The use of reflection mass spectrometry (REMS) as an in situ diagnostic for surface segregation of indium during InGaAs layer growth is reported. InGaAs growth at substrate temperatures above 500 °C yields a REMS signature which indicates a thickness-dependent surface In content. Adapting a simple segregation model [K. Muraki, S. Fukatsu, Y. Shiraki, and R. Ito, Appl. Phys. Lett. 61, 557 (1992)], the segregation ratio R was extracted under various deposition conditions in real time. The segregation ratio obtained during InGaAs/GaAs multiple quantum well growth at 500–530 °C suggests the presence of InGaAs composition grading near interfaces, and agrees qualitatively with ex situ characterization by x-ray diffraction. The high values of R (0.7–0.8) observed under normal device-layer growth produces a surface layer with high In content (i.e., InAs). The segregation ratio was not sensitive to unrelaxed layer strain, but showed a large increase under conditions which probably produce island (three-dimensional) growth. Methods for preparation of high-quality InGaAs layers with more abrupt AlGaAs/InGaAs/GaAs heterointerfaces are discussed, such as use of a two-step growth procedure or the incorporation of thin ‘‘cap layers’’ prior to high temperature AlGaAs growth.
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