High Electron Mobility Transistor Devices Research Articles

Optimizing electrical and thermal performance in AlGaN/GaN HEMT devices using dual‐metal gate technology

AbstractThe investigation of aluminum gallium nitride/gallium nitride high electron mobility transistor (AlGaN/GaN HEMT) devices with a dual‐metal gate (DMG) structure encompasses both electrical and thermal characteristics. As efforts to enhance heat dissipation progress, there is a concurrent exploration of novel semiconductor materials boasting high thermal conductivity, like boron arsenide and phosphide. Combining these materials into a model and measuring their interface achieves efficient energy transport. Minimizing the self‐heating impact in AlGaN/GaN HEMTs is essential for enhancing device efficiency. This research exposes the heterogenous combination of boron arsenide and phosphide cooling substrates with metals, GaN semiconductors and HEMT. In this research, the autoencoder deep neural network techniques in GaN HEMT for self‐heat reduction is driven by the ability to effectively analyze and model the thermal behavior of the device. Autoencoders learn complex relationships within temperature data and identify patterns associated with self‐heating. By leveraging these learned representations, the deep neural network optimizes control strategies to mitigate self‐heating effects in GaN HEMT devices, ultimately contributing to improved thermal management and enhanced overall performance. In this research, the use of genetic algorithms in GaN HEMT aims to optimize device parameters systematically, to minimize self‐heating effects and enhance overall thermal performance. The structure also enhances electron mobility within the channel. Results show DMG structures, exhibiting higher saturation output currents and transconductance despite self‐heating. The DMG exhibits a maximum gm value of 0.164 S/mm, which is 10% higher significantly enhancing GaN‐based HEMTs for improved reliability and efficiency in various applications.

Understanding of multi-way heat extraction using peripheral diamond in AlGaN/GaN HEMT by electrothermal simulations

Abstract High power operation of high electron mobility transistors (HEMTs) is limited due to a variety of thermal resistances in the HEMT device causing self-heating effects (SHEs) in the device. To reduce the SHEs, diamond heat spreaders integrated to the device have proven efficient for heat extraction from the device. In this report using electro-thermal TCAD simulations, we demonstrate an understanding of multiway heat extraction utilizing diamond heat spreaders for improving HEMT thermal performance at high DC output power density
(~40 W/mm). The impact of each heat extraction pathway is understood while considering the thermal boundary resistance between Diamond/GaN hetero-interface and optimization of the GaN buffer layer thickness. Using these findings, we simulated an AlGaN/GaN HEMT device operating at 40 W/mm DC output power while maintaining device temperature at approximately 470 - 500 K.

Automatic in-situ measurement of thermal resistance for GaN HEMTs

An automatic in-situ technique for thermal resistance measurement based on an electrical method is proposed in this paper. In contrast to the conventional thermal resistance measurement circuits of the electrical method, this method involves direct measurement of the thermal resistance of GaN high-electron-mobility transistor (HEMT) devices in an operating circuit by introducing a well-matched radio-frequency switching circuit into the operating circuit. The advantage of this method is that the thermal resistance can be measured periodically on the in-situ device without changing the electrical characteristics of the device. Based on this result, the cooling curve of the HEMT device in the power amplifier (PA) circuit is collected and the thermal resistance characteristics of the HEMT are determined via the structure function method. The purpose of this paper is to successfully obtain the thermal resistance of in-situ devices through an automatic in-situ measurement circuit of thermal resistance, and to verify the feasibility of periodic detection of thermal resistance of in-situ devices.

