An inherent feature of the vacuum arc discharge is that small droplets of micrometer size (macroparticles) are produced along with the plasma in the cathode spots. Droplet contamination of the substrate can occur when implanting metal ions using a vacuum arc ion source. The contamination can be significant for some cathode materials such as lead and other low melting point metals, which for some ion implantation applications such as for semiconductor doping and metallic corrosion inhibition can be a detriment. We have developed a vacuum arc ion source in which the plasma is filtered before the ions are extracted. By guiding the arc-produced plasma through a 60° bent magnetic duct, macroparticles are completely removed from the plasma. No additional power supply for the guiding magnetic field is required since the pulsed arc current itself is used to drive the magnetic solenoid. Tests have shown that macroparticle-free metal ion implantation can be done while maintaining the high ion beam current typical of vacuum arc ion sources.