Influence Of Layer Thickness Research Articles

Exploring the impact on contact adhesion layer properties in numerical simulations.

This paper presents a comprehensive investigation into the impact of key parameters on contact adhesion layer properties using numerical simulations, addressing fundamental questions in contact mechanics. Aiming to explore interfacial penetration and contact pressure dynamics between a wavy punch and an adhesive-coated body, the study focuses on the influence of adhesive layer thickness, elasticity modulus, and punch geometry on mechanical behavior. The study includes the application of Green's function to address deficiencies in existing models, revealing how contact stiffness, influenced by the flexibility relationship between the coating and substrate, affects the size of the contact area. Finally, conclusions are drawn that adjusting coating factors can induce full contact conditions. Quantitative analysis shows a 2.23-fold increase in load-bearing capacity with a 2 mm increase in adhesive layer thickness, and a 23-fold increase with a toughness ratio rise from 0.1 to 5. These findings are recommended for optimizing adhesive layer properties, contributing to advancements in materials science and innovation.

Monte Carlo Simulation of Electron Beam Induced Current in Au/Si Schottky Diodes: effects of metal layer thickness and minority carrier diffusion length

The Electron Beam Induced Current (EBIC) technique, when combined with scanning electron microscopy (SEM), offers valuable insights into the electronic properties of semiconductor materials at the nanoscale. This study leverages EBIC and Monte Carlo simulations to investigate the behavior of Schottky diodes, particularly focusing on the influence of gold layer thickness on current gain and backscatter electron (BSE) yield. The simulation results reveal the significant effects of depletion depth and minority carrier diffusion length on the diode’s performance. A key finding is that the EBIC current decreases with increased gold layer thickness, due to a higher BSE fraction. Additionally, at low beam energies, the current is negligible when the interaction volume is confined within the metal layer, while at higher energies, some penetration into the semiconductor occurs, generating a measurable EBIC current. These findings provide a better understanding of the interplay between metal layer thickness and semiconductor performance, which is crucial for optimizing semiconductor devices.

Improving current-matching in textured perovskite/silicon tandem solar cells via a thickness control strategy

This study presents an analysis of a two-terminal tandem solar cell that integrates metal-doped, lead-free double Cs2AgBi0.75Sb0.25Br6 perovskite with silicon to enhance overall energy conversion efficiency. This study explores how the thicknesses of the top and bottom sub-cells affect current-matching in two-terminal tandem perovskite/silicon solar cells with two separate planar and textured configurations. Using numerical modeling in MATLAB, and considering dominant recombination effects, we calculated the performance parameters of the device. We investigated the optical and electrical properties of textured tandem structures, focusing on current- matching and the influence of layer thickness on device performance. Given the complexity, time, and expense involved in constructing tandem solar cells, being able to analytically determine the thickness at which current-matching occurs can be highly advantageous. This approach offers the benefit of providing a precise analytical relationship for this purpose. Our findings demonstrate that increasing the top cell thickness enhances current density and power conversion efficiency, but at the cost of the bottom cell’s efficiency due to increased light absorption. Moreover, we discovered a nearly linear behavior between the thickness of the top and bottom cells for achieving current-matching. The study highlights the critical balance required to optimize layer thicknesses, thereby improving the design and performance of tandem solar cells. These insights are significant as they pave the way for more efficient and cost-effective tandem solar cell designs in the future, potentially accelerating the adoption of advanced photovoltaic technologies. The results show good agreement with experimental data, validating our model.

Influence of layer thickness and heat treatment on microstructure and properties of selective laser melted maraging stainless steel

As one of the main parameters of selective laser melting (SLM) process, layer thickness has a significant impact on the forming performance and efficiency of printed parts. Based on microstructure analysis and properties testing, the metallurgical mechanism, phase composition and mechanical behavior of SLM-formed Corrax stainless steel with different layer thicknesses were discussed. The influence of heat treatment process on the properties was comparatively investigated. The results indicated that at smaller or larger layer thicknesses, the increase in melt dynamic instability and spheroidisation feature easily induced the formation of unfused pore defects, which in turn led to lower relative density and mechanical properties. At the appropriate layer thickness, the suitable melt flow behaviour promoted the formation of good metallurgical bonding between adjacent melt channels. The maximum tensile strength, yield strength and hardness of the samples prepared at a layer thickness of 60 μm were 1224 MPa, 948 MPa and 39.2 HRC, respectively. The microstructure of the as-built samples was martensite and a small amount of austenite. With increasing layer thickness, the cooling rate of the molten pool decreased and the austenite content increased. After solution treatment, the alloying elements dissolved in the martensitic matrix resulted in lower mechanical properties. After aging and solution aging treatment, the mechanical properties were significantly improved due to precipitation strengthening of NiAl nanoparticles and dislocation strengthening. The corresponding tensile strengths were 1655 MPa and 1796 MPa, the yield strengths were 1328 MPa and 1573 MPa, and the hardnesses were 45.7 HRC and 50.2 HRC, respectively.

