2D materials have been the focus of intense research in the last decade due to their unique physical properties. This presentation will highlight our recent progress on the large-area synthesis of two-dimensional transition metal chalcogenides for nanoelectronics using advanced atomic layer deposition cycle schemes. First, how we can use advanced cycle schemes to deposit wafer-scale polycrystalline MoS2 thin films at very low temperatures down to 100 °C. We have identified the critical role of hydrogen during the plasma step in controlling the composition and properties of molybdenum sulfide films. By increasing the H2/H2S ratio or adding an extra hydrogen plasma step to our ALD process, we are able to deposit pure polycrystalline MoS2 films at temperatures as low as 100 °C. To the best of our knowledge, this represents the lowest temperature for crystalline MoS2 films prepared by any chemical gas-phase method.[1]ALD-grown 2D films tend to exhibit a high density of out-of-plane 3D structures in addition to 2D horizontal layers. While the out-of-plane 3D structures are ideal for catalysis applications, the presence of such 3D structures can hinder charge transport, which hampers device applications. In this presentation I will show how we used mechanistic insight obtained by HRTEM to tune the shape and density of the 3D structures during plasma-enhanced ALD using advanced atomic layer deposition schems. The obtained morphology control was further confirmed by electrical measurements.[2]Earlier [3] we have shown that ALD is an excellent technique to make MoxW1-xS2 alloys with precise control over the alloy composition. Here, I will focus on how (plasma-enhanced) atomic layer deposition can aid in synthesizing doped 2DTMCs with precise control over the doping concentration by using elaborate ALD dosing schemes.[1] M. Mattinen et al., Chem. Mater. (2022), 34, 5104[2] S. Balasubramanyam, et al. ACS Appl. Mater. Interfaces (2020), 12, 3873[3] J. J. P. M. Schulpen et al. 2D Mater. (2022), 9, 025016
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