In-plane Thermal Conductivity Research Articles

Multiple coherent amplitude modes and exciton-phonon coupling in quasi-one-dimensional excitonic insulator Ta2NiSe5.

An excitonic insulator (EI) is an intriguing correlated electronic phase of condensed excitons. Ta2NiSe5 is a model material for investigating condensed excitonic states. Herein, femtosecond pump-probe spectroscopy is used to study the coherent phonon dynamics and associated exciton-phonon coupling in single-crystal Ta2NiSe5. The reflectivity time series consists of exponential decay due to hot carriers and damped oscillations due to the Ag phonon vibration. Given the in-plane anisotropic thermal conductivity of Ta2NiSe5, coherent phonon oscillations are stronger with perpendicular polarization to its quasi-one-dimensional chains. The 1-, 2-, and 4-THz vibration modes show coherent amplitude responses in the EI phase of Ta2NiSe5 with increasing temperature, totally different from those of normal coherent phonons (the 3- and 3.7-THz modes). The amplitude modes at higher frequencies decouple with the EI order parameter at lower temperatures, as supported by theoretical analysis with a model Hamiltonian of the exciton-phonon coupling system. Our work provides valuable insights into the character of the EI order parameter and its coupling to multiple coherent amplitude modes.

Anisotropic Fourier Heat Conduction and phonon Boltzmann transport equation based simulation of time domain thermo-reflectance experiments

The anisotropic Fourier Heat Conduction Equation (FHCE) and the multidimensional phonon Boltzmann Transport Equation (BTE) were solved numerically in cylindrical coordinates and in time domain to simulate a Time Domain Thermo-Reflectance (TDTR) experimental silicon/aluminum substrate/transducer setup. The out-of-phase response of the probe laser was predicted at various beam offset distances for a pump laser pulse frequency of 80 MHz and modulation frequency of 10 MHz and compared against experimental measurements for a silicon substrate. The isotropic FHCE was also solved for comparison. Results show that the isotropic FHCE with bulk thermal conductivity of 145 W/m/K significantly underpredicts the out-of-phase temperature difference, particularly at smaller beam offsets. With an isotropic thermal conductivity of 105 W/m/K, the computed results match experimental data at smaller beam offsets well, but overpredicts the experimental data at larger beam offsets. An almost-perfect match is obtained by using an anisotropic thermal conductivity wherein the radial (in-plane) thermal conductivity is set to 85 W/m/K and the axial (through-plane) conductivity is set to 130 W/m/K. The multidimensional frequency and polarization dependent phonon BTE is next solved. The BTE results for the out-of-phase temperature difference match experimental observations well at small and intermediate beam offsets, but overpredicts the experimental data at larger beam offsets. FHCE results are fitted to the BTE predictions, and the extracted (best fit) thermal conductivity is found to be 110 W/m/K.

Boron Nitride/Carbon Fiber High-Oriented Thermal Conductivity Material with Leaves–Branches Structure

In the realm of thermal interface materials (TIMs), high thermal conductivity and low density are key for effective thermal management and are particularly vital due to the growing compactness and lightweight nature of electronic devices. Efficient directional arrangement is a key control strategy to significantly improve thermal conductivity and comprehensive properties of thermal interface materials. In the present work, drawing inspiration from natural leaf and branch structures, a simple-to-implement approach for fabricating oriented thermal conductivity composites is introduced. Utilizing carbon fibers (CFs), known for their ultra-high thermal conductivity, as branches, this design ensures robust thermal conduction channels. Concurrently, boron nitride (BN) platelets, characterized by their substantial in-plane thermal conductivity, act as leaves. These components not only support the branches but also serve as junctions in the thermal conduction network. Remarkably, the composite achieves a thermal conductivity of 11.08 W/(m·K) with just an 11.1 wt% CF content and a 1.86 g/cm3 density. This study expands the methodologies for achieving highly oriented configurations of fibrous and flake materials, which provides a new design idea for preparing high-thermal conductivity and low-density thermal interface materials.

