High Injection Current Densities Research Articles

Unequilibrated Charge Carrier Mobility in Organic Semiconductors Measured Using Injection Metal–Insulator–Semiconductor Charge Extraction by Linearly Increasing Voltage

The charge carrier mobility in tris(4‐carbazoyl‐9‐ylphenyl)amine (TCTA), a host and hole transport material typically used in organic light‐emitting diodes (OLEDs), is measured using charge carrier electrical injection metal–insulator–semiconductor charge extraction by linearly increasing voltage (i‐MIS‐CELIV). By employing the injection current i‐MIS‐CELIV method, charge transport at time scales shorter than the transit times typically observed in standard MIS‐CELIV is measured. The i‐MIS‐CELIV technique enables the experimental measurement of unequilibrated and pretrapped charge carriers. Through a comparison of injection and extraction current transients obtained from i‐MIS‐CELIV and MIS‐CELIV, it is concluded that hole trapping is negligible in evaporated neat films of TCTA within the time‐scales relevant to the operational conditions of optoelectronic devices, such as OLEDs. Furthermore, photocarrier generation in conjunction with i‐MIS‐CELIV (photo‐i‐MIS‐CELIV) to quantify the properties of charge injection from the electrode to the semiconductor of the MIS devices is utilized. Based on the photo‐i‐MIS‐CELIV measurements, it is observed that the contact resistance does not limit the injection current at the TCTA/molybdenum oxide/silver interface. Therefore, when TCTA is employed as the hole transport/electron‐blocking layer in OLEDs, it does not significantly reduce the injection current and remains compatible with the high injection current densities required for efficient OLED operation.

The effects and mechanisms of 2 MeV proton irradiation on high bias conditions of InP/InGaAs DHBTs

In this work, a 2 MeV proton irradiation experiment has been carried out on self-fabricated InP/InGaAs heterojunction bipolar transistors (HBTs) with fluence of 5 × 1013 H+/cm2 and 1 × 1014 H+/cm2. The degradation and mechanisms have systematically been studied under different bias conditions. The irradiated InP-based HBTs have suffered more sever degradation at low and high bias voltages with larger damage coefficient of current gain (Kβ), due to the increased base recombination current and the slacken collector current respectively. Under high injection current densities, the slow-down of collector current and the collapse of current gain (β) have occurred at increasingly smaller biases as irradiation fluence increases. Consistently, the ideality factor of base current collapses to 1 at high injection current, moreover, the collapse point decreases as fluence increases. The aggravated degradation at high current densities is attributed to the influence of heterojunction barrier effect (HBE) by the structure of the multi-layer collector region. The study would be of great significance for optimizing the device structure and improving the irradiation tolerance.

Realizing high injection current density up to 200 kA-cm−2 in electrically pumped AlGaN ultraviolet laser diodes on c-Sapphire substrate

Previously, we attempted to the optically-pumped AlGaN ultraviolet (UV) laser diodes (LDs) on AlN template on c-Sapphire substrate, using low-cost epitaxial growth technique in low-pressure metalorganic vapor-phase epitaxy (LP-MOVPE). As a result, stimulated lasing spectra at 274 nm were observed for the first time at room temperature (RT) in the optically pumped LD. However, the electrically-pumped AlGaN-based (270–298 nm)-band UV LD was quite challenging due to both the issue of low injection current density and light confinement factor (Г). In this paper, the injection current density in the electrically pumped AlGaN UV LD at 283 nm emission was remarkably improved up to 200 kA-cm−2 by using undoped Al-graded cladding and Al-graded Mg-doped p-AlGaN hole source layer (HSL). Also, some weak oscillation at 296 nm near to the main spontaneous emission peak of 298 nm-band LD under the 600 mA (24 V) current using pulse width of 50 ns at RT was observed. To further improve the lasing phenomenon, some theoretical studies was conducted, by making the p-side waveguide (p-WG) layer non-doped (Mg = 0) and also increasing the quantum-well (QW) thickness from 2 nm to 4 nm in the multiquantum-wells (MQWs). Consequently, the optical-loss was significantly reduced from 22.7 to 8.7 cm−1 and the Г was enhanced from 1.77% (Experimental LD) to 4.65% (simulated LD).

