Hybrid Processing Technology Research Articles

Modelling and Design Optimization of a Novel Compliant XY Positioner for Vibration-Assisted CNC Milling

Vibration-assisted machining, known as hybrid processing technology, offers several benefits over conventional machining methods. However, developing mechanical structure designs to generate a non-resonant frequency source remains challenging. The objective of this study is to propose a novel design for an XY flexure positioner by combining the pseudo-rigid-body model with the Lagrange technique, finite element analysis and Crayfish optimization algorithm. Firstly, the mechanism was designed by combining a hybrid amplifier and parallel driving mechanism integrated with right circular hinges to increase the natural frequency and precision for potential application to VAM CNC milling. Then, the analytical model was established by the pseudo-rigid-body and Lagrange method. Next, the theoretical result was verified by finite element analysis. The first natural frequency results of theory and FEM methods were found at 990.74 Hz and 1058.5 Hz, respectively. The error between the two methods was 6.4%, demonstrating a reliable modeling approach. Based on the analytical equations, the Crayfish optimization algorithm was utilized for optimizing the main design variables of the mechanism. Next, the prototype was fabricated. The results showed that the experimental and simulated frequencies were 1127.62 Hz and 1216.6 Hz, with an error between the two methods of 7.31%. Finally, the workpiece was installed on the prototype and a real vibration-assisted CNC milling process was carried out in the frequency range [700 Hz, 1000 Hz]. The best surface roughness of the specimen was achieved at a frequency of 900 Hz with a Ra of 0.287 µm. This demonstrates that the proposed XY mechanism is an effective structure for generating a non-resonant frequency source for vibration-assisted machining.

A hybrid process technology of SiC die separation

ABSTRACT Silicon carbide (SiC) is ideal for making powerful, high-frequency chips for 5 G and electric vehicles due to its wide band gap and resistance to high voltage. However, its powerful chemical bond strength and extreme hardness make it difficult for die separation in the post-wafer process. A hybrid process technology is proposed, where die scribing is performed on SiC wafer using a femtosecond pulsed laser-assisted ablation. The extremely short energy pulses forced the ablation of traces of SiC at extreme speed, breaking chemical bonds and thereby reducing strength and hardness for easy high-speed cutting along the scribed lanes with a polycrystalline diamond wheel. The experiment showed that the average stage current dropped from 0.90 A to 0.45 A and kerf chipping ratio from 11.7 to 4.1 during die separation, proving that the process removed materials along the separation lanes using a wheel tool at low grinding force, creating separation lanes of outstanding straightness and minimal kerf chippings and SiC dies of high integrity. Furthermore, thanks to the on-line rotational machining and dressing of the wheel tool, the blunt diamond abrasive cutting edge could be redressed to expose chip pockets of appropriate depth and protruding grinding edges with a favorable negative rake angle. The established grinding regime utilizing a pressure-grinding force in cutting and material removal reduced cracking at the SiC surface. In this paper, the laser energy density, scanning speed, number of ablations, focus position, as well as the speed, feed-rate and grinding depth of the wheel tool are also discussed in detail.

Cross-scale and cross-precision structures/systems fabricated by high-efficiency and low-cost hybrid 3D printing technology

Three-dimensional (3D) printing is widely used in many fields such as micro-optics, microbiology, and microfluidics. However, using existing technologies is a challenge to efficiently fabricate high-quality 3D structures with cross-scale and cross-precision. In this paper, we propose a low-cost hybrid processing technology that combines two-photon polymerization (TPP) and DMD micro stereolithography (DMDMSL) (TPP-DMDMSL). This low-cost hybrid processing technology is a two-part alignment achieved by combining marker positioning and image processing, and then by coordinating the transformation of processing data. Using the same mark as a bridge, the two independent technologies are linked to realize hybrid processing. The high synergetic combination of the two technologies is realized by using the mask as the benchmark and combining it with the flexible real-time transformation of processing data. The horizontal and vertical alignment accuracy is 2 µm and 3 µm, respectively. TPP-DMDMSL unites the high precision of TPP with the high efficiency of DMDMSL. Taking the aspheric lens as an example (radius = 163 µm, height = 33 µm), TPP-DMDMSL reduces the time from 4 h to 1 h. The maximum surface error is 0.22 µm, which does not affect the image quality according to the Rayleigh criterion. TPP-DMDMSL manufactures different types of structures. These results prove that TPP-DMDMSL can print multiple types of 3D structures across scales and precision, which is challenging or time-consuming with existing technologies. TPP-DMDMSL will likely be extended to more micro and nano fields based on the original general technology. TPP-DMDMSL provides strong basic techniques and ideas for integrated hybrid processing systems in the future.