Manipulating heat transfer at graphene/silicon interface with nitrogen doping

We perform a numerical evaluation on manipulating the thermal transfer at graphene/silicon by adjusting nitrogen doping modes. The results show that nitrogen doping can reduce the in-plane thermal conductivity of graphene/silicon heterostructure, but when doping is regular and distributed throughout graphene, the thermal conductivity will increase abruptly. This phenomenon can be attributed to the coupling between nitrogen phonons, which provides a new heat transfer channel for in-plane heat transfer. We also detected that the in-plane thermal conductivity of regular doping is higher than that of random doping in all concentration ranges. In the other, we found that nitrogen doping can significantly reduce the interfacial thermal resistance of graphene/silicon interface. The above-mentioned findings provide new ideas and theoretical support for controlling the heat transfer between graphene based heterogeneous interfaces.

Impact of crystallinity on thermal conductivity of RF magnetron sputtered MoS2 thin films

Abstract This study investigates the effects of sulfur atomic defects and crystallinity on the thermal conductivity of MoS2 thin films. Utilizing scanning transmission electron microscopy (STEM), X-ray diffraction (XRD), and Raman spectroscopy, we examined MoS2 films, several nanometers thick, deposited on Si/SiO2 substrates. These films were prepared via a combination of RF magnetron sputtering and sulfur vapor annealing (SVA) treatment. Structural analyses, including cross-sectional STEM and in-plane and out-of-plane XRD measurements, revealed an increase in the S/Mo ratio and grain size of the MoS2 films following SVA treatment. Notably, the in-plane thermal conductivity of MoS2 films treated with SVA was found to be at least an order of magnitude higher than that of films without SVA treatment. This research suggests that the in-plane thermal conductivity of MoS2 thin films can be significantly enhanced through crystallinity improvement via SVA treatment.

Construction of three-dimensional network using boron nitride microspheres and the thermal conductivity/stability of epoxy resin composites

Efficient heat dissipation has become the focus of electronic packaging materials, constructing three-dimensional thermally conductive filler networks to prepare composites can realize efficient heat transfer. However, there are few studies comparing the effects of different ways of constructing three-dimensional networks on the thermal conductivity enhancement of polymers. In this study, BNMS self-assembled from BNNSs was used as a thermally conductive filler, and the three-dimensional skeleton was constructed by both the powder mixing pressing method and the ice template method, and scanned to analyze the morphological and structural characteristics. At the same time, the epoxy composites were prepared, and the advantages and disadvantages of the thermal conductivity of the composites prepared in different ways were analyzed by combining the SEM structures. In the powder mixing pressing method, the in-plane and through-plane thermal conductivity of the epoxy composites with the BNMS additive amount of 53.92 wt% reached 10.961 W·m−1·K−1 and 9.955 W·m−1·K−1, respectively, which was increased by 58 and 52 times. The thermal stability has been improved significantly that the T60 was in creased by 60.89°C compared to pure epoxy. Using the ice template method with 7.67 wt% of BNMS addition, the through-plane thermal conductivity of the epoxy composites reaches 0.977 W·m−1·K−1, which is an improvement of 428.1 % compared with pure EP. In addition, both composites maintain low dielectric constants and dielectric losses. It is instructive for the preparation method of subsequent construction of three-dimensional thermally conductive filler networks.

Computational fluid dynamics simulations of the heat transfer properties of graphene-based nanolubricants and application to hydrodynamic lubrication

In this paper, we consider experimental data available for graphene-based nanolubricants to evaluate their convective heat transfer performance by means of computational fluid dynamics (CFD) simulations. Single-phase models with temperature-dependent properties are employed for this purpose. The base fluid is a polyalkylene glycol, and we show the effect of the addition of carbon nanohorns and graphene nanoplatelets (GNPs), in different volume fractions, on the convective heat transfer coefficient between two parallel plates. Then, an application to hydrodynamic lubrication is discussed. The extreme in-plane thermal conductivity of graphene allows a smaller temperature rise of the GNP-based nanolubricant, i.e., a more effective heat removal. To the best of our knowledge, this work represents the first application of single-phase nanofluid models to hydrodynamic lubrication.

