Heterojunction Bipolar Transistors Research Articles

Model Parameters and Degradation Mechanism Analysis of Indium Phosphide Hetero-Junction Bipolar Transistors Exposed to Proton Irradiation

The degradation properties of Indium phosphide hetero-junction bipolar transistors (InP HBTs) under proton irradiation are studied and modelled using a compact model for pre-irradiation, post-irradiation, and post-annealing. The variation rates of the model parameters, such as the base–emitter saturation current (ISE) and ideality factor in the ideal region (NE) in the forward Gummel characteristics, the zero-biased capacitance (Cje) and the grading factor (Mjer) in the BE junction capacitance, and the transit time parameter in the base region (Tfb), are analysed to delve into the degradation mechanism induced by proton irradiation. The displacement damage, induced by proton irradiation in the space charge region of the base–emitter junction and in the quasi-neutral bulk base region, is found to be responsible for the decrease in current gain and cut-off frequency. After annealing, the variation rates of the parameters decrease significantly compared to post-irradiation. This suggests that the recombination of unstable defects leads to a slight recovery in the degradation characteristics of InP HBTs after a period of annealing.

Investigation of cryogenic current–voltage anomalies in SiGe HBTs: Role of base–emitter junction inhomogeneities

The deviations of cryogenic collector current–voltage characteristics of SiGe heterojunction bipolar transistors (HBTs) from ideal drift-diffusion theory have been a topic of investigation for many years. Recent work indicates that direct tunneling across the base contributes to the non-ideal current in highly scaled devices. However, cryogenic discrepancies have been observed even in older-generation devices for which direct tunneling is negligible, suggesting that another mechanism may also contribute. Although similar non-ideal current–voltage characteristics have been observed in Schottky junctions and were attributed to a spatially inhomogeneous junction potential, this explanation has not been considered for SiGe HBTs. Here, we experimentally investigate this hypothesis by characterizing the collector current ideality factor and built-in potential of a SiGe HBT vs temperature using a cryogenic probe station. The temperature dependence of the ideality factor and the relation between the built-in potential as measured by capacitance–voltage and current–voltage characteristics are in good qualitative agreement with the predictions of a theory of electrical transport across a spatially inhomogeneous junction. These observations suggest that inhomogeneities in the base–emitter junction potential may contribute to the cryogenic non-idealities. This work helps to identify the physical mechanisms limiting the cryogenic microwave noise performance of SiGe HBTs.

Simple Modeling and Analysis of Total Ionizing Dose Effects on Radio-Frequency Low-Noise Amplifiers

In this study, the degradation characteristics of radio frequency (RF)-low-noise amplifiers (LNA) due to a total ionizing dose (TID) is investigated. As a device-under-test (DUT), sample LNAs were prepared using silicon–germanium (SiGe) heterojunction bipolar transistors (HBTs) as core elements. The LNA was based on a cascode stage with emitter degeneration for narrowband applications. By using a simplified small-signal model of a SiGe HBT, design equations such as gain, impedance matching, and noise figure (NF) were derived for analyzing TID-induced degradations in the circuit-level performance. To study radiation effects in circuits, the SiGe-RF-LNAs fabricated in a commercial 350 nm SiGe technology were exposed to 10-keV X-rays to a total ionizing dose of up to 3 Mrad(SiO2). The TID-induced performance changes of the LNA were modeled by applying degradation to device parameters. In the modeling process, new parameter values after irradiation were estimated based on information in the literature, without direct measurements of SiGe HBTs used in the LNA chip. As a result, the relative contributions of parameters on the circuit metrics were compared, identifying dominant parameters for degradation modeling. For the TID effects on input matching (S11) and NF, the base resistance (RB) and the base-to-emitter capacitance (Cπ) of the input transistor were mostly responsible, whereas the transconductances (gm) played a key role in the output matching (S22) and gain (S21). To validate the proposed approach, it has been applied to a different LNA in the literature and the modeling results predicted the TID-induced degradations within reasonable ranges.

Effect of emitter-base spacer design on the performance of InP/GaAsSb/InP DHBTs grown by MOCVD

Effect of spacer layer design between InP emitter and GaAsSb base in InP/GaAsSb/InP double heterojunction bipolar transistors (DHBTs) grown by MOCVD was investigated. A very thin tensile-strained GaAs layer, or a thin GaInP layer, or combination of both was inserted between InP emitter and GaAsSb base to mitigate Sb segregation and/or eliminate electron pile-up between emitter and base. With a base sheet resistances of ∼1800 ohm sq−1 for all devices, DHBTs with a GaAs spacer, a GaInP spacer and the combination demonstrate a current gain of 24, 49 and 64, respectively. The conduct band discontinuity ΔEc at InP/GaAsSb interfaces and the current blocking effect are effectively eliminated by employing the combination of GaAs and GaInP layers.