Epitaxial growth of bottom-crosslinked ZnGa2O4 nanowire arrays on c-plane GaN/Al2O3 substrate

The epitaxial growth of highly ordered ZnGa2O4 nanowire arrays and the construction of connectivity states between the individually segregated nanowires would significantly improve the performance of ZnGa2O4-based devices and expand their application fields. Herein, a strategy to construct high crystalline quality and well-aligned bottom-crosslinked ZnGa2O4 nanowire arrays along seven equivalent crystallographic directions of [111], [111̅], [11̅1], [1̅11], [11̅1̅], [1̅11̅] and [1̅1̅1] on Au-coated (0001) GaN/Al2O3 substrates using chemical vapor deposition (CVD) is proposed. The vapor-liquid-solid (VLS) mechanism dominates the entire growth process. The horizontal nanowires induced to nucleate and grow by catalyst droplets encountered and then turned towards inclined nanowires. Meanwhile, catalyst droplets that failed to move horizontally were enclosed by horizontal nanowires, resulting in the induction of perpendicular nanowire growth. The film-like horizontal nanowires connected all the inclined and perpendicular nanowires to form the bottom-crosslinked nanowire arrays. Additionally, the morphology, structure and optical properties of the ZnGa2O4 nanowire arrays, as well as the influence of Au layer thickness and growth time on the growth of ZnGa2O4 nanowires, were further characterized and thoroughly investigated. The proposed strategy achieved the growth of epitaxial well-aligned ZnGa2O4 nanowire arrays with bottom cross-linking, which is conducive to the application of ZnGa2O4 nanowires in optoelectronics.

The influence of irradiation time and layer thickness on the optical properties of NiO/CO3O4 nanocomposite for optoelectronic applications

This paper offers insights into optical properties of NiO/Co3O4 nanocomposite, demonstrating how X-ray irradiation affects it which offers information for optoelectronic applications. FTIR results showed existence of chemical bonds that have been presented in our composite. The HRTEM images revealed the presence of clusters of molecules in various shapes and an average grain size approaching 19 nanometers. The optical investigations shows an increase in optical absorbance of a NiO/Co3O4 nanocomposite after irradiation with X-rays up to 60 min. The calculated indirect energy gap of the material increases response to X-ray radiation which attributed to defects in the material's crystal structure.

An ultrathin ultralight electromagnetic absorber based on shortcut glass-coated amorphous magnetic Fiber/Salisbury-like screen

A structural design methodology is proposed for an ultrathin, ultralight, and absorption-adjustable electromagnetic absorber. The proposed absorber (SFSL) consists of an absorbing layer with shortcut glass-coated amorphous magnetic fiber and a substrate layer with transmitting material. This absorber features a Salisbury-like screen structure and incorporates multiple loss mechanisms. By investigating the influence of fiber distribution, length, content, and substrate layer thickness on absorption performance, it has been determined that the weight per square meter and thickness of a single-layer SFSL can be lowered within 50 g/m2 and 1.5 mm respectively. Furthermore, the absorption intensity and bandwidth can be adjusted by manipulating these parameters. The SFSL exhibits resonant behavior similar to that of a metamaterial absorber; however, SFSL with randomly distributed fibers demonstrates broader and stronger absorption characteristics in the frequency range from 2 to18 GHz. Additionally, the thicknesses of the substrate layer and surface covering affect the electromagnetic response characteristics. This work provides a simple strategy for constructing an ultrathin and ultralight composite to achieve efficient absorption of electromagnetic waves.

