Semiconductor manufacturing comprises hundreds of consecutive unit processes. A single misprocess could jeopardize the whole manufacturing process. In current manufacturing environments, data monitoring of equipment condition, wafer metrology, and inspection, etc., are used to probe any anomaly during the manufacturing process that could affect the final chip performance and quality. The purpose of investigation is fault detection and classification (FDC). Various methods, such as statistical or data mining methods with machine learning algorithms, have been employed for FDC. In this paper, we propose an artificial immune system (AIS), which is a biologically inspired computing algorithm, for FDC regarding semiconductor equipment. Process shifts caused by parts and modules aging over time are main processes of failure cause. We employ state variable identification (SVID) data, which contain current equipment operating condition, and optical emission spectroscopy (OES) data, which represent plasma process information obtained from faulty process scenario with intentional modification of the gas flow rate in a semiconductor fabrication process. We achieved a modeling prediction accuracy of modeling of 94.69% with selected SVID and OES and an accuracy of 93.68% with OES data alone. To conclude, the possibility of using an AIS in the field of semiconductor process decision making is proposed.
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Jun 1, 2021
Zhen Huang + 4
Open Access