Inorganic Adhesives Research Articles

Characteristics of adhesive joints of metals using inorganic particulate composite adhesives

The characteristics of adhesive joints of similar sheets of aluminium and steel containing epoxy based particulate composite adhesives have been studied. The composite adhesives having particulate fillers as aluminium and alumina powders of varying amount (5–15wt.%) and size (75–84 to 0.8–1.2 mm) are applied to mechanically and chemically treated aluminium and mechanically treated steel substrates. The joints of the composite adhesive are characterized by their tensile lap shear strength as a function of the bond-line thickness as well as the amount, size and type of particle. For a given substrate the characteristics of the composite adhesive joint have been compared to those of the conventional adhesive joints. The bond-line thickness of the adhesive with respect to the amount and size of the aluminium and alumina particles has been optimised for maximum tensile shear strength of the adhesive joint of differently treated substrates.

Development of Evaluation Technologies for Microtubular SOFCs Under Pressurized Conditions

We developed evaluation technologies for microtubular solid oxide fuel cells under pressurized conditions. The pressurized cell evaluation system for the single cell was produced. The chamber temperature of the evaluation system can be controlled up to 750°C, and the maximum chamber pressure is 0.8MPa. It was possible to manually control the pressure difference between air and fuel gas within ±3kPa during the pressure increase. The hard sealing technique was introduced for the evaluation under pressurized conditions. Using two different types of commercial inorganic ceramic adhesives, the gas leakage was controlled at approximately 2%. Differential pressure control between fuel and air is effective for the stable open circuit voltage and power generation. The power generation under pressurized conditions was successful at 650°C, and the pressurized effect was clearly confirmed.

Mechanical Characterization of Adhesive Bonded Sheet Metal Joints at Elevated Temperature

A new approach is expected for heat resisting metal joints with inorganic adhesive. In the present study, the mechanical characterization of the inorganic adhesive and the strength evaluation of metal joints are realized by an experimental procedure that includes a static test for single lap joints bonded with inorganic adhesives. The inorganic adhesive can be cured at 150°C, and the maximum temperature resistance proposed is up to 1,200°C. A tensile shear test for the joints with a nickel adherend is performed at an elevated temperature of up to 400°C. The effect of material property, overlap length, and thickness of adherend on the joint strength is discussed based on stress analysis for corresponding joint models using a Finite Element Method. It is important to confirm whether fracture occurred in the adhesive layer or at the interface between the adhesive and the adherend. Therefore, the deformation and fracture behavior of the adhesive layer is investigated microscopically by the photographs of a scanning electron microscope (SEM) for the fracture surface.

Dependences on Heating Conditions and Applicabilities as an Additive for ECIA of Sr1-xBaxFe3+1-ΤFe4+ΤO3-yFerrite System

The solid solutions of the Sr 1-xBaxFeO3-y system (x = 0.0, 0.1, 0.2 and 0.3) having a perovskite structure were prepared in air at 1423 K and then heat-treated in air (A), O 2(O) and N2(N) to examine possibility of controlling the nonstoichiometry and applicability as an additive for electrical conducting inorganic adhesives (ECIA). In the samples heated in N2 stream, there existed almost no Fe 4+ ions, and at constant te mperature their electrical conductivities were considerably lower than th ose of the samples heat-treated in air or O 2. Sr0.8Ba0.2Fe 3+ 0.49Fe 4+ 0.51O2.76 (SB2-A) whose Fe 3+ /Fe 4+ ratio was nearly 1 (0.96) and whose conductivity values (1.04 ohm −1 cm −1 at 283 K and 1.88 ohm −1 cm −1 at 673 K) were higher than any other samples, was found to be Fe 4+ τO4-y system (x = 0.0, 0.1, 0.2 and 0.3) prepared in O 2 stream, Sr0.9Ba0.1La1.00 Fe 3+ 0.55Fe 4+ 0.45O4.225 and Sr0.8Ba0.2- La1.00Fe 3+ 0.54Fe 4+ 0.46O4.230 had considerably high conduc- tivity values (ohm −1 cm −1 ) of -2.4 (at 283 K) ~ -0.7(at 573 K) and -2.8 (at 283 K) ~ -1.1 (at 573 K). Adding them into inorganic adhesive (AB-11, made from the reaction of the mixtures of SiC, ZnO2 and NaOH) with several composition, various ECIAs for high temperature were prepared and, among them, ECIA-3 12 containing Sr0.8Ba0.2La1.00Fe 3+ 0.54 Fe 4+ 0.46O4.230 (70 wt%) exhibited the highest conductivity values of -3.24 ohm −1 cm −1 at 290K and -1.99 ohm −1 cm −1 at 773 K. In that study, however, the adhesive properties of ECIA-2 (containing Sr0.9Ba0.1La1.00Fe 3+ 0.55Fe 4+ 0.45O4.225(70 wt%)) and ECIA-3 (containing Sr0.8Ba0.2La1.00Fe 3+ 0.54 Fe 4+ 0.46O4.230 (70 wt%)) were not satisfactory because of their lower conductivity values than those of metals like Cu and Fe, and of their sensitiveness to curing conditions. Considering such previous works, this study was aimed at performing synthesis and heat-treatments of the Sr 1-x- BaxFeO3-y system (x = 0.0, 0.1, 0.2 and 0.3) under various conditions (in air, in O 2 (1 atm) and in N2 (1 atm)), at checking whether it is possible to control the nonstoichi- ometry of the Sr1-xBaxFeO3-y system and eventually at investigating their applicability as additives for ECIAs for electrolytic oxygen evolution electrode 3,4 and solid oxide fuel cell. 5 The changes of oxygen contents with temperature, of mixed valency ratios of Fe 3+ and Fe 4+ and of conduc- tivities were measured. Finally mixing each sample (20 wt%) with BG-11 inorganic adhesive, 14 ECIAs were prepared and their properties were examined.