Flash soldering of boron nitride nanosheets for all-ceramic films

The assembly of boron nitride nanosheets (BNNSs) into strong, flexible thin films capable of withstanding extreme conditions, such as high/low working temperatures and corrosive environments, holds immense promise for numerous applications. However, BNNSs are difficult to assemble and sinter to achieve the dense thin film structure observed in graphene thin films. We report the rapid fabrication of dense BNNS all-ceramic films (BACFs) in 30 s by combining the fabrication strategies for 2D and ceramic materials. In this process, densely arranged and highly oriented BNNSs are flash soldered into a monolith achieved by precisely controlled ultrafast sintering. This fusion of BNNS leads to an ultrahigh in-plane thermal conductivity of 134.5 W·m−1·K−1, which was among the highest values for BNNS films (mostly ≤ 70 W·m−1·K−1). The as-prepared BACF exhibits the combined advantages of sintered ceramics (durability, stability, acid-alkali resistance) and 2D material films such as flexibility and shock resistance, which is important for practical uses but rarely found in existing ceramics. It also has excellent cooling performance, dielectric properties, and good thermal stability, which is promising for demanding thermal management applications in emerging technologies.

Engineering lightweight Poly(lactic acid) graphene nanoribbon nanocomposites for sustainable and stretchable electronics: Achieving exceptional electrical conductivity and electromagnetic interference shielding with enhanced thermal conductivity

The challenge of creating flexible and sustainable electronics with properties such as lightweight, electrical and thermal conductivity, and electromagnetic interference (EMI) shielding is addressed in this study. Carbon nanotubes and graphene are commonly used in flexible electronic devices, but gaps exist in their conductivity and flexibility. A novel and scalable fabrication method is introduced, involving the creation of bio-based nanocomposites by integrating flexible and high aspect-ratio graphene nanoribbons (GNRs) into a poly (lactic acid) (PLA) matrix. The nanocomposites were drawn above the glass transition temperature (Tg) of PLA, resulting in the formation of extended shish structures, as observed in scanning electron microscope (SEM) images. These structures significantly enhanced thermal and electrical conductivities, as well as EMI shielding features. The combination of flexible GNR nanofillers with uniaxial stretching led to a substantial increase in Young's modulus, tensile strength, and toughness by approximately 550 %, 440 %, and 600 %, respectively, most likely due to the increased network connection despite the higher flexibility of GNRs. Moreover, in-plane thermal conductivity registered a notable enhancement of approximately 110 %. The EMI shielding reached 26 dB, with an absorption contribution to EMI shielding of around 45 %. Additional improvement was achieved through foaming of the stretched samples, resulting in multilayer structures with alternative extended shish and foam structures. Furthermore, a significant augmentation of approximately 33 dB in total EMI shielding of the foamed samples, accompanied by an 85 % increase in SEA was documented. These promising findings underscore potential applications across diverse domains, including thermal interface materials, electronic packaging, capacitors, and energy storage devices, with a specific emphasis on the realm of sustainable and stretchable electronics.

Enhancement of ZT in Bi0.5Sb1.5Te3 Thin Film through Lattice Orientation Management.

Thermoelectric power can convert heat and electricity directly and reversibly. Low-dimensional thermoelectric materials, particularly thin films, have been considered a breakthrough for separating electronic and thermal transport relationships. In this study, a series of Bi0.5Sb1.5Te3 thin films with thicknesses of 0.125, 0.25, 0.5, and 1 μm have been fabricated by RF sputtering for the study of thickness effects on thermoelectric properties. We demonstrated that microstructure (texture) changes highly correlate with the growth thickness in the films, and equilibrium annealing significantly improves the thermoelectric performance, resulting in a remarkable enhancement in the thermoelectric performance. Consequently, the 0.5 μm thin films achieve an exceptional power factor of 18.1 μWcm-1K-2 at 400 K. Furthermore, we utilize a novel method that involves exfoliating a nanosized film and cutting with a focused ion beam, enabling precise in-plane thermal conductivity measurements through the 3ω method. We obtain the in-plane thermal conductivity as low as 0.3 Wm-1K-1, leading to a maximum ZT of 1.86, nearing room temperature. Our results provide significant insights into advanced thin-film thermoelectric design and fabrication, boosting high-performance systems.

