High-speed Microelectromechanical Systems Research Articles

Acoustic resolution photoacoustic microscopy based on microelectromechanical systems scanner.

Photoacoustic microscopy (PAM) can be classified as optical resolution (OR)-PAM and acoustic resolution (AR)-PAM depending on the type of resolution achieved. Using microelectromechanical systems (MEMS) scanner, high-speed OR-PAM system was developed earlier. Depth of imaging limits the use of OR-PAM technology for many preclinical and clinical imaging applications. Here, we demonstrate the use of a high-speed MEMS scanner for AR-PAM imaging. Lateral resolution of 84 μm and an axial resolution of 27 μm with ~2.7 mm imaging depth was achieved using a 50 MHz transducer-based AR-PAM system. Use of a higher frequency transducer at 75 MHz has further improved the resolution characteristics of the system with a reduction in imaging depth and a lateral resolution of 53 μm and an axial resolution of 18 μm with ~1.8 mm imaging depth was achieved. Using the two-axis MEMS scanner a 2 × 2 .5 mm2 area was imaged in 3 seconds. The capability of achieving acoustic resolution images using the MEMS scanner makes it beneficial for the development of high-speed miniaturized systems for deeper tissue imaging.

High-speed simultaneous multiscale photoacoustic microscopy

.Photoacoustic microscopy (PAM) is a fast-growing biomedical imaging technique that provides high-resolution in vivo imaging beyond the optical diffusion limit. Depending on the scalable lateral resolution and achievable penetration depth, PAM can be classified into optical resolution PAM (OR-PAM) and acoustic resolution PAM (AR-PAM). The use of a microelectromechanical systems (MEMS) scanner has improved OR-PAM imaging speed significantly and is highly beneficial in the development of miniaturized handheld devices. The shallow penetration depth of OR-PAM limits the use of such devices for a wide range of clinical applications. We report the use of a high-speed MEMS scanner for both OR-PAM and AR-PAM. A high-speed, wide-area scanning integrated OR-AR-PAM system combining MEMS scanner and raster mechanical movement was developed. A lateral resolution of and penetration depth in vivo was achieved using OR-PAM at 586 nm, whereas a lateral resolution of and penetration depth of in vivo was achieved using AR-PAM at 532 nm.

Optical resolution photoacoustic microscopy based on multimode fibers.

Photoacoustic microscopy (PAM) is a multiscale imaging technique. In optical-resolution photoacoustic microscopy (OR-PAM), a single mode (SM) fiber is normally used as the source of optical excitation to be focused into a diffraction-limited spot. Recent advances in OR-PAM have improved its imaging speed using microelectromechanical systems (MEMS). Here we report for the first time the use of a multimode (MM) fiber as the optical excitation source for high resolution OR-PAM in vivo imaging. A high-speed MEMS scanner based OR-PAM system combined with the mechanical movement to provide wide area imaging was used. The use of multimode fiber for achieving tight optical focus would make the optical alignment easier and high repetition rate light delivery possible for high-speed OR-PAM imaging. A lateral resolution of 3.5 µm and axial resolution of 27 µm with ~1.5 mm imaging depth was successfully demonstrated using the system. The efficacy of multimode fibers for achieving tight focus is beneficial for developing high-resolution photoacoustic endoscopy systems and can be combined with other optical endoscopic imaging modalities as well.

A high-speed MEMS grating laser scanner with a backside thinned grating platform fabricated using a single mask delay etching technique

A novel micro-electromechanical system (MEMS) technology-based grating laser scanner with a backside thinned grating platform has been successfully developed for high-speed laser scanning applications. The grating platform is thinned by a round cavity and reinforced by a circular frame, which are fabricated using a single mask delay etching (SMDE) technique. The SMDE technique, which utilizes the well-know loading effects of the deep reactive ion etching (DRIE) process, is a simple and low-cost methodology to regulate the etching rate of a prescribed area. It can be used in a silicon-on-insulator (SOI) micromachining process to form multilevel structures in a silicon device layer through a multi-step DRIE process from a wafer's backside. This paper presents the design, simulation, fabrication process and characterization of the high-speed MEMS grating scanner as well as the principle and applications of the SMDE technique. When illuminated with a 635 nm wavelength incident laser beam, the prototype scanner with a 1 mm diameter diffraction grating is capable of scanning at 50.192 kHz with an optical scan angle of 14.1°.

Deformation Measurements of High-Speed MEMS With Combined Two-Wavelength Single-Pulse Digital Holography and Single Phase Reconstruction Using Subpicosecond Pulses

Holographic contouring of high-speed microelectromechanical system optical scanner mirrors operating at resonance frequencies close to 1 kHz is performed with ultrashort-pulse lasers containing two spectral components. These particular pulses are obtained by shaping the spectrum of sub-30 fs pulses of a Ti:sapphire laser system by an acousto-optic programmable dispersive filter. The separation of the two spectral components is adjustable within the 50-nm gain bandwidth. Single-pulse dual-wavelength contouring is achieved by an extended Twyman-Green type interferometer including two CMOS cameras. The deformation obtained from a single-wavelength interferogram is combined with the coarse-shape information deduced from the phase difference map of the two interferograms captured at different wavelengths to yield a combined reconstruction.