A review of: “INORGANIC ADHESIVES (Russian) by M. M. Sychev. Khimia Publ., Leningrad, 1974. 158 pp. (Rub. 0.66).”

A review of: “INORGANIC ADHESIVES (Russian) by M. M. Sychev. Khimia Publ., Leningrad, 1974. 158 pp. (Rub. 0.66).”

High-temperature inorganic adhesives for electromagnetic applications

Covers advancements in spacecraft and tactical and strategic missile systems, including subsystem design and application, mission design and analysis, materials and structures, developments in space sciences, space processing and manufacturing, space operations, and applications of space technologies to other fields.

American Society for Testing Materials‐National Meeting

TWENTY years ago, there was no commercial production of metal‐to‐metal adhesive‐bonded structures, and much of the recent progress has resulted from a greater understanding of the molecular physics of the adhesive mechanism. Theoretical and experimental knowledge of the fundamentals of adhesion was reviewed as was experimental work in Germany on metal‐to‐metal adhesives. The European aircraft industry has put heat‐curing resins to general use. German research, however, has also covered room‐temperature‐curing adhesives which are specially valuable for repairs in the field. Since work in the United States has been confined largely to heat‐curing adhesives, the German work on room‐tempcrature‐curing adhesives was of considerable interest. Most of the metal‐to‐metal bonding adhesives used today are phenolic or epoxy‐modificd phenolic types. These, however, will withstand only short‐time exposure to temperatures above 500 to 1,000 deg. F. Prolonged high temperatures break down the polymer structure and drastically lower strength. Research was described in which an inorganic component (most satisfactory to date: arsenic pentoxide) was added to the organic adhesive to provide thermal resistance. Results definitely indicated that organic‐inorganic adhesive systems provide one solution to the thermal resistance problem. The high temperature resistance characteristics of five ceramic adhesives were presented. These inorganic adhesives were prepared as ceramic frits and applied to stainless steel, the material being considered for wings and control surfaces of missiles. Data from tests at 800 and 1,200 deg. F. showed great promise for this type of adhesive.

A New Inorganic Cement and Adhesive

ADVERTISEMENT RETURN TO ISSUEPREVArticleNEXTA New Inorganic Cement and AdhesiveDean S. HubbellCite this: Ind. Eng. Chem. 1937, 29, 2, 123–132Publication Date (Print):February 1, 1937Publication History Published online1 May 2002Published inissue 1 February 1937https://doi.org/10.1021/ie50326a002RIGHTS & PERMISSIONSArticle Views111Altmetric-Citations5LEARN ABOUT THESE METRICSArticle Views are the COUNTER-compliant sum of full text article downloads since November 2008 (both PDF and HTML) across all institutions and individuals. These metrics are regularly updated to reflect usage leading up to the last few days.Citations are the number of other articles citing this article, calculated by Crossref and updated daily. Find more information about Crossref citation counts.The Altmetric Attention Score is a quantitative measure of the attention that a research article has received online. Clicking on the donut icon will load a page at altmetric.com with additional details about the score and the social media presence for the given article. Find more information on the Altmetric Attention Score and how the score is calculated. Share Add toView InAdd Full Text with ReferenceAdd Description ExportRISCitationCitation and abstractCitation and referencesMore Options Share onFacebookTwitterWechatLinked InReddit PDF (2 MB) Get e-Alerts