Low-resistance TiAl3/Au ohmic contact and enhanced performance on AlGaN/GaN HEMT

The advent of an era characterized by intelligent, interconnected systems of AlGaN/GaN High Electron Mobility Transistors (HEMTs) electronic devices is underway. Within this context, the performance of ohmic contacts in HEMTs bears substantive influence on the electrical characteristics of power devices, notably impacting parameters such as on-resistance and output current. Therefore, the improvement of ohmic contacts attributes in AlGaN/GaN HEMT devices has perennially constituted a focal point of considerable industry. Based on the AlGaN/GaN heterostructure, a novel TiAl3/Au ohmic contact has been successfully developed for HEMTs. A low contact resistance of 0.23 Ω·mm (2.33 × 10-6 Ω·cm2) is obtained, which proposes a new interface contact for AlGaN/GaN heterojunction. Transmission electron microscope (TEM) illustrates that the contact mechanism for low resistance is direct contact with two-dimensional electron gas (2DEG) through the substitution of the TiN compound with a smaller area Au dominated penetration. Concurrently, in contrast to TiN, Au exhibits a diminished capacity for Ga dissolution, thereby substantiating its efficacy in preserving the structural integrity of the crystal lattice. In addition, the reduction of Al can impede the diffusion notably, further showing the smooth surface morphology of the electrode with atomic force microscope (AFM) and scanning electron microscopy (SEM) measurements. The ohmic contacts of HEMTs are individually fabricated with Ti/Al/Ni/Au and TiAl3/Au configurations. The HEMTs with TiAl3/Au ohmic contacts demonstrate superior DC characteristics.

Temperature-induced degradation of GaN HEMT: An in situ heating study

High-power electronics, such as GaN high electron mobility transistors (HEMTs), are expected to perform reliably in high-temperature conditions. This study aims to gain an understanding of the microscopic origin of both material and device vulnerabilities to high temperatures by real-time monitoring of the onset of structural degradation under varying temperature conditions. This is achieved by operating GaN HEMT devices in situ inside a transmission electron microscope (TEM). Electron-transparent specimens are prepared from a bulk device and heated up to 800 °C. High-resolution TEM (HRTEM), scanning TEM (STEM), energy-dispersive x-ray spectroscopy (EDS), and geometric phase analysis (GPA) are performed to evaluate crystal quality, material diffusion, and strain propagation in the sample before and after heating. Gate contact area reduction is visible from 470 °C accompanied by Ni/Au intermixing near the gate/AlGaN interface. Elevated temperatures induce significant out-of-plane lattice expansion at the SiNx/GaN/AlGaN interface, as revealed by geometry-phase GPA strain maps, while in-plane strains remain relatively consistent. Exposure to temperatures exceeding 500 °C leads to almost two orders of magnitude increase in leakage current in bulk devices in this study, which complements the results from our TEM experiment. The findings of this study offer real-time visual insights into identifying the initial location of degradation and highlight the impact of temperature on the bulk device’s structure, electrical properties, and material degradation.

Damage Effects and Mechanisms of High-Power Microwaves on Double Heterojunction GaN HEMT

In this paper, simulation modeling was carried out using Sentaurus Technology Computer-Aided Design. Two types of high electron mobility transistors (HEMT), an AlGaN/GaN/AlGaN double heterojunction and AlGaN/GaN single heterojunction, were designed and compared. The breakdown characteristics and damage mechanisms of the two devices under the injection of high-power microwaves (HPM) were studied. The variation in current density and peak temperature inside the device was analyzed. The effect of Al components at different layers of the device on the breakdown of HEMTs is discussed. The effect and law of the power damage threshold versus pulse width when the device was subjected to HPM signals was verified. It was shown that the GaN HEMT was prone to thermal breakdown below the gate, near the carrier channels. A moderate increase in the Al component can effectively increased the breakdown voltage of the device. Compared with the single heterojunction, the double heterojunction HEMT devices were more sensitive to Al components. The high domain-limiting characteristics effectively inhibited the overflow of channel electrons into the buffer layer, which in turn regulated the current density inside the device and improved the temperature distribution. The leakage current was reduced and the device switching characteristics and breakdown voltage were improved. Moreover, the double heterojunction device had little effect on HPM power damage and high damage resistance. Therefore, a theoretical foundation is proposed in this paper, indicating that double heterojunction devices are more stable compared to single heterojunction devices and are more suitable for applications in aviation equipment operating in high-frequency and high-voltage environments. In addition, double heterojunction GaN devices have higher radiation resistance than SiC devices of the same generation.

Impact of Carbon Doping on Vertical Leakage Current in AlGaN‐Based Buffer Layer Grown on Silicon Substrate

The buffer leakage phenomena have a large effect on high‐power and fast‐switching GaN high electron mobility transistor devices. Herein, the buffer leakage mechanism in a GaN‐on‐Si substrate with AlGaN buffer layers is investigated by using samples with various carbon concentrations. Comparing the leakage current with crystallinity and impurity concentration, it is found that the vertical leakage current is dominated by both threading dislocations and bulk impurities. Increasing the carbon concentration of buffer layers suppresses leakage current in the bulk conducting regime in high electric fields but increases it in the dislocation conducting regime in low electric fields. These results indicate that the optimal carbon concentration of buffer layers depends on the target electric field.

