In the realm of electronic cooling, it is of significance to efficiently manage the transient heat load. In this context, an innovative strategy is introduced by integrating a cooling fluid loop with a latent heat storage (LHS) unit. The effects of strategic positioning of LHS units on the dynamic temperature under varying conditions, such as heat load intensities, filling rates of phase change materials (PCMs), heating durations, and coolant flow rates, are examined and analyzed. The results indicate that the introduction of LHS unit can significantly alleviate the temperature fluctuation of microchannel heat sink (MHS) under instantaneous heat load. When the LHS unit is located upstream and downstream of the cooler, the maximum temperature of the MHS surface is reduced by 10 °C and 42 °C, respectively. The heat load determines the dynamic temperature characteristics of LHS units, and PCM performs best at precise melting states. When the heat storage of LHS unit matches the heat generated by the heating surface, further increasing the PCM filling rate has no positive effect, and extending the heating time is not conducive to cooling MHS. Additionally, increasing flow rate of working fluid has a limit effect on thermal enhancement of fluid loop with LHS.
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