Fuzzy Fine Tuning Therapies for Intelligence of High Speed Electronic Packaging Equipment

Abstract

It’s always difficult to satisfy both strict requirements of dynamic performance and settling performance of high-precision and high-acceleration point-to-point motions on electronic packaging equipment, i.e., Die bonders, Wire bonders, Flip-chip bonders, Wafer bumping machines, and so on. Focusing on this difficulty, Fuzzy logic is promoted in this paper to fine tune feed forward coefficient parameters of motion systems on packaging equipment to satisfy multiple targets of dynamic and settling performance requirements. This intelligent fine tuning approach, with achievable multiple motion targets, provides a therapy to automate and optimize motion system performance on packaging equipment, help on development and mass production of semiconductor packaging equipment, and improve machine intelligence.