IC Electrodes Research Articles

Eco-friendly production of carbon electrode from biomass for high performance Lithium and Zinc ion capacitors with hybrid energy storage characteristics

Biomass derived carbon has emerged as promising electrode material for supercapacitors, owing to its low-cost, abundance and eco-friendly nature. Herein, we investigate the application of fluorine-enriched carbon derived from Ipomoea carnea as electrode in Zinc-Ion and Lithium-Ion capacitors (ZIC and LIC). The prepared IC is activated using KOH to enhance the surface properties and to create an amicable environment to accommodate metal ions. The properties of resultant biomass carbon (IC) are evaluated using various physical and chemical characterization techniques. The activated IC exhibited high surface area of 736.7 m2/g and suitable porous structure. The IC electrode is paired with Zn metal foil and an aqueous solution of ZnSO4/MnSO4 is used to fabricate ZIC. The device exhibits a capacitance of 168 F g−1 and retains about 79.5% of its initial capacitance after 5000 cycles. The prepared IC pre-lithiated and used to fabricate Li Ion capacitor, which delivered a capacitance of 155 F g−1 and retained 77.5% of initial capacitance after 5000 cycles. The implication biomass-derived carbon in LIC and ZIC is experimented in detail.

Thyroid-dedicated internally-cooled wet electrode for benign thyroid nodules: experimental and clinical study

Background To assess the effects of radiofrequency ablation (RFA) using an internally-cooled wet (ICW) electrode in ex vivo bovine liver and evaluate the feasibility of the ICW electrode for benign thyroid nodules. Methods We developed an 18-gauge ICW electrode with a microhole at the distal tip for tissue infusion of chilled (0 − 4 °C) isotonic saline (rate = 1.5 ml/min). RFA using ICW and IC electrodes were performed in bovine livers (40 pairs, 1-cm active tip, 50 W, 1-min). We compared the morphological characteristics of ablation zones and presence of carbonization. Twenty patients with benign thyroid nodules larger than 5 ml were prospectively enrolled in a clinical study and underwent ultrasound-guided RFA with ICW electrodes. Ultrasound examinations, laboratory data, and symptom and cosmetic scores were evaluated preprocedure and 1 and 6 months after the procedure. Results In the ex vivo study, the ICW achieved significantly larger ablation zones than the IC (p<.001). In the clinical study, ICW electrodes were tolerable in all patients. At last follow-up, nodule volume had decreased from 15.6 ± 12.1 ml to 4.1 ± 4.3 ml (p<.001), and the mean volume reduction ratio (VRR) was 73.3 ± 13.7% at 6.0 months follow-up. Cosmetic and symptom scores were reduced from 3.52 ± 1.03 to 2.65 ± 0.88 and 3.10 ± 2.17 to 0.85 ± 0.99 (both p<.001), respectively. After RFA, thyroid function was well preserved in all patients, and mean thyroglobulin level decreased from 36.6 ± 52.1 ng/ml to 26.9 ± 62.2 ng/ml. One patient experienced a temporary voice change that recovered within a week. Conclusions We developed a thyroid-dedicated ICW electrode that we showed to be feasible and effective in patients with benign thyroid nodules.

A novel testing system based on microprobe and machine vision for IC testing

To achieve automatic test of the microprobe and the IC circuit, the automated test is integrated based on machine vision. It was found that fitting time of the symmetry axis in the image processing was much less than that of the rectangular fitting, and fitting efficiency was increased by one order of magnitude. On this basis, the relationship between the displacement of the rectangular under machine vision and the number of motor revolutions was obtained. The light intensity was optimized in the testing, thus the stability of automated testing was improved. Finally, the positioning and test of the micro-probe tip and the IC electrode were carried out by the motion control systems, in which the movement accuracy of x, y and the rotation direction reached to 7.6μm, 7μm and 0.066 degrees, respectively. The accuracy of the IC circuit automatic alignment test was verified by the data tested with a multimeter, and the electrical parameters and turn-off of the IC can be automatically measured and evaluated.