Boosting the thermal stability of paralleled GaAs HBTs through temperature-dependent ballasting resistors: A proof-of-concept study

This paper explores the efficacy of base ballasting strategies in enhancing the electrothermal (ET) stability of paralleled InGaP/GaAs heterojunction bipolar transistors (HBTs) for radiofrequency (RF) applications. More specifically, technologically-feasible temperature-dependent base ballasting resistors are proposed as a solution to shift the collapse of current gain to higher power densities. A three-cell test device fabricated through a state-of-the-art process is considered as a simple case study. Extremely accurate DC and AC ET simulations are performed with SPICE to quantify the advantages of the proposed strategy with respect to traditional approaches.

Design and Optimization of a Highly Linear Power Amplifier with Novel Active Bias Circuit in InGaP/GaAs HBT MMIC Technology

This paper introduces a highly linear power amplifier (PA) that utilizes a 2-μm InGaP/GaAs hetero-junction bipolar transistor (HBT) process. As communication systems evolve in complexity, the demands for the linearity and static power consumption of HBT power amplifiers are becoming more stringent. Typically, there exists a trade-off relationship between linearity and static power consumption in the design process. Hence, this paper proposes a novel active bias circuit for HBT power amplifiers, along with its layout design. The proposed active bias circuit consists of a differential pair and a current mirror structure, designed to enhance PA linearity while maintaining low quiescent current. Additionally, a novel layout structure is implemented to achieve thermal coupling between the RF transistors and the active bias, further improving PA linearity. As a result of the implementation of the proposed active bias and layout structure, the PA demonstrates high linearity in both amplitude modulation to phase modulation (AM/PM) and amplitude modulation to amplitude modulation (AM/AM) performance, while simultaneously maintaining a low quiescent current. The three-stage PA prototype achieves notable performance metrics, including a peak gain of 32.6 dB at 5.6 GHz, gain flatness of ±0.5 dB from 5.15 GHz to 5.85 GHz, and P1dB of 32.1 dBm at a quiescent emitter current of 180 mA.

Calculation of GaInSb PNP lateral HBT for complementary bipolar logic technology

In this study, the power consumption and speed of a GaInSb PNP lateral heterojunction bipolar transistor were estimated for applications in complementary bipolar logic circuits. At the supply voltage of 250 mV, the current gain is over 1000, on/off power consumption ratio is approximately 180, and delay time is 2.6 ps. However, the characteristics degrade rapidly at voltages greater than 300 mV, owing to deep saturation and high-level injection.

Investigation of laser-induced single event effect on SiGe BiCMOS low noise amplifiers

With the further development of the complementary metal-oxide-semiconductor (CMOS) technology and the silicon-germanium (SiGe) epitaxy technology, SiGe bipolar CMOS (BiCMOS) low noise amplifiers (LNAs) are widely used in the first level of radio frequency (RF) transceiver system in space. The core part of SiGe BiCMOS LNA is SiGe heterojunction bipolar transistor (SiGe HBT) which naturally possesses excellent temperature characteristic and favorable build-in total ionizing dose and displacement damage resistance without any radiation hardening. However, the single event effect caused by the transient charge collection is the bottleneck problem, restricting its application in space. In this work, laser microbeam experiments were carried out on a SiGe BiCMOS LNA in which the sensitive region of single event effect was located. The experimental results indicate that the transient charge collection of SiGe HBT is the main reason of the single event effect of SiGe BiCMOS LNA. TCAD simulations show that the ionization track caused by ion incident in CMOS region will cross the deep trench isolation (DTI) structure, generate electron-hole pairs in SiGe HBT region and cause transient charge collection. The circuit simulations by ADS show that the peak value of the transient voltage will drop sharply when the SEE pulse transient voltage crosses the capacitor between the first stage and the second stage, which indicates that the capacitor plays an important role in transmitting the transient pulses caused by single event effect. The experimental and simulation results in this work provide technical support for radiation hardening by design (RHBD) of the single event effect of SiGe BiCMOS LNA.

