High-speed Electronic Packages Research Articles

Fuzzy Fine Tuning Therapies for Intelligence of High Speed Electronic Packaging Equipment

It’s always difficult to satisfy both strict requirements of dynamic performance and settling performance of high-precision and high-acceleration point-to-point motions on electronic packaging equipment, i.e., Die bonders, Wire bonders, Flip-chip bonders, Wafer bumping machines, and so on. Focusing on this difficulty, Fuzzy logic is promoted in this paper to fine tune feed forward coefficient parameters of motion systems on packaging equipment to satisfy multiple targets of dynamic and settling performance requirements. This intelligent fine tuning approach, with achievable multiple motion targets, provides a therapy to automate and optimize motion system performance on packaging equipment, help on development and mass production of semiconductor packaging equipment, and improve machine intelligence.

Efficient Modeling of Rerouted Return Currents in Multilayered Power-Ground Planes by Using Integral Equation

<para xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> Multilayered power-ground (PG) planes are commonly used to supply power to circuits in high-speed electronic packages and printed circuit boards (PCBs). In this paper, we propose an efficient integral equation equivalent network method to simulate the interference produced by the rerouted return currents of signal traces inside such PG planes. The integral equation is created based on the geometrical features of the PG planes. Therefore, it could reduce the computing time and will be maintaining good accuracy. By discretizing the integral equation, a multiport equivalent network model is derived for each layer of the PG planes. Their [<formula formulatype="inline"> <tex>$Z$</tex></formula>] matrices are then obtained. These [<formula formulatype="inline"> <tex>$Z$</tex></formula>] matrices can be smoothly integrated with signal traces and other circuit models of lumped components mounted in the package and on the PCB, so that the system-level signal integrity and power integrity can be simulated efficiently. </para>

Time-domain characterization and circuit modeling of a multilayer ceramic package

The dynamic deconvolution (peeling algorithm) used in the past for single interconnects is extended to multiple-coupled interconnects and used to model high-speed electronic packages. A multilayer ceramic package (MLC) is used as vehicle to demonstrate the characterization and equivalent circuit modeling procedure based on single and multiport time-domain measurement.

Microwave Absorption in NaCl Crystals with Various Controlled Defect Conditions

ABSTRACTA thorough understanding of fundamental microwave absorption mechanisms in ionic crystalline solids is important for microwave sintering of ceramics, as well as the design of high speed electronic packaging, advanced radomes, etc. Of particular importance to these applications are how the density and type of crystalline defects affect the dominant microwave absorption mechanisms. We have designed experiments to measure microwave absorption in NaCl samples with controlled variations in defect conditions(pure, point defects, dislocations and grain boundaries) at different temperatures (20–400 °C) and frequencies (2–20 GHz). Initial results are reported and discussed.