High-speed Interconnect Systems Research Articles

Control policies for interconected distributed systems via an HIPPI switch

The increase in high-speed communication between supercomputers and between intelligent components of supercomputing systems has lead to the development of the High Performance Parallel Interface (HIPPI) as a standard interface for local high-speed interconnection systems. This interface facilitates connection oriented, one way communication at speeds up to 1600 Mbps. While the standard specifies the physical interface to the interconnection system, it leaves open many aspects of the system, such as switch topology and connection management policy. This paper proposes three different policies for managing the connections in a HIPPI system, a centralized policy, a broadcast policy, and a distributed policy. Assuming a crossbar topology for the switch a analytic model is developed to evaluate the performance of HIPPI interconnection systems under the three connection management policies. The model results can aid in determining the proper size of the interconnection system, and in selecting an appropriate connection management policy.

Frequency-dependent inductance and resistance calculation for three-dimensional structures in high-speed interconnect systems

Frequency-dependent inductances and resistances of three-dimensional structures commonly encountered in modern electronic interconnections are calculated by a combined finite-element/integral-equation method. the mathematical formulation and the numerical method of solution are discussed. Numerical results for microstrip bends and vias are presented. These results compare well with experiment. The effect of the frequency dependence of the inductance on pulse propagation is discussed. >

Electrical Performance of High-Speed Interconnect Systems

Advancing semiconductor technology is increasing both device densities and speeds. As signal risetimes become faster than Ins and interconnect densities on a single chip carrier approach 500 leads or more, extremely careful electrical modeling of the packaging environment becomes critical. Designers are confronted with the practical problems imposed by the interconnect system which may degrade (or limit) the electrical performance of the device/system. To analyze or design a highspeed, high-density interconnect system, a battery of software modules needs to be developed. Several of these software modules are described.