The effects of defect on the corrosion behavior of electrolytically Ni-plated steel in copper sulfate solution were investigated using electrochemical methods and surface characterization techniques. The results show that copper is deposited on the Ni surface not on steel exposed through defect. In the case of incompletely-open defects, weight gain on the Ni surface due to the copper deposition is decreased with immersion time and levelled off within 3 hours. However, the copper deposition on the Ni surface with fully-open defects exhibits continuous weight gain by vertical growth of copper layer. This is because copper deposition proceeds in the lateral direction preferentially until exposure of steel to the corrosive environment is blocked in incompletely-open defects where connection between copper deposition layers on separate Ni plating is accomplished. In contrast, in fully-open defects, vertical growth of copper deposition layers on separate Ni plating is observed. The vertical growth of the copper deposition layer in fully-open defects means that the interface between the substrate and nickel plating layers is continuously exposed to a corrosive environment, which eventually leads to delamination of the Ni plating layer from its substrate.The difference between incomplete and complete opening of defects is related to the defect area of the Ni plating layer, but verification of further electrochemical factors is required to distinguish the structural difference. These defects vary depending on the substrate and Ni plating process, but are inevitably accompanied by the subsequent forming process of Ni-plated steel. Since these defects are a major factor in determining the durability of the final products related to corrosion, it is important for manufacturers to identify and screen for these defects before moving on to the next step. Therefore, this study aims to identify the differences in copper sulfate test results according to the defect types and the correlation with product's durability due to corrosion. To verify this, analysis of the interfacial reaction through EIS (electrochemical impedance analysis) and current density and its overvoltage according to cathodic polarization related to the reaction of the copper deposition are in progress.
Read full abstract