Advancing laser transmission welding for additive manufacturing: A study of glass fiber reinforced polypropylene parts

Laser transmission welding (LTW) is a well-established technique for joining high-volume thermoplastic parts, such as automotive injection molded parts. For low-volume, prototype, and custom production, additive manufacturing is an emerging technology for producing complex thermoplastic parts. When compared to injection molding, the additive manufacturing process fused filament fabrication (FFF) results in an inhomogeneous structure with entrapped air within the volume. Additionally, the presence of short glass fibers in the polymer matrix leads to higher radiation scattering during the welding process. This paper presents a fundamental study of the weldability of additively manufactured fiber-reinforced parts. The specimens were fabricated using a FFF process with glass fiber-reinforced polypropylene (GF-PP). The study investigates the influence of layer thickness and line width of the FFF process on the optical transmittance. LTW-experiments were conducted using additively manufactured uncolored and black GF-PP samples. Lap shear test specimens were welded with a different energy per unit length. This research presents a process for welding additively manufactured GF-PP parts that can be used with optimized FFF-parameters to produce high-strength and durable prototypes or spare parts for the automotive industry. This research provides valuable insights into the process parameters and considerations required to achieve robust welds in additively manufactured thermoplastic parts, facilitating broader adoption of LTW in additive manufacturing contexts.

Lifetime prediction of copper pillar bumps based on fatigue crack propagation

2.5D package realizes the interconnection of multiple dies through Si interposers, which can greatly improve the data transmission rate between dies. However, its multi-layer structure and high package density also place higher reliability requirements on the interconnection structure. As a key structure for interconnection, copper pillar bump (CPB) has small size, high heat generation, and thermal mismatch with silicon chips. The thermal fatigue failure of CPB has gradually become the main failure mode in 2.5D package. Due to the small size of CPB and the large proportion of intermetallic compound (IMC) layers, the lifetime prediction method of spherical solder joints is no longer suitable for CPB. Therefore, it is necessary to establish a fatigue lifetime prediction method for CPB. This paper establishes a method for obtaining the lifetime of CPB based on the basic theory of fatigue crack propagation. Using the extended finite element simulation method, the crack propagation lifetime of CPB under thermal cycling was obtained, and the influence of different IMC layer thickness on the fatigue lifetime of CPB was analyzed. The results indicated that the fatigue lifetime of cracks propagating in the IMC layer is lower than that of cracks propagating in the solder layer, and an increase in the thickness of the IMC layer leads to a significant decrease in the fatigue lifetime of CPB. The lifetime prediction method for CPB proposed in this paper can be used for reliability evaluation of 2.5D package, and has certain reference value for the study of the lifetime of CPB.

Micromagnetic study of exchange bias effect in sub-micron dots of Co2MnSi interfaced with uncompensated IrMn

Owing to its crucial role in spintronics devices, the exchange bias (EB) phenomenon has been extensively investigated in various ferromagnet (FM) and antiferromagnet (AFM) bilayers since its discovery in Co/CoO core–shell nanoparticles. In this study, we present the emergence of negative EB for the first time in the Co2MnSi Heusler alloy interfacing with an uncompensated AFM, exhibiting analogous anisotropy to the IrMn. Due to the high pinning and IrMn anisotropy values, EB is stronger here. Investigation into the influence of ferromagnetic layer thickness (tFM) on exchange bias reveals an inverse relationship, while coercivity displays a non-monotonic increase. The analysis of spin canting angles suggests the presence of a maximum canting angle in the Co2MnSi layer close to the interface. We thoroughly analyze the spin configurations at the interface as well as away from it in the Co2MnSi (25 nm)/IrMn (5 nm) bilayer to better understand the mechanism of magnetization reversal. Interestingly, our findings unveiled distinct spin behaviors for the first and second reversals. In cases of small AFM thicknesses (tAFM), the exchange field is proportionate to the tAFM, contrasting with large tAFM, where it scales as 1/tAFM. Notably, coercivity demonstrates an increasing behavior across all tAFM variations. The angular dependence of the Heusler alloy revealed a four-fold symmetry indicative of cubic anisotropy and a two-fold symmetry representative of uniaxial anisotropy. The angular dependency study of exchange bias indicated similar clockwise (CW) and counterclockwise (CCW) rotations, with cos (θ) unidirectional dependence. However, loop shifting revealed that the lower pinning ability at 0° was due to a low Meiklejohn-Bean parameter (R) value. Additionally, through the manipulation of the R-parameter, we can tune the magnitude of the coercive field and EB. All these results are crucial for the utilization of the Co2MnSi/IrMn heterostructures for various applications in spintronics-based devices.