Kunpeng 920: The First 7-nm Chiplet-Based 64-Core ARM SoC for Cloud Services

Kunpeng 920 is the second generation server processor designed by HiSilicon based on ARM architecture. Kunpeng 920 is able to achieve cost efficiency for various workloads through using a variety of chiplets and hybrid process technologies. The unique recomposition(s) of these flexible chipsets allows new designs to be created. The Kunpeng series processors combine technology innovations from various levels to improve efficiency, eliminate bottlenecks, and deliver value and performance. Its key features are as follows: The Kunpeng 920 core is specifically designed with superscalar architecture with the support of vector extension to provide leading features for high-performance computing applications; the coherent cache subsystem is created to integrate multicores into single chiplet (e.g., 7-nm process node) with a ring design that is ultralow-latency (<; 15 ns), nonblocking and bufferless; a dedicated parallel small-IO block is developed to achieve high-bandwidth (e.g., 400 GB/s) interdie connection for 2-D package solutions; IO die is redesigned (e.g., 16-nm process) so that the latest standard interface (e.g., PCI4.0) can be leveraged to scale up the System on a Chip (SoCs) and connect them with other IO devices; two or four Kunpeng 920 can work together as single symmetric multiprocessor system with cache coherent nonuniform memory access fabric.

Laser-induced oxidation-assisted micromilling of deep narrow microgroove on Inconel 718

The miniaturized components of Inconel 718 superalloy are widely used in aerospace industries due to its excellent properties at elevated temperatures. In this work, an innovative hybrid processing technology named laser-induced oxidation assisted micromilling (LOMM) was proposed. A deep narrow microgroove with a depth of 1500 μm and a width of 500 μm was fabricated successfully by LOMM. The effects of average laser power on morphology and microstructure of the oxide layer and sub-layer were studied. In addition, milling force, surface quality of the machined microgrooves, and tool wear were investigated. Under laser irradiation with average laser power of 4.5 W, a loose and soft oxide layer, as well as a sub-layer were formed, whose thicknesses were 24 μm and 16 μm, respectively. The milling force during removing of the oxide layer was only around 1.2 N, which was much lower than that (3~8 N) when removing of the substrate material. Owing to the low cutting force, no obvious tool wear was observed in removing of the oxide layer. However, tool wear in terms of coating peeling and microchipping was found in micromilling of the sub-layer and substrate material. For comparison, conventional micromilling (COMM) was used to machine a deep narrow microgroove under identical milling parameters. The tool diameter was reduced by 4.4% in LOMM, while that was reduced by 22% in COMM. The tool failure forms in COMM were catastrophic nose breakage and severe coating peeling. The bottom surface roughness Sa of the deep narrow microgroove machined with LOMM was 0.21 μm, while that machined with COMM reached 0.41 μm. This study validated that the proposed novel hybrid process can prolong tool life, and improve surface quality and material removal rate.