Endoscopic Cochlear Implant: A Series of Cases

Objectives: Cochlear implant is traditionally performed using a mastoidectomy, posterior tympanotomy and cochleostomy using a surgical microscope. Because of the anatomical and physiological understanding of the mastoid cells and their role in maintaining ventilation and pressure equalization in the middle ear, and the possible risk of facial nerve injury, some techniques without mastoidectomy and without posterior tympanotomy have been introduced as an alternative approach, showing excellent results. The aim of the study was to describe totally endoscopic technique without mastoidectomy in 6 patients with bilateral profound hearing loss who underwent cochlear implantation from January 2012 to February 2013, showing its viability and the advantages and disadvantages. Methods: All cases were selected based on computed tomography, magnetic resonance, audiological tests and psychological evaluation. Surgical steps, intra- and postoperative complications were analyzed. Each procedure duration was recorded. Surgical procedure was described step by step focusing on the anatomy of the round window (RW) niche. Results: The mean duration of the procedure was 62 minutes. No facial nerve injury was observed. All cases showed a normal RW conformation and endoscopic cochleostomy was conducted. No difficult insertion of the IC electrode was observed. The longest follow-up is 2 years. No postoperative complications were observed in this series. Conclusions: Totally endoscopic cochlear implantation is safe and allows a direct approach to the RW and cochlea. A larger series is paramount to evaluate its total benefits and may represent a breakthrough in the ongoing process of developing scientific knowledge.

Evidence for augmented brainstem activated forebrain seizures in Wistar Audiogenic Rats subjected to transauricular electroshock

Previous work from our laboratory has shown that naïve Wistar Audiogenic Rats (WARs), a genetic model of reflex epilepsy in which seizures are induced by high-intensity sound stimulation (120 dB SPL), are seizure-prone to a variety of pro-convulsive stimuli (e.g., transauricular electroshock, pentylenetetrazole and pilocarpine). On the other hand, repetitive acoustic stimulation of WARs causes a slow recruitment of limbic structures, known as audiogenic kindling, changing seizure expression to include behavior characteristic of temporal-lobe epilepsy. Thus, our hypothesis is that WARs have facilitated acoustic-limbic projections when compared to Wistar controls. Wistar controls ( n = 9) and WARs ( n = 9) underwent EEG electrode implants in the cortex-Cx, amygdaloid complex-AMY and inferior colliculus-IC and received one low current transauricular electrical stimulus (ES) daily, for three consecutive days, with intensities of 10, 20 and 30 mA, respectively. The video-electroencephalographic activity was recorded 1 min before and 4 min after ES. Our results confirm previously described data indicating a greater susceptibility of WARs to seizure. However, low current ES (e.g., 20 mA) triggered epileptiform activity in the AMY only after epileptiform EEG was visible in the Cx and IC electrode leads. The AMY after-discharge continued even though no evident epileptiform activity was present in the Cx. In conclusion, our results add electrophysiological data to previously published behavioral evidence of WAR enhanced susceptibility to ES seizures and, also, support the hypothesis that the acoustic-limbic circuitry is facilitated even in unkindled WARs.

無電解銀めっきによる導電性微粒子の作製

Connection reliability between LSI and electronics device is increasingly important with the miniaturization of electronics device. In general, solder is widely applied to connect between IC chips and the circuits. In this case, contact reliability between IC chips and electrode is the key technology. However, solder can not applied to the chip on the glass (COG) bonding, because the thermal stress on the glass substrate causes the crack during the soldering step. Therefore, solder-less process such as the conductive paste, conductive particles, and bumps has been applied to solve these problems. In this paper, we investigate the properties of the deposited film and the bath stability of the electroless silver plating process. The deposition rate gradually decreased with the reaction time since Co (II) -amine complex ions are readily self oxidized under the air atmosphere, and the bath life was shortened. Bath life was improved by the operating conditions, especially, the prevention of Co (II) oxidation under the nitrogen atmosphere. Furthermore, the preparation of the silver conductive particle was investigated. As the result, the uniformity film on the particle was obtained under the optimized pre-treatment process.

822 COG 実装技術における ACF 内導電粒子の変形挙動

Following the increasing adoption of TFT-type LCD modules in a mobile and other equipments, COG (chip-on-glass) mounting is increasingly employed instead of TCP (tape crrier package) mounting to make LCD modules smaller, thinner, and cheaper. Since the IC and LCD panel electrodes are bonded together by the conductive particles embedded in ACF (anisotoropic conductive film), the bonding conditions depend substantially on the respective characteristics of the IC electrodes and the conductive particles on the ACF. We examined the effects of the arrangement, area and material properties of IC electrodes and the profile and the effects of material properties of conductive ACF particles.