Fabrication and Electrical Characterization of GaAs/GaN Junctions

GaAs/GaN heterojunctions are likely to be an ideal platform for high-frequency/high-output-power electron devices because of excellent electrical properties of GaAs and GaN as well as the similarity in their coefficients of thermal expansion. We have to note, however, that heteroepitaxial growth of GaAs/GaN junctions is quite difficult because of difference in crystal structures (in case of GaAs/wurtzite GaN junctions) and large mismatch in lattice constants (GaAs/zincblende GaN junctions). In this work we fabricate p+-GaAs/n-GaN heterojunctions by bonding GaAs and GaN epi wafers to each other using surface-activated-bonding technologies [1,2], selectively etching off the GaAs substrate used in the epitaxial growth, making ohmic contacts on the exposed surface of GaAs layer, and forming GaAs mesas. Ohmic contacts on the backside of GaN epi wafer are formed before bonding. The junctions are annealed at 400 ℃ in contact formation on GaAs surfaces. The temperature is much lower in comparison with the temperature in a wafer-fusion process of GaAs and GaN (750 ℃), which were reportedly applied for fabricating group-III arsenide/nitride heterojunction bipolar transistors [3]. Observation using cross sectional transmission electron microscope (TEM) of as-bonded and 400-℃ annealed GaAs/GaN interfaces shows that no voids are formed at the GaN/GaAs interfaces by the 400-℃ annealing. We also fabricate n+-GaAs/n-GaN heterojunctions for comparison.We measure the capacitance-voltage characteristics and current-voltage characteristics for reverse-bias voltages of the p+-GaAs/n-GaN and n+-GaAs/n-GaN junctions and find that the characteristics of the two junctions are close to each other, which suggests that the band profiles of GaN layers in the p+-GaAs/n-GaN and n+-GaAs/n-GaN junctions are almost the same, i.e., the Fermi-level pinning occurs at the GaAs/GaN interfaces. More importantly, the reverse-bias characteristics are measured up to -60 V. The reverse-bias voltage corresponds to an electric field of as high as ~2 MV/cm, which is comparable to the breakdown field of GaN (3-4 MV/cm) [4]. We also excite minority electrons in the p+-GaAs layer using a 488-nm Ar laser and successfully observe the photo current due to the transport of minority electrons across the reverse-biased GaAs/GaN interfaces.Acknowledgement: TEM samples were fabricated under the Inter-University Cooperative Research in IMR of Tohoku University. Epi wafers used in the work were provided from Sciocs (present Sumitomo Chemical) Co., Ltd.[1] H. Takagi, et al. Appl. Phys. Lett. 68, 2222 (1996). [2] S. Yamajo, et al., Jpn. J. Appl. Phys. 57, 02BE02 (2018). [3] C. Lian, et al. Appl. Phys. Lett. 91, 063502 (2007). [4] T. Maeda, et al., IEEE Electron Device Lett., 43, 96 (2022).

(Invited) Transistor-Injected Quantum-Cascade Devices: Novel Sources for Mid-Wave Infrared Emission

Quantum Cascade Lasers (QCLs) [1] are important sources for coherent mid-wave infrared (MWIR) light that find widespread use in applications such as molecular spectroscopy, free-space optical communications, and defense countermeasures. These applications demand tunability of emission wavelength and high output powers. The conventional QCL is a two-terminal n-i-n device in which an externally applied bias establishes the necessary electric field in the cascade region for proper alignment of the quantum states, defines the emission wavelength, and also determines the current through the cascade structure. Because QCLs are 2-terminal devices, changing bias directly changes both wavefunction overlap and energy separation. The spectral location and magnitude of the gain peak thus has a strong dependence on applied voltage, impacting the capability to modulate. To overcome these limitations, the transistor-injected quantum-cascade laser (TI-QCL) has been proposed [2]. The TI-QCL is a three-terminal device in which the cascade region is placed within a heterojunction bipolar transistor. In forward-active mode the current injection is controlled by a forward-biased emitter-base junction, and the reverse bias on the base-collector junction is used to control the electric field for alignment of the quantum states. This novel structure enables the decoupling of emission wavelength and output power. This extra control positions the TI-QCL to impact a wide range of applications such as spectroscopy with its wide tunability, and free-space communication with its capability to separately modulate power and frequency.Previously, transistor characteristics and near-infrared (NIR) band-to-band base emission was demonstrated in a GaAs design [3, 4] before moving to an InP-based design [5]. We will review the progress made to push the TI-QCL concept towards full functionality, focusing on InP-based epitaxial designs. A self-consistent Schrodinger-Poisson solver and non-equilibrium Green’s function method is used to aid in the active-region design of the structure, which is optimized for a peak emission wavelength of 8.27 μm as shown in Figure 1 [6]. A wide wavelength tunability from approximately 7.8 μm to 8.8 μm is projected based on computational analysis. The InP-based structure is grown using molecular beam epitaxy by IntelliEpi; a cross-section of the material is depicted in Figure 2. It contains an active-region composed of 30 repeated periods of In0.41Ga0.59As/In0.36Al0.64As strain-balanced superlattice. The devices are fabricated using standard III-V processing. An image of a fabricated TI-QCL bar consisting of a sloped, 20 μm wide emitter mesa and evaporated SiO2 as the passivation layer is depicted in Figure 3. The fabricated devices are diced and cleaved into 2 to 4 mm x 500 μm die and mounted onto In-plated copper mounts followed by wire bonding. The devices are electrically characterized at room temperature, 77 K, and 18 K. Under cryogenic temperatures, the common-base characteristics exhibit negative differential resistance (NDR) in collector current at all emitter injection currents as shown in Figure 4, which signifies tunneling transport through the quantum cascade superlattice region. The base current also exhibits corresponding NDR behavior and switching in the band-to-band NIR light (1.57 m) output from the In0.53Ga0.47As base is experimentally observed when biased in a region where transport through the cascade region is rejected due to quantum state misalignment.