Effect of a hybrid process, high hydrostatic pressure treatment combined with mixed‐strain fermentation, on the quality of the dietary fibre in pickled vegetables

SummaryA new hybrid processing technology, mixed‐strain (Lactobacillus plantarum and Pediococcus acidilactici; mixed‐LAB) fermentation combined with high hydrostatic pressure (HHP) treatment, was used to modify the dietary fibre (DF) in Sichuan pickled vegetables. This process significantly improved the swelling and water holding capacities of the DF, while the oil holding capacities first increased and then decreased sharply with elevated pressure. Physio‐functional properties of DF, including heavy metal adsorption, cholate adsorption and α‐amylase inhibitory activity, were also enhanced, and antioxidant activity assays revealed an increase in the free radical scavenging ability and the ferric reducing adsorption capacity. The DF structure analysis showed that the hybrid process increased the contents of soluble dietary fibre and monosaccharides of the DF. Moreover, the microstructure is loosened and the surface pore size is expanded. These results indicate that combining mixed‐LAB fermentation with HHP treatment is a potential tool that would enable the production of a better quality of DF.

Multilayered skyscraper microchips fabricated by hybrid \u201call-in-one\u201d femtosecond laser processing

Multilayered microfluidic channels integrated with functional microcomponents are the general trend of future biochips, which is similar to the history of Si-integrated circuits from the planer to the three-dimensional (3D) configuration, since they offer miniaturization while increasing the integration degree and diversifying the applications in the reaction, catalysis, and cell cultures. In this paper, an optimized hybrid processing technology is proposed to create true multilayered microchips, by which “all-in-one” 3D microchips can be fabricated with a successive procedure of 3D glass micromachining by femtosecond-laser-assisted wet etching (FLAE) and the integration of microcomponents into the fabricated microchannels by two-photon polymerization (TPP). To create the multilayered microchannels at different depths in glass substrates (the top layer was embedded at 200 μm below the surface, and the underlying layers were constructed with a 200-μm spacing) with high uniformity and quality, the laser power density (13~16.9 TW/cm2) was optimized to fabricate different layers. To simultaneously complete the etching of each layer, which is also important to ensure the high uniformity, the control layers (nonlaser exposed regions) were prepared at the upper ends of the longitudinal channels. Solvents with different dyes were used to verify that each layer was isolated from the others. The high-quality integration was ensured by quantitatively investigating the experimental conditions in TPP, including the prebaking time (18~40 h), laser power density (2.52~3.36 TW/cm2) and developing time (0.8~4 h), all of which were optimized for each channel formed at different depths. Finally, the eight-layered microfluidic channels integrated with polymer microstructures were successfully fabricated to demonstrate the unique capability of this hybrid technique.

High-performance machining of fiber-reinforced materials with hybrid ultrasonic-assisted cutting

A main approach for sustainable and efficient products is the application of innovative materials like fiber-reinforced plastics. Despite the excellent properties, the machining requirements, especially the hard cutting conditions, restrain the wide application of these materials. Thus a major task is the realization of the required part qualities combined with efficient machining strategies. The project ULTRASPAN, a joint venture of partners from industry and research institutes funded by the BMBF, attends to this challenge. The goal is the development of new hybrid machining concepts and process technologies for enhanced cutting of composite materials with ultrasonic-assistance. Prior condition is the development of novel robust actuators. Therefore, prototypic actuators for longitudinal and torsional vibration systems are developed in the project. Besides the novel actuator concepts, the results of ultrasonic-assisted drilling (UAD) on composite parts are presented in this paper. Machining tests in drilling of fiber-reinforced plastics with the novel prototype actuator systems were performed. Focus of the investigation was the influence of the ultrasonic vibration support on the bore quality. The superimposition of drilling with ultrasonic vibrations influences the process characteristics and engagement of the cutting edge. Machining tests showed the potential to enhance the bore quality with UAD in a certain parameter field.

Hybrid Processing: the Impact of Mechanical and Surface Thermal Treatment Integration onto the Machine Parts Quality

The comparative analysis of the two hybrid process technologies, which are based on the integration of mechanical treatment (abrasive grinding or turning) and a surface heat strengthening by high frequency current on the same processing equipment, is given in the paper. The acquired results demonstrate that the suggested integrating approach allows carrying out the processing on the one technological base, which leads to the increase in the quality of the machine parts surface layer. The conducted experimental research proves that a minor stock allowance value for the final mechanical processing (sparking out or diamond smoothing) ensures the absence of defects such as local abatement zones and provides strain hardening of the work piece surface. This leads to the formation of the work-hardened layer of 0.01 - 0.03 mm, increase in microhardness value by 12 - 17% and the level of residual compressive stress in the surface layer by 10 - 21 % respectively.