Investigation of RF performance of Ku-band GaN HEMT device and an in-depth analysis of short channel effects

In this paper, we have characterized an AlGaN/GaN High Electron Mobility Transistor (HEMT) with a short gate length (Lg ≈ 0.15 μm). We have studied the effect of short gate length on the small signal parameters, linearity parameters and gm-gd ratio in GaN HEMT devices. To understand how scaling results in the variation of the above-mentioned parameters a comparative study with higher gate length devices on similar heterostructure is also presented here. We have scaled down the gate length but the barrier thickness(tbar) remained same which affects the aspect ratio (Lg/tbar) of the device and its inseparable consequences are the prominent short channel effects (SCEs) barring the optimum output performance of the device. These interesting phenomena were studied in detail and explored over a temperature range of −40 °C to 80 °C. To the best of our knowledge this paper explores temperature dependence of SCEs of GaN HEMT for the first time. With an approach to reduce the impact of SCEs a simulation study in Silvaco TCAD was carried out and it is observed that a recessed gate structure on conventional heterostructure successfully reduces SCEs and improves RF performance of the device. This work gives an overall view of gate length scaling on conventional AlGaN/GaN HEMTs.

Performance improvement of enhancement-mode GaN-based HEMT power devices by employing a vertical gate structure and composite interlayers*

In this work, p-n junction vertical gate (JVG) and polarization junction vertical gate (PVG) structures are for the first time proposed to improve the performance of GaN-based enhancement-mode (E-mode) high electron mobility transistor (HEMT) devices. Compared with the control group featuring the vertical gate structure, a highly improved threshold voltage (V th) and breakdown voltage (BV) are achieved with the assistance of the extended depletion regions formed by inserting single or composite interlayers. The structure dimensions and physical parameters for device interlayers are optimized by TCAD simulation to adjust the spatial electric field distribution and hence improve the device off-state characteristics. The optimal JVG-HEMT device can reach a V th of 3.4 V, a low on-state resistance (R on) of 0.64 mΩ cm2, and a BV of 1245 V, while the PVG-HEMT device exhibits a V th of 3.7 V, an R on of 0.65 mΩ cm2, and a BV of 1184 V, which could be further boosted when an additional field plate design is employed. Thus, the figure-of-merit value of JVG- and PVG-HEMT devices rise to 2.4 and 2.2 GW cm−2, respectively, much higher than that for the VG-HEMT control group (1.0 GW cm−2). This work provides a novel technical approach to realize higher-performance E-mode HEMTs.

Revolutionizing Fe doped back barrier AlGaN/GaN HEMTs: Unveiling the remarkable 1700V breakdown voltage milestone

This research investigates the enhanced device breakdown capabilities of silicon-based AlGaN/GaN High Electron Mobility Transistors (HEMT). By incorporating various back barrier materials, a significant improvement in peak electric field and breakdown voltage is observed. Specifically, the integration of iron (Fe) doping into the Gallium Nitride (GaN) back barrier layer, combined with different back barrier materials such as Aluminum Gallium Nitride (AlGaN) and Indium Gallium Nitride (InGaN), results in an impressive increase of up to 1700 V. This improvement is attributed to the reduction of peak electric field at the gate edge. The optimized layer configurations significantly contribute to the overall performance of silicon substrate GaN HEMT devices, making them promising candidates for high-voltage applications in electric vehicles and high-power applications.

