Although solders that contain lead such as SnPb were customarily used in the microelectronic industry due to their excellent adhesion and soldering properties, good mechanical and fatigue properties, reasonable melting temperature, and low cost, growing concerns rose to abandon their use due to toxicity [1-4]. The mechanical properties of SAC305 films fabricated using thermal evaporation from a SAC spool and SAC bulk material are reported. X-ray diffraction (XRD), field emission (FE-SEM), atomic force microscopy (AFM), and nanoindentation were used to investigate the SAC films crystal structure, thickness, grain structures, surface morphology, and SAC mechanical properties. XRD diffraction of the SAC films exhibited β-Sn crystallographic planes of (200), (101), and (211) orientations with a dominant β-Sn (200) at 2Q = 30.5°. FE-SEM images indicated formation of a discontinuous film of a thickness of 70-75 nm and AFM images depicted formation of equiaxed grains of grain size between 5-100 nm. For bulk SAC material, we conclude that the hardness increases with the increase of the strain rate and the modulus was not influenced by the strain rate. We also conclude that changing the hold time at peak loads or the rate of loading for the creep experiments had no bearing on the creep properties of the bulk SAC material. References Hasnine, M. Mustafa, J.C. Suhling, B.C. Prorok, M.J. Bozack, and P. Lall, Characterization of Aging Effects in Lead Free Solder Joints Using Nanoindentation, IEEE Electronic Components and Technology Conference, 2013, pp 166-178.Aamir, R. Muhammad, N. Ahmed, M. Sadiq, M. Waqas, and Izhar, J. Engg. and Appl. Sci. 2017, vol. 36, pp. 115-123.J. Jackson, H. Lu, R. Durairaj, N. Hoo, C. Bailey, N.N. Ekere, and J. Wright, J. Electron. Mater. 2004, vol. 33, pp. 1524-1529.Cheng, C.-M. Huang, and M. Pecht, Microelectron. Reliab. 2017, vol. 75, pp. 77-95. Figure 1