Multifunctional properties of carbon nanotube yarn/aerogel laminate composites

This work explores the multifunctional performance of scalable carbon nanotube (CNT) yarn laminate composites. Tensile, thermal, electrical, and electromagnetic interference (EMI) shielding properties are compared to state-of-the-art unidirectional IM7/5250-4 carbon fiber composite (CFRP). CNT laminates achieved a specific tensile modulus of 249.7 ± 22.3 GPa/(g/cm3), which is over double the specific modulus of the CFRP, while maintaining a specific tensile strength of 1.88 ± 0.17 GPa/(g/cm3) which is comparable to the CFRP. CNT yarn laminates demonstrated superior thermal transport properties, with in-plane thermal conductivity of 75.78 ± 14.3 W/mK, over 13 times higher than the CFRP. CNT yarn laminates were also superior in electrical conductivity, achieving a longitudinal conductivity of 5359 ± 417 S/cm and transverse conductivity of 36.87 ± 2.55 S/cm. This translated to superior EMI shielding properties, achieving over 100 dB in the X-band, which is nearly double that of the CFRP. Incorporating CNT aerogel interwoven between CNT yarns reduced the large property variance observed in the measurements, demonstrating a multifunctional material with tensile, thermal, electrical, and EMI properties superior to the CFRP, while potentially mitigating the scalability challenges inherent to CNT nanomaterials.

Enhancing Thermal Conductivity in Polymer Composites through Molding-Assisted Orientation of Boron Nitride.

Incrementing thermal conductivity in polymer composites through the incorporation of inorganic thermally conductive fillers is typically constrained by the requirement of high filler content. This necessity often complicates processing and adversely affects mechanical properties. This study presents the fabrication of a polystyrene (PS)/boron nitride (BN) composite exhibiting elevated thermal conductivity with a modest 10 wt% BN content, achieved through optimized compression molding. Adjustments to molding parameters, including molding-cycle numbers, temperature, and pressure, were explored. The molding process, conducted above the glass transition temperature of PS, facilitated orientational alignment of BN within the PS matrix predominantly in the in-plane direction. This orientation, achieved at low filler loading, resulted in a threefold enhancement of thermal conductivity following a single molding time. Furthermore, the in-plane alignment of BN within the PS matrix was found to intensify with increased molding time and pressure, markedly boosting the in-plane thermal conductivity of the PS/BN molded composites. Within the range of molding parameters examined, the highest thermal conductivity (1.6 W/m·K) was observed in PS/BN composites subjected to five molding cycles at 140 °C and 10 MPa, without compromising mechanical properties. This study suggests that compression molding, which allows low filler content and straightforward operation, offers a viable approach for the mass production of polymer composites with superior thermal conductivity.

Spatially resolved lock-in micro-thermography (SR-LIT): A tensor analysis-enhanced method for anisotropic thermal characterization

While high-throughput (HT) computations have streamlined the discovery of promising new materials, experimental characterization remains challenging and time-consuming. One significant bottleneck is the lack of an HT thermal characterization technique capable of analyzing advanced materials exhibiting varying surface roughness and in-plane anisotropy. To tackle these challenges, we introduce spatially resolved lock-in micro-thermography, an innovative technique enhanced by tensor analysis for optical thermal characterization. Our comprehensive analysis and experimental findings showcase notable advancements: We present a novel tensor-based methodology that surpasses the limitations of vector-based analysis prevalent in existing techniques, significantly enhancing the characterization of arbitrary in-plane anisotropic thermal conductivity tensors. On the instrumental side, we introduce a straightforward camera-based detection system that, when combined with the tensor-based methodology, enables HT thermal measurements. This technique requires minimal sample preparation and enables the determination of the entire in-plane thermal conductivity tensor with a single data acquisition lasting under 40 s, demonstrating a time efficiency over 90 times superior to state-of-the-art HT thermology. Additionally, our method accommodates millimeter-sized samples with poor surface finish, tolerating surface roughness up to 3.5 μm. These features highlight an innovative approach to realizing HT and accurate thermal characterization across various research areas and real-world applications.

Enhancing thermal conductivity and electromagnetic shielding performance of Ni-CNT/Al2O3/PVDF composite film with a multi-layered structure

To develop thermal interface materials with both high thermal conductivity and electromagnetic interference shielding, the polyvinylidene fluoride (PVDF) composite film was prepared by electrospinning and hot-pressing, using strategies of multi-layered structure and two fillers synergy of nickel modified carbon nanotube (Ni-CNT) and Al2O3 microspheres. The composite film consisted of a Ni-CNT filled PVDF electrospun fiber film as the top and bottom surface layers, and a PVDF electrospun fiber film electrostatically adsorbing Al2O3 microspheres and surface-sprayed with Ni-CNT as the middle layer. At a 20 wt% Ni-CNT in the surface layers and a 16.7 wt% Al2O3 and 5 wt% Ni-CNT in the middle layer, the composite film with a thickness of 0.1 mm exhibited optimal performances with electromagnetic wave shielding efficiency of 65 dB in the frequency range of 8.2–12.4 GHz, with 86% of the electromagnetic waves being absorbed. At the same time, the composite film had a high in-plane thermal conductivity of 4.02 W m−1 K−1, while maintaining a tensile strength of 25 MPa and flexibility.

