Void growth during the plating and stripping process is an important interfacial phenomenon that hinders the development of Li-metal solid-state batteries (SSBs) because it can potentially result in inter-component delamination or growth of Li dendrites. Behind the void growth is the complex interaction between electrochemistry and mechanics. Voids usually grow from micro- or nanoscale initial imperfections on the Li-solid electrolyte (SE) interface. It is, therefore, important to analyze the stress concentration at the initial void tips, which largely determines the growth/shrinking of the void as well as the consequent changes in the internal resistance and overall battery efficiency. Recently, the development of in situ operando experimental technology has enabled the electro-chemo-mechanical characterization of the void growth phenomenon on the Li-SE interface. In this study, we explore how voids in SSBs evolve with a multi-physics model in COMSOL Multiphysics. Based on this model, we perform a systematic parametric study in the space of the mechanical stack pressure and the applied current density. The simulation results show different deformation patterns and potential failure mechanisms under different combination of stack pressure and current density. To better understand the phenomena, we develop an analytical solution to understand the void deformation induced by the inhomogeneous Li-ion concentration field under stack pressure. This analytical approach offers a complementary and intuitive perspective on the mechanical aspect of our simulation findings. By combining the simulation and analytical solutions, we depict a phase diagram, in which we identify the “safe zone” that will not result in void growth. The new insights of this research hold the promise of guiding the development of stabilized SSB interfaces.