High-efficiency InGaN red micro-LEDs for visible light communication

In this study, we present a high-efficiency InGaN red micro-LED fabricated by the incorporation of superlattice structure, atomic layer deposition passivation, and a distributed Bragg reflector, exhibiting maximum external quantum efficiency of 5.02% with a low efficiency droop corresponding to an injection current density of 112 A / cm 2 . The fast carrier dynamics in the InGaN is characterized by using time-resolved photoluminescence, which is correlated to a high modulation bandwidth of 271 MHz achieved by a 6 × 25-μm-sized micro-LED array with a data transmission rate of 350 Mbit/s at a high injection current density of 2000 A / cm 2 . It holds great promise for full-color micro-displays as well as high-speed visible light communication applications based on monolithic InGaN micro-LED technologies.

High Injection Current Density Up to 200 Ka-Cm-2 in Electrically Pumped Algan Ultraviolet Laser Diodes on C-Sapphire Substrate

High Injection Current Density Up to 200 Ka-Cm-2 in Electrically Pumped Algan Ultraviolet Laser Diodes on C-Sapphire Substrate

Implantation energy- and size-dependent light output of enhanced-efficiency micro-LED arrays fabricated by ion implantation.

A new process is presented for fabricating enhanced-efficiency micro-pixelated vertical-structured light-emitting diode (µVLED) arrays based on ion-implantation technology. High-resistivity selective regions are locally introduced in the n-GaN layer by ion implantation and then used as effective and non-destructive electrical isolation for realizing µVLED arrays with ultra-small pixel diameters. The implantation energy-dependent and size-dependent opto-electrical characteristics of fluorine (F-) implanted µVLED arrays are investigated systematically. The results show that the optimally designed F- ion implantation not only can achieve smaller reverse leakage current but also can realize ion-induced thermal relaxation effectively and is more suited for fabricating high-resolution µVLED arrays with higher optical output power. For the F--implanted µVLED array with pixel diameters of 10 µm, a measured output power density reaches a value of 82.1 W cm-2 at a high injection current density of 220 A cm-2, before power saturation. Further, the output power densities and external quantum efficiencies of F--implanted µVLED arrays with pixel diameters less than 10µm show strong dependences on pixel size due to the presence of defects-related SRH process. So, the high-efficiency µVLED arrays with ultra-small pixel sizes could be fabricated by an appropriately designed ion implantation combined with control of defect densities to meet the industrial requirement of microdisplay applications.

Heavily Si-doped pulsed sputtering deposited GaN for tunneling junction contacts in UV-A light emitting diodes

We report the characteristics of heavily Si-doped GaN prepared by pulsed sputtering deposition (PSD) and its application as tunneling junction (TJ) contacts for nitride-based light-emitting diodes (LEDs). We determined that the use of PSD allows us to grow extremely heavily Si-doped wurtzite GaN epitaxial layers with [Si] = 1.0 × 1021 cm−3 on commercially available UV-A LED wafers. Then, we processed these samples into LED structures to investigate their device characteristics as TJ-contact LEDs. Compared to commercially available UV-A LEDs with transparent conductive oxide contacts, TJ-contact LEDs with [Si] = 1.0 × 1021 cm−3 at the tunnel-junction interface showed lower differential resistance and, consequently, worked well under a high injection current density of ∼1 kA/cm2 without any degradation. These results indicate that PSD-grown heavily doped n-type GaN is promising for application as a TJ-contact in group III nitride-based optoelectronic devices.

Direct Epitaxial Approach to Achieve a Monolithic On-Chip Integration of a HEMT and a Single Micro-LED with a High-Modulation Bandwidth.