ADHESIVE FLIP CHIP BONDING ON FLEXIBLE SUBSTRATES

Flip chip attachments provide the highest interconnection density possible — which makes this technology very attractive for use with flexible high density substrates. This technology stimulated the development of new interconnection techniques such as anisotropic conductive adhesives, isotropic conductive adhesives and non-conductive adhesives.This paper presents three approaches to a flip chip adhesive process based on flexible polyimide and polyester substrates using gold, nickel/gold and gold stud bumps. A promising candidate for adhesive joining technique are the isotropic conductive adhesives. These adhesives are isotropically conductive, which means that they conduct electricity equally in all directions. To use such adhesives in flip chip applications, the material must be applied precisely onto the points to be electrically connected, and must be not allowed to flow and short circuit between circuit lines. The anisotropically-conductive adhesive materials are prepared by dispersing electrically-conductive particles in an adhesive matrix at a concentration high enough to assure reliable conductivity between the substrate and the IC electrodes. Another possibility is the use of non-conductive adhesives and goldbumped chips, which are bonded via thermocompression to the substrate. During the bonding the bumps pierce through a non-conducting adhesive foil and make the electrical contact while the adhesive supplies the mechanical stability. Moreover, the adhesive fills the gap between chip and substrate, relieving the bumps of the mechanical stress resulting from the different CTEs.The reliability evaluation was performed with specific regard to the interface reactions between polymers and metal surfaces in adhesive contacts. The electrical and mechanical performance of the adhesive bonds were studied by evaluating initial contact resistance as a function of temperature and humidity.

Mediated electrocatalysis at a biocatalyst electrode based on a bacterium, Gluconobacter industrius

Mediated amperometr ic enzyme electrodes use oxidoreductases as catalysts to oxidize or reduce the substrates bioelectrocatalytically in the presence of redox molecules serving as mediators [1-3]. We are interested in the use of microorganisms in place of enzymes. It was reported in early 1966 [4] that Fe(CN)63acted as an electron acceptor for the metabolic oxidation of o-glucose by Escherichia coli (E. coli). This means that in principle, Fe(CN) 3can be used as a mediator to couple the oxidation reaction of o-glucose by E. coli to the electrode reaction of Fe(CN)63-. At tempts to use mediators to shuttle electrons from a bacterial respiratory chain to an electrode were made in biofuel cell configurations [5,6]. In a few whole cell-based biosensors, mediators have been employed to divert electrons from the micro-organisms to the electrode for monitoring photosynthetic activity [7] or eubacterial respiration [8]. However, the details of the electrocatalytic reaction have not been investigated, and the redox compounds taking part in the catalytic reaction are not clear. There is no report on studies of whole cell-based electrodes from a bioelectrocatalysis point of view. A number of micro-organisms have oxidoreductases in their cytoplasmic membranes. The oxidoreductase reaction may be linked to an electrode reaction by the use of an appropriate mediator as illustrated schematically in Fig. 1. We have tested several kinds of bacteria as catalysts and observed small currents resulting

A fine pitch COG technique for a TFT-LCD panel using an indium alloy

A fine-pitch chip-on-glass (COG) bonding technique for liquid-crystal display (LCD) panels is described. An IC chip with gold (Au) bumps was dipped in a stirred indium-tin (InSn) alloy bath in a nitrogen atmosphere without flux. Shallow-bowl-shaped InSn alloy bumps were selectively formed on the Au bumps on the IC electrodes. The minimum examined bump pitch was 50 mu m, and the bump size was 31*31 mu m. The InSn alloy bumps, which had minimum pitch of 100 mu m, were connected to molybdenum (Mo) conductors without flux at low pressure (30 gf/bump or less) and low temperature (110 degrees C or less). The temperature was lower than the alloy melting point. The mean contact resistance was 0.78 Omega . The technique allows easy repair. A thermal shock test, a high-temperature and high-humidity storage test, and a high-temperature storage test showed that the contact resistance changes satisfied the specification, which allows up to 10 Omega . Prototype thin-film-transistor (TFT) LCD panels with 80- mu m pitch-driver ICs were developed using the new bonding method.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>