Traditional air insulation in high-voltage equipment becomes bulky for high voltage withstand. The research so far conducted is related to electrode shape optimization, without fully exploiting the potential of strategically placed dielectric barriers. This paper introduces a new concept toward miniaturized high-voltage equipment by proposing glass barriers within rod-gap electrodes insulated with air and subjected to positive DC voltage. Barrier thickness and its positioning with regard to withstand characteristics are studied in order to optimize the design of such equipment. Three regimes of barrier thickness have been studied, and how that influences breakdown voltage and path type is presented. It was seen that with increasing barrier thickness, breakdown voltage improves more considerably. Interestingly, while the vertical position influences the breakdown path type, breakdown voltages remain similar for different paths at the same location. This paper, therefore, reveals that strategically placed glass barriers can enhance the dielectric strength of air-insulated systems. The present study leads to the optimization of the thickness and placement of barriers in future work by understanding the interplay with breakdown path to maximize the dielectric strength in miniaturized high-voltage equipment.
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