A 4H-SiC 4° off-wafer fabricated from a bulk crystal grown using the solution method has high quality with extremely low-density threading screw (TSD) and basal plane (BPD) dislocations. For application to electronic devices, we formed an epitaxial layer on the solution-method-prepared wafer via chemical vapor deposition and evaluated the BPD in the epitaxial layer using synchrotron X-ray topography and molten KOH etching. The BPD density of the epitaxial layer formed on the solution-grown crystals was extremely low. Bulk crystals fabricated as wafers by the solution method are expected to be applied to high-voltage bipolar devices that do not suffer from degradation of forward characteristics.