization during thin-film growth is challenging, so columnar grains are often found in metal and semiconductor thin films. These rough columnar grain boundaries may also have different phonon specularities from that for typically smoother top/bottom film surfaces. A simple analytical model to separately treat these boundaries and interfaces for phonon scattering is currently unavailable, although the in-plane thermal transport is critical to heat spreading within thin-film devices. In this paper, we extend the effective medium formulation from three-dimensional polycrystalline bulk materials to columnar-grained thin films. The model predictions agree well with those given by frequency-dependent phonon Monte Carlo simulations, considering varied phonon specularity at top/bottom film surfaces and grain-boundary phonon transmissivity. The analytical model is further used to analyze the existing data on polycrystalline ZnO thin films with columnar grains.

Design, optimization, fabrication and analysis of Cu microheater for loop-mediated isothermal amplification (LAMP) applications

A paper presents the design, fabrication, and thermal evaluation of a printed circuit board (PCB) based copper (Cu) microheater that can be integrated with microfluidic chips to initiate the loop-mediated isothermal amplification (LAMP). A series of 3D finite element electro-thermal simulations were carried out to analyze the thermal uniformity and power consumption of the micro heater. The optimal design was fabricated using the etching technique and analyzed with a heat spreader to enhance thermal uniformity. The simulation results of the microheater reveal that the meander configuration outperforms other designs. In addition, the microheater with a heat spreader has a thermal difference of only < 5 ℃ when compared with ∼10 ℃ in a microheater without a heat spreader. The developed microheater has a long shelf life and can be used to handle wet biological samples when encapsulated with polyethylene terephthalate (PET). The paper microfluidic chip on the glass substrate has a temperature difference of only 0.5 ℃. The low-cost microheater integrated microfluidic chips has the great potential to develop inexpensive home-based diagnostic kits and trigger the access of diagnostic kits in underdeveloped countries to reduce the spread of infection and initiate treatment plans.

In-situ synthesized graphene reinforced copper matrix composites with enhanced thermal properties and corrosion resistance

Graphene is expected to comprehensively improve the thermal conductivity and corrosion resistance of metals to satisfy the need of adverse electrochemical environments. However, there are some major concerns in the mixing methods such as, low quality of graphene, non-uniform dispersion, and poor interface bonding with the metal matrix. In this study, we propose an effective approach to fabricate Cu-graphene (Cu/G) nanocomposite by sintering in-situ growth of graphene on Cu nanoparticles. Results confirmed the firmly adhesive graphene on Cu surface, which closely linked Cu particles to building a bulk, particularly binding between Cu particles and graphene flakes is largely improved by the sintered progress. The as-prepared Cu/G heat spreader demonstrated higher thermal conductivity (376 W/(m·K) at room temperature and lower thermal expansion. Additionally, the short-time corrosion resistance showed that Cu/G can build a graphene network to avoid the penetration of active species and enhance the passivation layer. This work endows Cu/G integral materials possessing good thermal conductivity and corrosion inhibition, which can effectively serve as potential offshore materials.

Pulsating heat pipe and embedded heat pipe heat spreaders for modular electronics cooling

Two-phase-based heat spreaders are highly sought electronics cooling solutions due to their superior thermal performance over conventional conduction plates. Along with good thermal performance, Pulsating Heat Pipes (PHPs) potentially have thickness, shape matching and cost benefits over Embedded Heat Pipe (EHP) heat spreader solutions. In this manuscript, the thermal performance of PHP charged with three different fluids-propylene, R245fa, and acetone was experimentally determined for different sink temperatures and compared to an EHP heat spreader. A mathematical model to predict the thermal performance of the PHP was developed and validated against experimental results. It was determined that at low sink temperatures, PHP charged with propylene performs better than or similar to an EHP heat spreader with up to 7.8 times higher effective thermal conductivity over a conduction plate. However, at moderate temperatures above >40 °C, propylene PHP dries out faster than the EHP plate. PHP performance with R245fa and acetone improves with increasing heater power. Effective thermal conductivity improved by 2.5 times with R245fa PHP and by 4 times with acetone PHP over the conventional plate but was lower than the EHP plate whose effective thermal conductivity was 17.3 times higher. However, weight comparison showed PHP to be lighter than the EHPs.