Improvement of AlGaN/ GaN based HEMT with high performance rate for integrated circuit design for wide range of applications

In the current research work, we focused on the design and analysis of a semiconductor device called High-Elec-tron-Mobility Transistor (HEMT) based on the AlGaN/GaN material system. An Aluminum Nitride spacer,Layer of Nucle-ation along with cap as a AlGaN and barrier of GaN with the channel of AlGaN are incorporated to enhance HEMT device performance.The electrical characteristics of the proposed HEMT are an-alyzed. The Drain Current is found to be 0.18A/mm, indicating the device's ability to handle high current levels. The Electron Concentration is observed to have a maximum value of -96.12electrons/cm3 and varying based on the position in the channel for GaN Barrier thickness is 0.15mm. In the analysis of AC such as Gain of the Maximum Unilateral Power is deter-mined to be 83.41dB, indicating the ability of the device to am-plify signals. The Y-parameters, which characterize the de-vice's behavior at various frequencies of operation, are also de-termined. The capacitance between the electrode region Gate-Source (CGSMIN) is found to be 1.70×10^-11 F/mm, and alike The Capacitance between the electrode region the Gate-Drain Ca-pacitance (CGDMIN) is determined to be 4.7×10^-12 F/mm. Fur-thermore, an Electric Field of 96.51×10^3 V/mm is observed, in-dicating the strength of the electric field across the device. For HEMT device the simulation,The TCAD Silvaco software is be-ing practiced.

In-situ S/TEM DC biasing of p-GaN/AlGaN/GaN heterostructure for E-mode GaN HEMT devices

This work describes an in-situ electrical DC bias study of the E-mode GaN high electron mobility transistor (HEMT) device. A single transistor structure is biased and studied in real-time. The sample was made from an E-mode GaN HEMT device using Focused Ion Beam (FIB) milling and upright lift-off. The device lamella is subjected to forward gate bias to understand the device operation and physical changes under the bias. Active device area and micron level changes due to biasing were studied and identified as crucial factors affecting device reliability during continuous operation. Electric bias-induced physical changes are observed at the p-GaN layer and AlGaN interface on the p-GaN and GaN sides. Localized damage and defect formation, along with elemental diffusion, is observed. The formation of new defects over existing growth defects was seen in the p-GaN/AlGaN/GaN heterostructure. The study helped us identify the exact location of the failure, the region affected under bias, and the occurrence of physical changes due to the electrical bias on the in-situ device. Based on the study, gate breakdown failure and its location at the metal/p-GaN interface are understood to result from physical changes activated by electrical bias.

Research on the Reliability of Threshold Voltage Based on GaN High-Electron-Mobility Transistors.

With the development of high-voltage and high-frequency switching circuits, GaN high-electron-mobility transistor (HEMT) devices with high bandwidth, high electron mobility, and high breakdown voltage have become an important research topic in this field. It has been found that GaN HEMT devices have a drift in threshold voltage under the conditions of temperature and gate stress changes. Under high-temperature conditions, the difference in gate contact also causes the threshold voltage to shift. The variation in the threshold voltage affects the stability of the device as well as the overall circuit performance. Therefore, in this paper, a review of previous work is presented. Temperature variation, gate stress variation, and gate contact variation are investigated to analyze the physical mechanisms that generate the threshold voltage (VTH) drift phenomenon in GaN HEMT devices. Finally, improvement methods suitable for GaN HEMT devices under high-temperature and high-voltage conditions are summarized.

Third generation semiconductor device research: Optimizing CMOS and HEMT designs

The third-generation semiconductor device known as High Electron Mobility Transistors (HEMT) has found extensive applications in high-frequency and high-speed electronic systems. Its widespread usage in critical technologies such as radio telescopes, satellite broadcast receivers, and cellular base stations has established HEMT as a foundational technology underpinning our information and communication society. This paper provides an in-depth exploration of these semiconductor advancements. Firstly, the paper utilizes the CMOS inverter as a representative example to elucidate the fundamental structure of Complementary Metal-Oxide-Semiconductor (CMOS) technology. Additionally, it employs Gallium Arsenide (GaAs) HEMT as an illustrative instance to expound upon the architecture of HEMT devices. Furthermore, the paper delves into the optimization of CMOS technology, focusing on topics such as Multi-Threshold CMOS and the impact of the Width/Length (W/L) ratio. These discussions shed light on ways to enhance the performance of CMOS-based components. Additionally, the paper explores strategies to optimize HEMT devices, including the introduction of carbon doping and the application of the Grey-Wolf optimization technique. These approaches are critical in achieving higher efficiency and performance in HEMT-based applications.

