Insulated Gate Bipolar Transistor Junction Research Articles

Insulated-gate bipolar transistor junction temperature estimation based on ℋ∞ robust controller in wind energy applications

This article presents lifetime estimation using robust control based on thermal path degradation condition of insulated-gate bipolar transistor wind power modules. Online measurements of the on-state voltage [Formula: see text] are considered to be a promising method for obtaining a thermal-sensitive electrical parameter for wire-bond lift-off. This parameter demonstrates a good correlation with junction temperature. Due to the harsh environment, disturbances and uncertain parameters are founded within the compact set of wind energy generation systems. The uncertainty sacrifices some degree of accuracy of junction temperature measurements. Hence, robust control theory has been utilized to synthesize [Formula: see text] controller for the thermal impedance of high-power insulated-gate bipolar transistors. To study this reliability problem, an integrated model of wind energy generation system is built in MATLAB/Simulink for the closed-loop system. Simulation results show the benefit of the designed controller compared to the open-loop system in terms of thermal cycles of junction temperature and lifetime estimation.

Liquid Metal Magnetohydrodynamic Pump for Junction Temperature Control of Power Modules

Power modules are the most common components to fail in power converters that are employed in mass transportation systems, thus leading to high unscheduled maintenance cost. While operating, high junction temperature swings occur that result in high thermomechanical stress within the structure of the power module, reducing the lifetime of the module. Liquid metals as a cooling medium received so far little attention in the area of power semiconductor cooling, despite being able to remove high heat fluxes. This paper shows for the first time how liquid metal is used to reduce actively the junction temperature swing. A magnetohydrodynamic (MHD) pump has been designed for this purpose allowing active control of the flow rate of the liquid metal that impinges against the baseplate of the module. The pump has been 3-D printed and is attached directly to the power module. A closed-loop temperature control system is implemented, able to estimate the insulated-gate bipolar transistor's junction temperature, and thus, controls the MHD power. This paper presents simulation and experimental results showing reductions in the temperature swing over the full load cycle with 12 °C as the highest observed reduction rate. This paper also shows detailed designs of the MHD pump and the controller hardware.

IGBT junction and coolant temperature estimation by thermal model

The capability of IGBT (Insulated Gate Bipolar Transistor) to handle heat is one of its main limitations of high power application. This paper aims to study an IGBT thermal model under flow cooling condition and estimate the IGBT module junction and coolant temperature. Firstly, this paper studies the IGBT module internal sandwich structure and calculates the thermal resistance and thermal capacitor for each layer using a 1D physical model. Then a Cauer electric model is built for the IGBT module to evaluate the thermal constant time of the model. The liquid cooling method is applied in this project for fast cooling and the thermal parameters are studied and measured since this cooling method involves both solid and liquid. In order to estimate the junction temperature, the sensing temperature from NTC (Negative temperature coefficient) resistor inside the module is used as reference temperature. The equivalent thermal models, also named Foster model, from both junction to NTC and NTC to coolant are built, respectively. With these thermal models, the junction and coolant temperature estimation methods are derived. For the purpose of making the estimation accurate, the thermal coupling effect is carefully studied. Finally, the thermal model is verified by inverter application with current steps sweeping; the estimated temperature is compared with thermal camera measurement result which demonstrates good accuracy of the thermal model. The estimated coolant temperature is also well matched with thermocouple measurement result.

Smooth control of insulated gate bipolar transistors junction temperature in a small‐scale wind power converter

In wind power converters, the junction temperature of the power module is the crucial factor which affects its reliability. This study developed a comprehensive thermal management strategy to improve the operational reliability of a small-scale wind power converter. Firstly, the idea of thermal management that improves the reliability is introduced. Then, in order to smooth the temperature fluctuations, the adjustment law of the switching frequency and the strategy of the exterior thermal management have been investigated. A field-programmable gate array- based thermal management system consists of temperature-controlled oscillator and fan speed regulator as well as power resistor heating system was designed. Lastly, numerical simulation and experimental implementation were carried out to verify the correctness of the proposed thermal smooth control method.