Visible light communications (VLC) require III-nitride visible micro-light-emitting diodes (μLEDs) with a high-modulation bandwidth. Such μLEDs need to be driven at a high injection current density on a kA/cm2 scale, which is about 2 orders of magnitude higher than those for normal visible LED operation. μLEDs are traditionally fabricated by dry-etching techniques where dry-etching-induced damages are unavoidable, leading to both a substantial reduction in performance and a great challenge to viability at a high injection current density. Furthermore, conventional biasing (which is simply applied across a p–n junction) is good enough for normal LED operation but generates a great challenge for a single μLED, which needs to be modulated at a high injection current density and at a high frequency. In this work, we have proposed a concept for an epitaxial integration and then demonstrated a completely different method that allows us to achieve an epitaxial integration of a single μLED with a diameter of 20 μm and an AlGaN/GaN high-electron-mobility transistor (HEMT), where the emission from a single μLED is modulated by tuning the gate voltage of its HEMT. Furthermore, such a direct epitaxial approach has entirely eliminated any dry-etching-induced damages. As a result, we have demonstrated an epitaxial integration of monolithic on-chip μLED-HEMT with a record modulation bandwidth of 1.2 GHz on industry-compatible c-plane substrates.

High-Brightness Nanosecond-Pulse Operation From Tapered-Ridge-Waveguide Lasers

Carrier-induced anti-guiding effects emerging at extremely high injection current densities under short-pulse operation necessitate lateral-waveguide design considerations, that differ from those required when continuous-wave operation is desired. Here, we investigate variations of the lateral index-guiding trench design to achieve an excellent brightness value of 27.4 Wmm−1mrad−1 from tapered-ridge-waveguide lasers with more than 18 W output power under 3.3 ns long pulse operation.

Directly modulated membrane lasers with 108 GHz bandwidth on a high-thermal-conductivity silicon carbide substrate

Increasing the modulation speed of semiconductor lasers has attracted much attention from the viewpoint of both physics and the applications of lasers. Here we propose a membrane distributed reflector laser on a low-refractive-index and high-thermal-conductivity silicon carbide substrate that overcomes the modulation bandwidth limit. The laser features a high modulation efficiency because of its large optical confinement in the active region and small differential gain reduction at a high injection current density. We achieve a 42 GHz relaxation oscillation frequency by using a laser with a 50-μm-long active region. The cavity, designed to have a short photon lifetime, suppresses the damping effect while keeping the threshold carrier density low, resulting in a 60 GHz intrinsic 3 dB bandwidth (f3dB). By employing the photon–photon resonance at 95 GHz due to optical feedback from an integrated output waveguide, we achieve an f3dB of 108 GHz and demonstrate 256 Gbit s−1 four-level pulse-amplitude modulations with a 475 fJ bit−1 energy cost of the direct-current electrical input. Directly modulated membrane distributed reflector lasers are fabricated on a silicon carbide platform. The 3 dB bandwidth, four-level pulse-amplitude modulation speed and operating energy for transmitting one bit are 108 GHz, 256 Gbit s−1 and 475 fJ, respectively.

Size-dependent optical-electrical characteristics of blue GaN/InGaN micro-light-emitting diodes.

To derive the impact of chip size reduction on optical efficiency in micro-LED array panels, blue InGaN/GaN LEDs, which consist of 21×7 arrays (60 ppi display) with different mesa sizes on sapphire substrates, are designed and fabricated in this study. Changing the mesa area of the chip is first proposed to investigate the luminous efficiency (cd/A) of the screen. The current efficiency with a peak wavelength of 450 nm reaches up to 14.29 cd/A for the biggest pixel 50µm×60µm and to 12.25 cd/A for the 15µm×25µm chip, delivering high-level efficiencies to the current LED research field. The mechanisms of size-dependent efficiency variation trends and efficiency droops of blue LEDs are investigated experimentally, confirming that the current efficiency is more efficient at high injection current density while exhibiting poorer performance at the low current density region for smaller chips. The peak efficiency corresponds to higher current density with a decrease in chip size according to the carrier recombination ABC model. Moreover, the characteristic curve of the spectrum and the changes in the yellow light band under different incident light conditions (i.e., 355 nm and 375 nm) are analyzed by photoluminescence.