Anisotropy Reversal of Thermal Conductivity in Silicon Nanowire Networks Driven by Quasi-Ballistic Phonon Transport.

Nanostructured semiconductors promise functional thermal management for microelectronics and thermoelectrics through a rich design capability. However, experimental studies on anisotropic in-plane thermal conduction remain limited, despite the demand for directional heat dissipation. Here, inspired by an oriental wave pattern, a periodic network of bent wires, we investigate anisotropic in-plane thermal conduction in nanoscale silicon phononic crystals with the thermally dead volume. We observed the anisotropy reversal of the material thermal conductivity from 1.2 at 300 K to 0.8 at 4 K, with the reversal temperature of 80 K mediated by the transition from a diffusive to a quasi-ballistic regime. Our Monte Carlo simulations revealed that the backflow of the directional phonons induces the anisotropy reversal, showing that the quasi-ballistic phonon transport introduces preferential thermal conduction channels with anomalous temperature dependence. Accordingly, the anisotropy of the effective thermal conductivity varied from 2.7 to 5.0 in the range of 4-300 K, indicating an anisotropic heat manipulation capability. Our findings demonstrate that the design of nanowire networks enables the directional thermal management of electronic devices.

Layer-by-layer assembly of boron arsenide and copper nanoflake-based aramid nanofibers for thermoconductive electromagnetic interference shielding materials with superior mechanical flexibility and flame retardancy

Flexible and wearable electronics represent an emerging frontier, but realizing their potential requires addressing challenges like electromagnetic interference (EMI) shielding, electrical insulating thermal management, and mechanical flexibility. Layer-by-layer structure with alternating conductive and insulating layers offers a promising solution. In this work, we fabricated layer-by-layer structured papers combining boron arsenide (BA) as insulating layers and two-dimensional copper nanoflake (CuF) as conductive layers based on aramid nanofiber (ANF) film via alternating vacuum filtration. The resultant paper (BA4/CuF3) consists of 3 layers of CuF (50 wt%) based ANF (CuF@ANF) conductive layers sandwiched between 4 layers of BA (50 wt%) based ANF (BA/ANF) insulating layers providing exceptional EMI shielding effectiveness (SE) up to 52 dB in the X-band frequency, and in-plane thermal conductivity up to 32.8 W/mK. Meanwhile, the composite papers also demonstrate excellent mechanical flexibility, with the BA4/CuF3 papers exhibiting a tensile strength of 92.38 MPa and EMI SE above 50 dB. Moreover, the composites impart thermal stability up to 500 °C and reduce flammability. The concurrent enhancement of EMI shielding, thermal conductivity, and mechanical properties confirms the potential of layer-by-layer BA/CuF papers for next-generation flexible electronics demanding electromagnetic protection and thermal management.

Polyimide-assisted fabrication of highly oriented graphene-based all-carbon foams for increasing the thermal conductivity of polymer composites

Graphene and its derivatives are often preferentially oriented horizontally during processing because of their two-dimensional (2D) layer structure. As a result, thermal interface materials (TIMs) composed of a polymer matrix and graphene-derived fillers often have a high in-plane (IP) thermal conductivity (K), however, the low through-plane (TP) K makes them unsuitable for practical use. We report the development of high-quality polyimide/graphite nanosheets (PG) perpendicular to the plane using a directional freezing technique that increase the TP K of polymer-based composites. Graphene-derived nanosheets (GNs) were obtained by the crushing of scraps of highly thermally conductive graphene films. A water-soluble polyamic acid salt solution was used to disperse the hydrophobic GNs filler to achieve directional freezing. The polyimide, which facilitated the directional alignment of the GNs, was then graphitized. The introduction of the GNs increases the order and density of the PG, thus improving the strength and heat transfer performance of its polydimethylsiloxane (PDMS) composite. The obtained PG/PDMS composite (21.1% PG, mass fraction) has an impressive TP K of 14.56 W·m−1·K−1, 81 times that of pure PDMS. This simple polyimide-assisted 2D hydrophobic fillers alignment method provides ideas for the widespread fabrication of anisotropic TIMs and enables the reuse of scraps of graphene films.

