A novel testing system based on microprobe and machine vision for IC testing

Abstract

To achieve automatic test of the microprobe and the IC circuit, the automated test is integrated based on machine vision. It was found that fitting time of the symmetry axis in the image processing was much less than that of the rectangular fitting, and fitting efficiency was increased by one order of magnitude. On this basis, the relationship between the displacement of the rectangular under machine vision and the number of motor revolutions was obtained. The light intensity was optimized in the testing, thus the stability of automated testing was improved. Finally, the positioning and test of the micro-probe tip and the IC electrode were carried out by the motion control systems, in which the movement accuracy of x, y and the rotation direction reached to 7.6μm, 7μm and 0.066 degrees, respectively. The accuracy of the IC circuit automatic alignment test was verified by the data tested with a multimeter, and the electrical parameters and turn-off of the IC can be automatically measured and evaluated.