Automated and Cost-efficient Production of Hybrid Sheet Moulding Compound Aircraft Components

Nowadays, innovative lightweight structures and highly complex aircraft components are made of modern lightweight materials such as carbon fibre reinforced plastics (CFRP). In this context current production technologies for fibre composite parts in aviation industry are generally characterised by long cycle times, sub-optimal material usage and a huge effort for reworking or finishing. A promising technology for the cost-efficient and time-saving manufacturing of lightweight, geometrically complex and functional components is the combination of thermoset Sheet Moulding Compounds (SMC) with chopped fibre reinforcements and pre-impregnated, tailored continuous fibre reinforcements in a single-stage compression moulding process. In comparison to conventional production technologies for composite materials this hybrid material and process technology obtains short cycle times, functional integration, a high freedom of design, an optimum material usage and less rework. For the manufacturing of cabin, cargo and also secondary structure aircraft components a direct implementation of metallic elements, such as inserts, and the use of recycled carbon fibres can be realised. Furthermore, this process technology can be fully automated to yield an increased economic efficiency.Hence, this paper deals with the potentials of this new technology, especially regarding to cost reduction and saving of time, by analysing and simulating the holistic process chain for the production of appropriate reference parts. In addition, different production concepts, with various grades of automation, are considered in detail and compared to each other in reference to determined criteria.

Magnetic aqueous two phase fishing: A hybrid process technology for antibody purification

The potential to combine aqueous two-phase extraction (ATPE) with magnetic separation was here investigated with the aim of developing a selective non-chromatographic method for the purification of antibodies from cell culture supernatants. Aqueous two-phase systems (ATPS) composed of polyethylene glycol (PEG) and dextran were supplemented with several surface modified magnetic particles (MPs) at distinct salt concentrations. The partition of pure human IgG in the upper and lower phases as well as the amount adsorbed at the MPs surface was investigated, indicating that MPs coated with dextran and gum Arabic established the lowest amount of non-specific interactions. The binding capacity of gum arabic coated particles modified with aminophenyl boronic acid (GA-APBA-MP) was were found to be excellent in combination with the ATPS system, yielding high yields of antibody recovery (92%) and purity (98%) from cell culture supernatants. The presence of MPs in the ATPS was found to speed up phase separation (from 40 to 25min), to consume a lower amount of MPs (half of the amount needed in magnetic fishing) and to increase the yield and purity of a mAb purified from a cell culture supernatant, when compared with ATPE or magnetic fishing processes alone.

Special Section Guest Editorial: Optical and Hybrid Imaging and Processing for Big Data Problems

The scientific community has been dealing with big data for a long time. Due to advancement in sensing, networking, and storage technology, other domains such as business, health, and social media followed. Data are considered the gold of the 21st century and are being collected, stored, and analyzed at a rapid pace. The amount of data being collected creates a compelling case for investing in hardware and software research to support generating even more data from new sensors and with better quality. It also creates a compelling case for investing in research and development of new hardware and software for data analytics. This special section of Optical Engineering explores the optical and hybrid imaging and processing technology that will enable capturing and analyzing large amounts of data or help stream the data for further exploration and analysis.