Numerical analysis and device modelling of a lead-free Sr3PI3/Sr3SbI3 double absorber solar cell for enhanced efficiency.

Halide perovskites are the most promising options for extremely efficient solar absorbers in the field of photovoltaic (PV) technology because of their remarkable optical qualities, increased efficiency, lightweight design, and affordability. This work examines the analysis of a dual-absorber solar device that uses Sr3SbI3 as the bottom absorber layer and Sr3PI3 as the top absorber layer of an inorganic perovskite through the SCAPS-1D platform. The device architecture includes ZnSe as the electron transport layer (ETL), while the active layer consists of Sr3PI3 and Sr3SbI3 with precise bandgap values. The bandgap value of Sr3SbI3 is 1.307 eV and Sr3PI3 is 1.258 eV. By employing double-graded materials of Sr3PI3/Sr3SbI3, the study achieves an optimized efficiency of up to 34.13% with a V OC of 1.09 V, FF of 87.29%, and J SC of 35.61 mA cm-2. The simulation explores the influence of absorber layer thickness, doping level, and defect density on electrical properties like efficiency, short-circuit current, open-circuit voltage, and fill factor. It also examines variations in temperature and assesses series and shunt resistances in addition to electrical factors. The simulation's output offers valuable insights and suggestions for designing and developing double-absorber solar cells.

Design and Characterization of Porous Electrodes for Redox Flow Batteries

The commercialization of redox flow batteries as large-scale energy storage systems depends on lowering the capital and operating costs which depend on achieving maximum power density. Optimizing electrode design parameters and flow field-electrode combinations is critical to minimize losses and maximize active material utilization. Modeling the current drawn from an electrode offers a means to interpret electrode structure based on the electrolyte distribution driven by internal design. However, direct imaging methods (such as in-situ fluorescence microscopy and X-ray tomography) and numerical methods for current to potential prediction (3D Lattice Boltzmann modeling) are specific to individual electrode structures and possess limited predictable value to obtain an ideal electrode design. In this work, we present an electrode impedance spectroscopy (EIS)-based approach for determining electrode design parameters and devise a general method for determination of effective diffusion layer thickness. Using COMSOL modeling we verified the development of slug flow behavior in highly randomized porous electrode systems, indicating that the mass transport properties are dictated by inter-fiber distance. An analytical model to predict current as a function of applied overpotential is presented which allows us to vary structural parameters of the porous electrodes to study the influence of surface area, inter-fiber distances and diffusion layer thickness on the RFB performance. This model is a highly flexible tool applicable to any electrochemical system using a porous electrode and identifies critical variables affecting electrode design to characterize optimal electrode structure to minimize mass transport losses and optimize operational parameters.

Design and simulation analysis of an extrusion structure based on screw extrusion 3D printing

Abstract In response to the problems of 3D printing, such as uneven wire discharge and easy clogging of printing nozzles in FDM (Fused Deposition Modeling) printing technology, this paper develops a screw extrusion 3D printing melting deposition system based on simulation. The simulation results show that the maximum deformation of the screw occurs at the tail end, with a maximum value of 0.04 mm, while the fluid pressure and the pressure on the surface of the screw gradually increase along the direction of extrusion, and the maximum pressure occurs near the nozzle, with a value of 0.13 MPa. The fluid pressure is positively correlated with the screw speed and negatively correlated with the screw pitch. The fitting formula is obtained by numerical simulation of the screw speed and the flow velocity at the nozzle outlet. Using a self-made screw extrusion 3D printing equipment, relevant experiments are conducted to explore the influence of different layer thicknesses and line spacings on the mechanical properties of printed samples, as well as the influence of printing speed on surface quality. It is found that layer thickness has a significant impact on the bending strength of printed samples, with a maximum value of 24.74 MPa and a minimum of 19.21 MPa. The bending strength decreases by 28.79 % from 0.6 mm to 1.0 mm layer thickness. The line spacing has a significant impact on the tensile strength of printed samples, with a maximum value of 27.22 MPa and a minimum of 21.16 MPa. As the printing speed increases, the surface roughness of the printed piece also gradually increases from Ra = 389.28 μm at v = 30 mm/s to Ra = 535.45 μm at v = 70 mm/s, an increase of 37.55 %.