High thermal conductivity and low dielectric polyimide nanocomposites using diamine-assisted mechanochemical exfoliation boron nitride and in-situ polymerization under pressure

Advanced integrated circuit materials demand polymer composites with exceptional thermal conductivity and low dielectric constant to minimize power consumption and improve signal transmission. However, conventional methods of improving the thermal conductivity of composites by incorporating thermal conductive fillers result in an increase in dielectric constant, producing a huge challenge in simultaneously achieving enhanced thermal conductivity and low dielectric constant. Herein, a brick-and-mortar structure has been successfully constructed through in-situ polymerization of the diamine-assisted mechanochemical exfoliated (DAME) boron nitride (BN) with trifluoromethyl-containing PI and microporous polyhedral oligomeric silsesquioxane (POSS) under pressure. The DAME functionalized BNNS (f-BN) exhibit high aspect ratios, few lattice defects, high yields and excellent dispersion in the POSS/PI matrix. Notably, the obtained 40 wt% f-BN/POSS/PI nanocomposite exhibits a high in-plane thermal conductivity of 17.76 W m−1 K−1 with a 488% enhancement compared to 40 wt% hBN/POSS/PI, and simultaneously maintains low dielectric constant of 2.76 and low dielectric loss of 0.0042 at 1 MHz close to the pure POSS/PI matrix. Density functional theory is utilized to reveal the possible chemical reactions between f-BN and diamine, and the impacts of interfacial functionalization on the thermal conductivity and dielectric properties of nanocomposites are illustrated by molecular dynamics simulations. Furthermore, the DAME method demonstrates good universality among polyimide matrices, and shows excellent practical implementation as a thermal interface material and flexible printed circuit board. This material provides a promising solution for integrated circuits by successfully addressing the challenge of combining low dielectric constant and high thermal conductivity in microelectronic systems.

Janus polyurethane composite film with highly aligned graphene fluoride and liquid metal: A versatile technique for thermal management and electromagnetic interference shielding

Flexible and multi-functional thermoconductive polymer composites have significant potential for application in advanced electronics. However, achieving a composite with necessary requirements such as flexibility, thermal conductivity, electromagnetic interference (EMI) shielding, and electrical insulation are challenging. The concept of Janus materials has provided the requirements of advanced electronics by forming a layered structure in polyurethane via sedimentation of liquid metal (LM) and graphene fluoride (GF). The fillers in the polyurethane were elongated and aligned along the draw direction using a stretching-induced filler alignment approach, which enhanced in-plane thermal conductivity and EMI shielding performance simultaneously. The Janus composite film exhibited electrical conductivity on one side and insulation on the other side, demonstrating the true nature of the Janus structure, while the film showed superior thermal conductivity (9.62 W·m−1·K−1) and EMI shielding effectiveness (55 dB) at a draw ratio of 2. These findings provide a novel approach to fabricating multifunctional composites for electronics applications.

In-situ exfoliation of hexagonal boron nitride during the forced flow of highly elastic polylactide to fabricate electrospun fibrous film with high thermal conductivity and low dielectric loss

Boron nitride nanosheets (BNNS) have promising applications in thermal management materials, due to their high thermal conductivity and low dielectric loss. However, it is still challenging to fabricate BNNS with large lateral size and structural integrity via solvent-free methods. Here, we report a novel processing method for in-situ exfoliation of hexagonal boron nitride (h-BN) to fabricate BNNS with an average lateral size of 1.45 μm, average thickness of 4.88 nm and few lattice defects during the forced flow of polylactide (PLA) in a highly elastic state. We further fabricate flexible and bio-degradable PLA/BNNS electrospun fibrous film for electronic devices to replace petroleum-based composites. The PLA/BNNS fibrous film exhibits an in-plane thermal conductivity of 4.9 W/(m·K) at the BNNS loading of 20 wt%. Moreover, the fibrous film also has a low dielectric loss (0.007 at 1 kHz) and good electrical insulation. The in-situ exfoliation strategy is simple, economical and environmentally friendly, providing an effective route to design thermal management materials with high thermal conductivity and low dielectric loss in the future of electronic devices.