Suppressing Efficiency Roll-Off at High Current Densities for Ultra-Bright Green Perovskite Light-Emitting Diodes.

Perovskite light-emitting diodes (PeLEDs) have undergone rapid development in the last several years with external quantum efficiencies (EQEs) reaching over 21%. However, most PeLEDs still suffer from severe efficiency roll-off (droop) at high injection current densities, thus limiting their achievable brightness and presenting a challenge to their use in laser diode applications. In this work, we show that the roll-off characteristics of PeLEDs are affected by a combination of charge injection imbalance, nonradiative Auger recombination, and Joule heating. To realize ultrabright and efficient PeLEDs, several strategies have been applied. First, we designed an energy ladder to balance the electron and hole transport. Second, we optimized perovskite materials to possess reduced Auger recombination rates and improved carrier mobility. Third, we replaced glass substrates with sapphire substrates to better dissipate joule heat. Finally, by applying a current-focusing architecture, we achieved PeLEDs with a record luminance of 7.6 Mcd/m2. The devices can be operated at very high current densities (J) up to ∼1 kA/cm2. Our work suggests a broad application prospect of perovskite materials for high-brightness LEDs and ultimately a potential for solution-processed electrically pumped laser diodes.

Operating behavior of micro-LEDs on a GaN substrate at ultrahigh injection current densities.

Near-ultraviolet micro-LEDs with different diameters were fabricated on GaN substrates. The electroluminescence and the light output power-current density and current density-voltage relationships were measured. A saturated current density of 358 kA/cm2 was achieved with a 20 µm LED. The ideality factor curves showed steps and peaks when the injection current density was increased from 20 to 150 kA/cm2 and an abnormal efficiency increase. The transport and recombination processes of micro-LEDs at high injection current densities were simulated, and the many-body effect and phase space filling in the integrated quantum drift-diffusion model were considered. Serious current crowding was observed above 100 kA/cm2, even for the 20 µm LED.

Fabrication and characterization of a germanium nanowire light emitting diode

In this letter, we demonstrate the feasibility of a germanium nanowire light emitting diode as a reasonable approach for downscaling of CMOS compatible light sources. We show room-temperature direct bandgap electroluminescence from axial p-n junction nanowire devices. The electron population in the Γ valley, necessary for direct bandgap emission, is achieved by high injection current densities. Carrier temperature is consistently found to be higher than the lattice temperature, indicating inhibited carrier cooling in small diameter wires. Strong polarization of the emission parallel to the nanowire axis is observed and attributed to dielectric contrast phenomena.

A Review on Experimental Measurements for Understanding Efficiency Droop in InGaN-Based Light-Emitting Diodes

Efficiency droop in GaN-based light emitting diodes (LEDs) under high injection current density perplexes the development of high-power solid-state lighting. Although the relevant study has lasted for about 10 years, its mechanism is still not thoroughly clear, and consequently its solution is also unsatisfactory up to now. Some emerging applications, e.g., high-speed visible light communication, requiring LED working under extremely high current density, makes the influence of efficiency droop become more serious. This paper reviews the experimental measurements on LED to explain the origins of droop in recent years, especially some new results reported after 2013. Particularly, the carrier lifetime of LED is analyzed intensively and its effects on LED droop behaviors are uncovered. Finally, possible solutions to overcome LED droop are discussed.

Epitaxy and characterization of GaInP/AlInP light-emitting diodes on As-doped Ge/Si substrates.

We investigate the impact of threading dislocation density (TDD) and thermal conductivity of substrates on the performance of GaInP/AlInP light-emitting diodes (LEDs) for the integration of III-V optoelectronics on Si. We utilized an arsenic (As) doped Ge/Si substrate that showed a reduced TDD compared to undoped Ge/Si. Compared to LEDs on undoped Ge/Si, the leakage current density for LEDs on As-doped Ge/Si substrate is reduced by four orders of magnitude and the light output is increased six-fold. An increased junction temperature causes light output saturation for LEDs on bulk Ge at high injection current densities. The light output of LEDs on As-doped Ge/Si shows good linearity with injection current density and its junction temperature is ~25 ± 5 °C lower than that of LEDs on bulk Ge at high injection current densities due to better thermal conductivity of the Ge/Si substrate.

