Hybrid Chip Research Articles

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103 Articles

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The use of acoustic emission in a test for beam-lead, TAB and hybrid chip capacitor bond integrity : George G. Harman. IEEE Trans. Parts. Hybrids. PackagingPHP-13, (2) 116 (June 1977)

The use of acoustic emission in a test for beam-lead, TAB and hybrid chip capacitor bond integrity : George G. Harman. IEEE Trans. Parts. Hybrids. PackagingPHP-13, (2) 116 (June 1977)

Microelectronics Reliability

Jan 1, 1977