A Thermochromic, Viscoelastic Nacre-like Nanocomposite for the Smart Thermal Management of Planar Electronics

HighlightsConstruction of a viscoelastic composite nacre with a ripple-like layered architecture through supramolecular interactions.Outstanding self-adhesion, self-healing and scrape-resistant mechanical and thermal properties.Utility as an integrated heat spreader and TIMs for “chameleon-like” thermal management of planar soft electronics.

A laser-based Ångstrom method for in-plane thermal characterization of isotropic and anisotropic materials using infrared imaging.

High heat fluxes generated in electronics and semiconductor packages require materials with high thermal conductivity to effectively diffuse the heat and avoid local hotspots. Engineered heat spreading materials typically exhibit anisotropic conduction behavior due to their composite construction. The design of thermal management solutions is often limited by the lack of fast and accurate characterization techniques for such anisotropic materials. A popular technique for measuring the thermal diffusivity of bulk materials is the Ångstrom method, where a thin strip or rod of material is heated periodically at one end, and the corresponding transient temperature profile is used to infer the thermal diffusivity. However, this method is generally limited to the characterization of one-dimensional samples and requires multiple measurements with multiple samples to characterize anisotropic materials. Here, we present a new measurement technique for characterizing the isotropic and anisotropic in-plane thermal properties of thin films and sheets as an extension of the one-dimensional Ångstrom method and other lock-in thermography techniques. The measurement leverages non-contact infrared temperature mapping to measure the thermal response from laser-based periodic heating at the center of a suspended thin film sample. Uniquely, our novel data extraction method does not require precise knowledge of the boundary conditions. To validate the accuracy of this technique, numerical models are developed to generate transient temperature profiles for hypothetical anisotropic materials with known properties. The resultant temperature profiles are processed through our fitting algorithm to extract the in-plane thermal conductivities without knowledge of the input properties of the model. Across a wide range of in-plane thermal conductivities, these results agree well with the input values. Experiments demonstrate the approach for a known isotropic reference material and an anisotropic heat spreading material. The limits of accuracy of this technique are identified based on the experimental and sample parameters. Further standardization of this measurement technique will enable the development and characterization of engineered heat spreading materials with desired anisotropic properties for various applications.

Mannitol enhanced thermal conductivity and environmental stability of highly aligned MXene composite film

Multifunctional thermal management materials with high flexibility are urgently required to tackle the heat dissipation issues of highly integrated electronics. MXene is considered a promising two-dimensional (2D) material for preparing composite with high thermal conductivity. However, there still is a challenge to prepare highly aligned MXene composite for simultaneously achieving high thermal performance and excellent mechanical properties. Herein, a novel MXene composite film was synthesized by vacuum-assisted filtering MXene nano-sheets suspension containing non-toxic and pollution-free mannitol. Under the connection of mannitol, MXene nano-sheets in the MXene/mannitol composite film form a highly aligned structure, resulting in outstanding thermal and mechanical properties. In-plane and through-plane thermal conductivities are 36.3 and 1.06 W m−1 K−1 for the MXene/mannitol composite film prepared using MXene suspension with a mannitol content of 0.2 mol/L, which are higher by 172% and 193% than those of pure MXene film, respectively. As the heat sink for a high-power LED, the MXene/mannitol composite film also demonstrated an excellent heat dissipation efficiency outperforming pure MXene film. Moreover, the MXene/mannitol composite film exhibited noteworthy mechanical property and stable thermal conductivity after bending for 300 times. Our findings provide a promising approach to prepare high-performance heat spreader for the thermal management of modern electronic components.