Evolution of crystal imperfections during current-stress ageing tests of green InGaN light-emitting diodes

We perform ageing tests under high current on several green InGaN light-emitting diodes and compare the luminous homogeneities of chip surfaces, shapes of external quantum efficiency (EQE) curves, and electroluminescence spectra during different ageing stages. By curve fittings to the EQE curves, with the ABC and two-level models, we discover that a high injection current density can modify the defect configuration in quantum wells even at room temperature, as high-temperature annealing can. For In-rich devices, the removal of localization centers is another origin of luminous intensity decay in addition to the formation of point defects.

A modified ABC model in InGaN MQW LED using compositionally step graded Alternating Barrier for efficiency improvement

In this paper, Multiple Quantum Well (MQW) Light-Emitting Diodes (LEDs) with compositionally step graded (CSG) Alternating Barriers (AB) of InGaN-AlGaN with p-doped GaN barrier is designed and analysed. The improved crystal structure and modified band bending in the device enhances the carrier confinement and diminishes the polarization-related efficiency reduction. Furthermore, the good crystalline quality increases the hole injection and transportation; this significantly improves the radiative recombination rate and reduces the non-radiative recombination as well as carrier leakage out of the active region. Simulation result show mitigated efficiency droop of 3% and light output power of 1500 mW at the injection current of 500 mA. A modified ABC model is also developed to model the carrier leakage mechanism at high injection current density. In the model, total carrier leakage currents from the active region due to thermionic emission and electron overflow at high injection current are considered. Also, the obtained result of the modelled conventional LED shows a good fit with experimental data. Moreover, the SiC substrate technology in the design is attributed with improved crystal structure, reduced polarization effect and thermal conductivity, which improve the optical performance of the device.

Superluminescent diode with a broadband gain based on self-assembled InAs quantum dots and segmented contacts for an optical coherence tomography light source

We report a broadband-gain superluminescent diode (SLD) based on self-assembled InAs quantum dots (QDs) for application in a high-resolution optical coherence tomography (OCT) light source. Four InAs QD layers, with sequentially shifted emission wavelengths achieved by varying the thickness of the In0.2Ga0.8As strain-reducing capping layers, were embedded in a conventional p-n heterojunction comprising GaAs and AlGaAs layers. A ridge-type waveguide with segmented contacts was formed on the grown wafer, and an as-cleaved 4-mm-long chip (QD-SLD) was prepared. The segmented contacts were effective in applying a high injection current density to the QDs and obtaining emission from excited states of the QDs, resulting in an extension of the bandwidth of the electroluminescence spectrum. In addition, gain spectra deduced with the segmented contacts indicated a broadband smooth positive gain region spanning 160 nm. Furthermore, OCT imaging with the fabricated QD-SLD was performed, and OCT images with an axial resolution of ∼4 μm in air were obtained. These results demonstrate the effectiveness of the QD-SLD with segmented contacts as a high-resolution OCT light source.

High‐power LEDs using Ga‐doped ZnO current‐spreading layers

The performance of LEDs with Ga-doped ZnO (Ga:ZnO) and Sn-doped In2O3 (ITO) current-spreading layers (CSLs) has been evaluated at high injection current densities. LEDs with electron beam-hydrothermally deposited Ga:ZnO transparent CSLs showed improved performance compared to electron beam deposited ITO at all current densities. External quantum efficiency and wall plug efficiency were both higher for blue emitting LEDs with ZnO. Luminous efficacy increased greatly for the ZnO-based CSL with a peak value of 113 lm/W compared to 82 lm/W for the ITO-based CSL, a 37% improvement.