Investigating the influence of chromium layer thickness on thermal stability, adhesion and agglomeration of Cr/Ag/Cr sandwich layers in microelectromechanical systems (MEMS)

This study explores the influence of chromium layer thickness on the thermal stability and agglomeration of Cr/Ag/Cr sandwich layers used in MEMS applications. Achieving uniform and consistent deposition of thin films is crucial for optimal device performance. Magnetron sputtering, a technique offering precise control over film properties, is commonly employed for depositing thin films in MEMS. Silver is a popular choice due to its desirable properties, but it tends to agglomerate at high temperatures. The researchers investigated the effect of chromium layer thickness on thermal stability and agglomeration. They deposited chromium layers of varying thicknesses onto silicon substrates, followed by a silver layer and another chromium layer to create a sandwich structure. Annealing was performed at different temperatures to assess thermal stability and prevent silver agglomeration. Thermal stability was evaluated by measuring electrical resistance using a four-point probe method, and surface topography was analyzed using a non-contact atomic force microscope. The goal was to identify the optimal chromium layer thickness to minimize agglomeration and maximize thermal stability. The results showed that a sandwich structure with a 5 nm top chromium layer (Si/Cr (5 nm)/Ag (100 nm)/Cr (5-10-15-20 nm)) exhibited decreased adhesion force with increasing annealing temperatures. The use of a chromium sandwich layer significantly reduced surface roughness, as indicated by reductions in Ra and RMS values. A 15 nm thick chromium layer above and below the silver layer provided the best thermal stability and prevented silver agglomeration, resulting in the highest degree of adhesion. This thickness also yielded optimal surface parameters for the chromium sandwich layers at the annealing temperatures. In conclusion, the study demonstrates that the thickness of the chromium layer influences thermal stability, agglomeration, and surface parameters in MEMS applications and enables better control over thin film deposition.

Influence of layer thickness and exposure on mechanical properties of additively manufactured polymer-derived SiOC ceramics

One significant hurdle in additively manufacturing polymer-derived ceramics lies in reconciling the lower mechanical properties of additively manufactured parts compared to traditionally manufactured ceramics and PDCs. Here, a methodology is presented for evaluating the influence of layer thickness and exposure on polymer-derived ceramics within the constraints of commercially available software and hardware. Maximizing exposure within printable limitation of DLP processes, produced green bodies with the highest conversion, and resulted in improved pyrolysis outcomes, manufacturability, and most importantly ceramic strengths comparable to traditionally manufactured SiOC PDCs. Decreasing layer thickness and increasing total dwell time had a dramatic impact on mechanical properties, increasing flexural strength by more than 6x from 18 MPa at 100 μm layer thickness to 111 MPa at 10 μm layer thickness. Density of resultant ceramic also increased from 1.62 ± 0.03 g/cc to 2.3 ± 0.05 g/cc. This represented a large increase in mechanical strengths of PDCs produced via DLP in literature.

Mechanisms of water layer thickness and ullage height on crude oil boilover: a theoretical model coupling the effects of multiple physical fields

Boilover is one of the most destructive tank fire scenarios. A series of experiments were conducted using eight different depths of oil pans (ranging from internal depths of 4 to 20 cm) to vary the water layer thickness and ullage height. The results indicate that the water layer effectively cools the sidewalls, reduces the burning rate, inhibits the development of hot zones, and delays the onset of boilover in small and medium-scale experiments. Conversely, the ullage height affects the burning rate, formation of hot zones, intensity of the boilover, and boilover onset time. Utilizing experimental data and thermodynamic analysis, both water layer thickness and fuel layer thickness were considered as variables to predict sidewall temperature at the fuel surface. These results were then introduced into the burning rate prediction model. A prediction model for the boilover onset time was also developed using the water layer thickness as a variable, and a thermodynamic analysis revealed the existence of a limit to the effect of water layer thickness on the boilover onset time. Bubble dynamics was introduced to analyze the boilover process at the oil-water interface, clarifying that the influence of water layer thickness and ullage height on boilover intensity primarily lies in factors such as the degree of superheat at the fuel-water interface. The study’s findings hold significant implications for predicting and assessing fire accidents in storage tanks.

