When high-intensity aerial ultrasonic waves (with a frequency of approximately 20–50 kHz) are applied to drops of liquid adhering to the surface of an object, the drops instantaneously atomize and peel off from the object and scatter in the air. If extremely strong sound waves (approximately 170 dB(sound pressure level; SPL)) are applied, it is also possible to cause the solid particles remaining on the surface of an object to peel off and scatter in the air. In this report, we describe a study in which we investigated a new method that uses the above-mentioned effects produced by aerial ultrasonic waves to quantitatively evaluate the cleanness, with regard to the particles remaining on their surface, of semiconductor manufacturing jigs that have been precision-cleaned. This method has various features, including (1) it can be conducted without touching the target object, (2) it can be used on a specific area of the object, (3) it does not depend on the shape of the object, and (4) its measurements can be easily carried out.