An Accurate Electro-Thermal Coupling Model of a GaAs HBT Device under Floating Heat Source Disturbances.

Taking into consideration the inaccurate temperature predictions in traditional thermal models of power devices, we undertook a study on the temperature rise characteristics of heterojunction bipolar transistors (HBTs) with a two-dimensional cross-sectional structure including a sub-collector region. We developed a current-adjusted polynomial electro-thermal coupling model based on investigating floating heat sources. This model was developed using precise simulation data acquired from SILVACO (Santa Clara, CA, USA). Additionally, we utilized COMSOL software (version 5.6) to simulate the temperature distribution within parallel power cells, examining further impacts resulting from thermal coupling. The research findings indicate that the rise in current induces modifications in the local carrier concentration, thereby prompting variations in the local electric field, including changes in the heat source's peak location and intensity. The device's peak temperature exhibits a non-linear trend regulated by the current, revealing an error margin of less than 1.5% in the proposed current-corrected model. At higher current levels, the drift of the heat source leads to an increase in the heat dissipation path and reduces the coupling strength between parallel devices. Experiments were performed on 64 GaAs (gallium arsenide) HBT-based power cells using a QFI infrared imaging system. Compared to the traditional temperature calculation model, the proposed model increased the accuracy by 6.84%, allowing for more precise predictions of transistor peak temperatures in high-power applications.

Effect of 60Coγ ray radiation on electrical properties of SiGe HBTs at low temperatures

In this article, total ionizing dose (TID) irradiation experiments were carried out on germanium-silicon heterojunction bipolar transistors (SiGe HBTs) under different bias and temperature conditions. The electrical performance and noise characteristics of the device were characterized before and after irradiation using a semiconductor parameter analyzer and a 1/f noise test system, respectively. The variation of radiation sensitivity parameters with the TID effect and temperature of the device was obtained, and the mechanism of radiation damage degradation was also identified. Results suggest that the oxide-trap charges and interface states induced by irradiation are the main causes for SiGe HBT electrical parameters degradation. With the decreased temperature, Gummel characteristics and 1/f noise are significantly improved. It's found that oxide-trap charges and interface states generated at 93 K is less than that at 300 K. This work lays the foundation for the application of SiGe HBT in aerospace area.

Mid-Infrared Photodetectors Based on Lattice Matched SiGeSn/GeSn Heterojunction Bipolar Transistor With an i-GeSn Absorber Layer

Mid-Infrared Photodetectors Based on Lattice Matched SiGeSn/GeSn Heterojunction Bipolar Transistor With an <i>i</i>-GeSn Absorber Layer

The effects and mechanisms of 2 MeV proton irradiation on high bias conditions of InP/InGaAs DHBTs

In this work, a 2 MeV proton irradiation experiment has been carried out on self-fabricated InP/InGaAs heterojunction bipolar transistors (HBTs) with fluence of 5 × 1013 H+/cm2 and 1 × 1014 H+/cm2. The degradation and mechanisms have systematically been studied under different bias conditions. The irradiated InP-based HBTs have suffered more sever degradation at low and high bias voltages with larger damage coefficient of current gain (Kβ), due to the increased base recombination current and the slacken collector current respectively. Under high injection current densities, the slow-down of collector current and the collapse of current gain (β) have occurred at increasingly smaller biases as irradiation fluence increases. Consistently, the ideality factor of base current collapses to 1 at high injection current, moreover, the collapse point decreases as fluence increases. The aggravated degradation at high current densities is attributed to the influence of heterojunction barrier effect (HBE) by the structure of the multi-layer collector region. The study would be of great significance for optimizing the device structure and improving the irradiation tolerance.

