Liquid encapsulated growth of GaP is complicated by two features not present in ordinary Czochralski growth: molten B 2O 3 encapsulates the melt, and high pressure gas (55 atm) fills the growth chamber. The growth of large ingots of GaP (200 g, 35 mm diameter) under these conditions is more difficult than the previously described growth of smaller ingots. Diameter control is more difficult, and the large ingots often crack spontaneously. In the liquid encapsulated Czochralski process, the growth conditions are dominated first by radiative heat transfer and later by convective heat transfer. Evidence to support this conclusion includes the shapes of growing crystals and the configurations of the growth interface. By using a knowledge of the heat transfer mechanisms, a reliable technique has been developed for adjusting rf power input to obtain uniform diameter single crystals. Unless precautions are taken, however, such ingots will crack spontaneously. The vertical temperature gradient in the growth chamber can be as high as 500 °C/cm. The resulting thermal stress causes plastic deformation in the growing ingots, leading to frozen-in stresses which may exceed the yield stress of GaP. These stresses have been reduced sufficiently to avoid cracking by using an afterheater which is an integral part of the rf susceptor. The use of an afterheater can lead to the occurrence of twin lamellae, but these have been eliminated by using a suitably shaped crucible (e.g., flat bottomed).
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