초정밀 평삭가공과 마이크로 펀칭가공을 위한 하이브리드 가공장비 및 공정기술 개발

Ultra-fine planing and micro punching are separately used for improving surface roughness and machining dot patterns, respectively, of metal molds. If these separate machining processes are applied for machining of identical molds, there could be an aligning mismatch between the machine tool and the mold. A hybrid machining system combining ultra-fine planing and micro punching was newly developed in this study in order to solve this mismatch; hybrid process technology was also developed for machining dot patterns on a mirror surface of a metal mold. The hybrid machining system has X, Y, and Z axes, and a cam axis for ultra-fine planing. The cam axis and attachable and removable solenoid actuators for micro punching can make large and small sizes of dot patterns, respectively. Ultra-fine planing was applied in the first place to improve the surface roughness of a metal mold; the measured surface roughness was about 20nm. Then, micro punching was applied to machine dot patterns on the same mold. It was possible to control the diameter of the dot patterns by changing the input voltage of the solenoid actuator. Before machining, severe inhomogeneous plastic deformation around the machined dot patterns was also removed by annealing heat treatment. Therefore, it was verified that metal molds with dots patterns for optical products can be machined using a hybrid machining system and the hybrid process technology developed in this study.

Low-loss electromagnetic composites for RF and microwave applications

Low-loss electromagnetic composites with high permittivity and permeability will benefit the miniaturization and multifunctional of RF devices. A kind of low-loss dielectric-magnetic ceramic-ceramic composite was developed by hybrid processing technology with the goal of integrating the dielectric properties and magnetic properties. The hybrid processing technology exhibits the advantage of lowered sintering temperatures for the composites while retaining good microstructure and high performance. By introducing elastomer as matrix, a kind of flexible low-loss dielectric-magnetic ceramic-polymer composite was prepared and studied. The obtained flexible dielectric-magnetic ceramic-polymer composite exhibited low loss and good mechanical properties. The results show good effects on lowering the dielectric loss and extending the cut-off magnetic frequency of the electromagnetic composite. Methods for tailoring the properties of the multifunctional composites were proposed and discussed.

Development of Hybrid Reprocessing Technology Based on Solvent Extraction and Pyrochemical Electrolysis

Toshiba has been proposing a new fuel cycle concept for a transition period from LWR to FR. This concept has a higher proliferation resistance for a fuel cycle than for a conventional cycle because plutonium could be recovered with minor actinides. Toshiba has been developing a new advanced hybrid process technology with solvent extraction and pyrochemical electrolysis of spent fuel reprocessing for a transition period from LWR to FR. The advanced hybrid process combines the solvent extraction of the LWR spent fuel in nitric acid to recover pure uranium and the pyrochemical electrolysis in molten salts to recover impure plutonium with minor actinides. Highly pure uranium is used for LWR fuel and impure plutonium with minor actinides for metallic FR fuel. The pyrochemical process for the FR fuel recycle system is based on the research on the electrorefining process in molten salts since 1988 in cooperation with Central Research Institute of Electric Power Industry (CRIEPI). The solvent extraction test with an electrolytic reduction test using actual LWR spent fuel and an oxalate precipitation test were carried out to confirm the feasibility of the new advanced hybrid process. The electrolytic reduction test was conducted to investigate the impurity of uranium recovery and the oxalate precipitation test to evaluate the recovery yield of plutonium with minor actinides. The results suggest that the purity of recovered uranium (U) and the recovery yield of plutonium with a minor actinide (Pu+MA) could achieve the target value in a stage (U purity: 99.97%, Pu+MA recovery yield: 99.9%).

Adsorption-membrane filtration (AMF) hybrid process for boron removal from seawater: an overview

The general objective of this study is to explore the suitability and performance of the adsorption-membrane filtration (AMF) hybrid process technology for boron removal from seawater and/or RO first stage permeate.

A 4-GHz 8-b ADC system

The system described incorporates silicon bipolar, thick-film hybrid, and CMOS process technologies. A sampler chip providing filtered pulses to four analog-to-digital converter chips on one thick-film hybrid can provide 8 b of resolution and a 2-Gsample/s sampling rate. A novel sampling process called sample and filter is used to reduce the bandwidth requirements of post-sampling circuitry. Two thick-film hybrids with interleaved sample timing were used to obtain a 4-Gsample/s sample rate, 2-GHz bandwidth, and eight effective bits at DC. The goals for system functionality, resolution, bandwidth, and noise were all met with the initial prototypes of the chips and the thick-film hybrid.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>