Morphological and electrical characterization of gate recessed AlGaN/GaN high electron mobility transistor device by purge-free atomic layer etching

An atomic layer etching (ALE) process without purge has been developed for gate recess etching of AlGaN/GaN high electron mobility transistors (HEMTs). The process consists of repeating ALE cycles where Cl2/BCl3 plasma modifies the surface by chemisorption. The modified layer is removed by the subsequential Ar ion removal step. In this manner, AlGaN/GaN HEMTs with three different gate recess etching depths of (7.3 ± 0.5), (13.6 ± 0.5), and (21.0 ± 0.5) nm were fabricated. The determined etch per cycle (EPC) of ∼0.5 nm corresponding to one unit cell in the c-direction of GaN was constant for all recesses, illustrating the precision and controllability of the developed ALE process. The root-mean-square surface roughness was 0.3 nm for every etching depth, which corresponds to the roughness of the unetched reference. The electrical measurements show a linear dependence between threshold voltage (Vth) and etching depth. An enhancement mode (E-mode) HEMT was successfully achieved. A deeper gate recess than 20 nm leads to an increased channel resistance, lower saturation current, and higher gate leakage. Hence, a compromise between the desired Vth shift and device performance has to be reached. The achieved results of electrical and morphological measurements confirm the great potential of recess etching using the ALE technique with precisely controlled EPC for contact and channel engineering of AlGaN/GaN HEMTs.

Phonon transport across rough AlGaN/GaN interfaces with varying Al–Ga atomic ratios

Exploring interfacial thermal transport of a heterojunction interface is crucial to achieving advanced thermal management for gallium nitride-based high electron mobility transistor devices. The current research primarily focuses on material enhancements and microstructure design at the interfaces of epitaxial layers, buffer layers, and substrates, such as the GaN/SiC interface and GaN/AlN interface. Yet, the influence of different concentrations of Al/Ga atoms and interface roughness on the interfacial thermal conductance (ITC) of AlGaN/GaN interface, the closest interface to the hot spot, is still poorly understood. Herein, we focus on the rough AlGaN/GaN interface and evaluate the changes in ITC under different Al–Ga atomic concentrations and interface roughness using atomistic simulations. When the interface is completely smooth and AlGaN and GaN are arranged according to common polarization characteristic structures, the ITC gradually increases as the proportion of Al atoms decreases. When the proportion of Al atoms is reduced to 20%–30%, the impact of the interface structure on heat transfer is almost negligible. For interface models with different roughness levels, as the interface roughness increases, the ITC drops from 735.09 MW m−2 K−1 (smooth interface) to 469.47 MW m−2 K−1 by 36.13%. The decrease in ITC is attributed to phonon localization induced by rough interfaces. The phonon modes at the interface are significantly different from those in bulk materials. The degree of phonon localization is most pronounced in the frequency range that contributes significantly to heat flux. This work provides valuable physical insights into understanding the thermal transfer behaviors across the rough AlGaN/GaN interfaces.

Study on the Hydrogen Effect and Interface/Border Traps of a Depletion-Mode AlGaN/GaN High-Electron-Mobility Transistor with a SiNx Gate Dielectric at Different Temperatures.

In this study, the electrical characteristics of depletion-mode AlGaN/GaN high-electron-mobility transistors (HEMTs) with a SiNx gate dielectric were tested under hydrogen exposure conditions. The experimental results are as follows: (1) After hydrogen treatment at room temperature, the threshold voltage VTH of the original device was positively shifted from -16.98 V to -11.53 V, and the positive bias of threshold was 5.45 V. When the VDS was swept from 0 to 1 V with VGS of 0 V, the IDS was reduced by 25% from 9.45 A to 7.08 A. (2) Another group of original devices with identical electrical performance, after the same duration of hydrogen treatment at 100 °C, exhibited a reverse shift in threshold voltage with a negative threshold shift of -0.91 V. The output characteristics were enhanced, and the saturation leakage current was increased. (3) The C-V method and the low-frequency noise method were used to investigate the effect of hydrogen effect on the device interface trap and border trap, respectively. It was found that high-temperature hydrogen conditions can passivate the interface/border traps of SiNx/AlGaN, reducing the density of interface/border traps and mitigating the trap capture effect. However, in the room-temperature hydrogen experiment, the concentration of interface/border traps increased. The research findings in this paper provide valuable references for the design and application of depletion-mode AlGaN/GaN HEMT devices.

