Program managers must manage heterogeneous sources of risk across the semiconductor lifecycle, identifying vulnerabilities that, if exploited, have adverse consequences to mission and/or business objectives. Identification of sources of risk involves understanding the business processes involved in the production, use, and maintenance of components. Business process modeling is widely used to address technology research and development. A typical methodology for business process modeling is the ICAM (integrated computer-aided manufacturing) DEFinition (IDEF) family of modeling languages. The basic IDEF0 block represents a function, with associated inputs, outputs, controls, and mechanisms. This article demonstrates risk identification and risk management through the use of an extended IDEF0 framework incorporating risk sources. The effort models the semiconductor lifecycle based on open-source materials at multiple hierarchical levels, for example, drilling down into fabrication and wafer manufacturing processes. Product lifecycle stages are associated with particular sources of risk. Several sources of risk are pervasive across stages while others are particular to a stage. The results of this effort help program and product managers to know what risks should be managed, how risk countermeasures and resources should be coordinated, and how the performance of risk management activities should be monitored and evaluated.