Study on interface characteristics and electron spin manipulation of two-dimensional [formula omitted] (001) heterostructures

Among numerous strongly correlated electron materials, cobalt ions in perovskite oxide SrCoO3 (SCO) possess rich valence states, playing a crucial role in determining the functionality of the material. Meanwhile, thin film preparation techniques such as epitaxial growth and pulsed laser deposition have accelerated the research progress of two-dimensional SCO films. In this study, we primarily investigate the interface characteristics and electron spin of two-dimensional SrCoO3/LaAlO3 (SCO/LAO) (SCO/LAO) (001) heterostructures using density functional theory, revealing the influence of atomic layer thickness and doping on the heterostructure. Our research results indicate that SCO/LAO heterostructures exhibit metallic behavior and ferromagnetism, and doping with oxygen vacancies and Nb2+ ions leads to significant changes in electronic properties and magnetism of the heterostructure. These findings provide insights for the experimental synthesis of two-dimensional heterostructures and suggest that two-dimensional SCO/LAO (001) heterostructures possess rich interface properties with tremendous potential applications in electronic devices.

Enhanced terahertz ISBT in GaAsBi/AlGaAs quantum well: impact of doping modulation

One of the pivotal characteristics of quantum wells (QW) designed for applications in filters or modulators is its absorption coefficient. This study investigates the combined influence of doping and active layer thickness on the absorption coefficient in GaAsBi/AlGaAs quantum wells. The self-consistent coupling between Schrödinger and Poisson equations was employed for this purpose. A comprehensive analysis of conduction band structure, energy levels, potentials, and densities is presented. This analysis discerns the effects of doping on intersubband transitions (ISBTs) in the terahertz (THz) frequency domain. An introduction of a donor impurity into the system greatly influenced the intersubband absorption coefficient, increasing its intensity and causing the optical response to shift toward the lowest frequency. The obtained resonant peak energies, situated within the terahertz spectrum, hint at promising applications for GaAsBi-based devices within this frequency band.

Performance analysis and optimization of insulation layers on a novel building-integrated photovoltaic system

Conventional photovoltaic-thermoelectric generator (PV-TEG) systems are hindered by significant heat transfer losses, which impair power generation throughout the year. Addressing this challenge, a novel PV-MCHP-TEG system is proposed, integrating photovoltaic (PV) cell, microchannel heat pipe (MCHP) array, and thermoelectric generator (TEG) module components with strategically placed insulation layers to facilitate year-round, day-and-night power generation. This study primarily investigates the impact of insulation layers on heat transfer processes, employing a comprehensive analysis and optimization approach. Utilizing Simulink software, the multifaceted influence of insulation layer variables, including locations, thicknesses, and materials, on TEG efficiency across various conditions was examined. Further, a comparative analysis was undertaken to evaluate the dynamic payback period across different modes. The optimization of these insulation parameters revealed that incorporating Polyisocyanurate Foam (PIR) as the insulation material in the optimized PV-MCHP-TEG system achieved an efficiency of 19.32 %, marking a 2.41 % improvement over conventional PV-TEG systems without insulation. Furthermore, the dynamic payback period was reduced to 11.34 years, representing a decrease of 1.05 years compared to conventional PV-TEG systems. These findings underscore the potential of our proposed system to outperform existing solutions by optimizing thermal management through insulation, thereby offering a promising avenue for enhancing photovoltaic-thermoelectric energy conversion.

Influence of Layer Thickness of 3D Printed Polyamide Against Temperature

Polyamide is one of the materials in 3D printing that can produce valuable products to meet the needs of the industry. Previous studies have proven that the layer thickness of the 3D printed material and the increase in temperature affect the mechanical and physical properties. However, only a few studies involve polyamide material as a test material, especially in analyzing the influence of the layer thickness of the printed material and the increase in temperature on the mechanical and physical properties of polyamide. Therefore, the bending properties of polyamide with different layer thicknesses at 0.1 mm, 0.2 mm and 0.3 mm and the tensile properties of the material at different temperatures at room temperature, 75˚C and 110˚C will be studied. This study will involve polyamide (PA) materials printed at three different layer heights using the Fused Deposition Modelling (FDM) process. Bending and tensile tests at different temperatures from 27˚C to 110˚C are conducted using the Instron Universal Testing Machine. The study results show that the layer height of 0.3 mm exhibits the highest flexural strength at an average rate of 11.05 MPa compared to 0.1 mm (6.7 MPa) and 0.2 mm (9.6 MPa). The tensile strength decreases when the temperature elevates, making the temperature of 110˚C have the lowest tensile value (1.591 MPa) compared to the temperature of 75˚C (1.6MPa) and 27˚C (2.1MPa). Several material characterizations such as SEM, TGA, DMA, DSC and density have been performed to study the microstructure and influence of tensile test temperature on the mechanical properties of polyamide.