Fractional order capacitance behavior due to hysteresis effect of ferroelectric material on GaN HEMT devices

AbstractIn recent years, gallium nitride (GaN) high electron mobility transistors (HEMTs) have come to the forefront of the semiconductor industry because of their exceptional performance in both high‐power and high‐frequency utility. Accurate capacitance modeling is crucial to optimize performance and facilitate energy‐efficient electronic circuit design. In order to reflect the complex nature of the aluminum scandium nitride (AlScN) gate capacitance in GaN HEMTs this study investigates the use of the unique Grünwald‐Letnikov model based on fractional order calculus. The proposed model presents a powerful approach to accurately characterize capacitance since fractional order derivatives allow modeling of non‐integer order systems. Quantitative assessment of the Grünwald‐Letnikov model's accuracy is performed through various error metrics, including mean absolute error (MAE), root mean square error (RMSE), maximum percentage error (MPE), mean absolute percentage error (MAPE), and mean squared error (MSE), by comparing the model's predictions to experimental data. Notably, this model demonstrates remarkable consistency in error metrics, with maximum values of MPE = 0.21%, MAE = 0.05%, MAPE = 0.33%, MSE = 0.01%, and RMSE = 0.09% for the forward scan, and MPE = 0.32%, MAE = 0.04%, MAPE = 0.39%, MSE = 0.01%, and RMSE = 0.08% for the backward scan. These metrics affirm the model's precision in capturing the nuanced capacitance characteristics of GaN HEMT devices. Hence, herein for the first time, the novel Grünwald‐Letnikov model, augmented by fractional order calculus, proves to be a robust tool for accurately characterizing GaN HEMT capacitance. Its ability to seamlessly account for the complexities introduced by using ferroelectric material highlights its potential for advancing semiconductor design and optimizing device performance.

High-performance normally off AlGaN/GaN high electron mobility transistor with p-type h-BN cap layer

Normally off AlGaN/GaN high electron mobility transistors (HEMTs) with p-type gates are attracting increasing attention due to their high safety and low power loss in the field of power switching. In this work, to solve the Mg difficult activating problem of the conventional p-GaN gate AlGaN/GaN HEMTs, we propose an advanced design for the normally off AlGaN/GaN HEMT with a p-type hexagonal boron nitride (h-BN) gate cap layer to effectively manipulate the channel transport of the device. The simulation results demonstrate that the p-hBN gate cap HEMTs yield superior performance over conventional p-GaN gate HEMTs in terms of output current and breakdown voltage, which can be attributed to the deeper potential well formation at the AlGaN/GaN interface and more accumulation of holes located at the p-hBN/AlGaN interface. Moreover, we investigate the effect of bandgap variation on device performance, taking into account that the exact bandgap of h-BN remains under debate. Herein, valuable insights into h-BN cap-gate E-mode AlGaN/GaN HEMT devices are provided, which could serve as a useful reference for the future development of robust III-nitride material power electronic devices.

Structural, optical, and electrical characterization and performance comparison of AlGaN/GaN HEMT structures with different buffer layers

AlGaN/GaN high electron mobility transistor (HEMT) structures are promising for high power and high speed electronic applications. The selection of a good buffer structure is crucial for the achievement of high quality HEMT devices. Here, we present a comparative analysis of structural, optical, and electrical properties of AlGaN/GAN HEMT structures with three different buffer configurations: step-graded AlGaN and superlattice-based buffers on Si, and no buffer on SiC substrates. The analysis of structural properties showed that the structure on SiC has better crystal quality. The Analysis also provided an insight of the role superlattice buffer to cut-off the dislocations and enhance the GaN channel crystallinity. Optical and electrical characterizations showed the enhanced 2DEG quality in the superlattice-based structure, due to the better stress management in the top layers. The electronic and optoelectronic quality of the structures were studied by fabricating HEMT and metal-semiconductor-metal photodetector devices. The devices analysis showed that the superlattice based structure outperformed the other two structures with drain current and transconductance of 406.3 mA/mm and 81.5 mS/mm, respectively, as well as photo-to-dark current ratio that is 2–3 orders of magnitude higher than the other two structures, under 325 nm light illumination. The results provide insights into the impact of different buffer configurations on the performance of AlGaN/GaN HEMT structures, suggesting that the superlattice buffer structure is the optimal choice for fabricating high-performance AlGaN/GaN HEMT-based electronics.