InP–InGaAs cleaved-cavity lasers are routinely used in long-wavelength optical transmission systems, packaged with a discrete pin photodiode back-facet monitor used to provide feedback to control the laser output power. This conventionally requires two separate wafer-fabrication processes, and individual testing, cleaving, and assembly at the chip level. The handling of cleaved bars, facet-coating, testing, and mounting is labour-intensive and expensive. Etching mirror facets during wafer processing makes it possible in a single fabrication process to fabricate lasers with an integrated back facet monitor, and do on-wafer testing without further alignment and assembly. This has now been achieved with the following technologiesf (i) laser epitaxial layers used for light detection as well as emission, (ii) reactive-ion-etched (RIE) (CH4–Ar)-etched mirror facets, and (iii) electrical interconnects by metal airbridges. Integrated laser and (or) monitors with RIE-processed facets have threshold currents as low as 30 mA, efficiencies of 0.14 mW mA−1, and monitor efficiencies of 0.1 mA mW−1. Excellent uniformity was observed across a 2 in (1 in = 2.54 cm) wafer. The lower threshold currents (27 mA) observed for cleaved facet lasers from the same wafer indicate that the processed facet quality can be further improved; the optimum RIE process results in etched facets with a facet angle about 5° off vertical. Packaged devices have been successfully operated at speeds up to 1 Gb s−1 for both laser and monitor. Preliminary reliability studies are described.
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