Transient dose rate effects in silicon–germanium heterojunction bipolar transistors

Transient γ-radiation and laser-simulated experiments were carried out to investigate the transient dose rate effect (TDRE) in SiGe heterojunction bipolar transistors (HBTs) for the first time. The results indicate that IBM43RF0100 SiGe HBTs experience a significant sensitivity of TDRE. For the laser-simulated experiment, the duration of transient current and charge collection are matched well with that of transient γ-radiation. The amplitude of transient photocurrent induced by the lower energy order of μJ approaches the transient photocurrent induced by transient γ-radiation. It is demonstrated that laser-simulated experiments are a candidate and a convenient method to evaluate the TDRE response of SiGe HBTs, which avoids serious electromagnetic interference in the transient γ-radiation environment.

RF Characterization of GaAs HBT under Load Mismatch with Reverse Wave Injection Technique.

RF PAs need to be reliable enough to protect them from damage under load mismatch conditions. This paper investigated the characteristics of GaAs heterojunction bipolar transistors (HBTs) under load mismatch conditions using a novel reverse wave injection technique to realize large VSWR ruggedness measurement with the circle centered at 50 Ohm and optimal impedance separately to analyze the device in real applications. With a real-time waveform measurement system, the RF voltage and current waveform information can be acquired, which provide a more-accurate view of what is occurring at the current generator plane of the HBT device. Thereby, the potential failure mechanisms and load impedance can be identified to design the most-suitable PA circuits in communication systems.

InP DHBT Analytical Modeling: Toward THz Transistors

InP double heterojunction bipolar transistors (InP DHBT) are one of the key technologies considered for terahertz applications. Improvement of their frequency performance is challenging and strongly dependent on various parameters (manufacturing process, geometry, epitaxial structure). In this article, a novel method is developed to take into account these parameters and predict the frequency performance of the technology. This approach consists of rebuilding the S-parameter matrix of the small-signal model. Elements of the small signal model are identified, and their assessment is described in detail. Once calibrated with the present state-of-the-art device features, the model shows a good agreement with the measurements. Based on this result, analysis of the emitter and base technological features are performed along with optimizations of the vertical structure. Finally, the necessary optimizations for developing a terahertz transistor are detailed. This works provides guidelines for technological improvement and opens the way for designing transistors operating at frequencies above a terahertz.

An Aging Small-Signal Model for Degradation Prediction of Microwave Heterojunction Bipolar Transistor S-Parameters Based on Prior Knowledge Neural Network.

In this paper, an aging small-signal model for degradation prediction of microwave heterojunction bipolar transistor (HBT) S-parameters based on prior knowledge neural networks (PKNNs) is explored. A dual-extreme learning machine (D-ELM) structure with an adaptive genetic algorithm (AGA) optimization process is used to simulate the fresh S-parameters of InP HBT devices and the degradation of S-parameters after accelerated aging, respectively. In addition to the reliability parametric inputs of the original aging problem, the S-parameter degradation trend obtained from the aging small-signal equivalent circuit is used as additional information to inject into the D-ELM structure. Good agreement was achieved between measured and predicted results of the degradation of S-parameters within a frequency range of 0.1 to 40 GHz.

Design of Power Amplifiers for BDS-3 Terminal Based on InGaP/GaAs HBT MMIC and LGA Technology.

With the development and popularization of the Beidou-3 navigation satellite system (BDS-3), to ensure its unique short message function, it is necessary to integrate a radio frequency (RF) transmitting circuit with high performance in the BDS-3 terminal. As the key device in an RF transmitting circuit, the RF power amplifier (PA) largely determines the comprehensive performance of the circuit with its transmission power, efficiency, linearity, and integration. Therefore, in this paper, an L-band highly integrated PA chip compatible with 3 W and 5 W output power is designed in InGaP/GaAs heterojunction bipolar transistor (HBT) technology combined with temperature-insensitive adaptive bias technology, class-F harmonic suppression technology, analog pre-distortion technology, temperature-insensitive adaptive power detection technology, and land grid array (LGA) packaging technology. Additionally, three auxiliary platforms are proposed, dedicated to the simulation and optimization of the same type of PA designs. The simulation results show that at the supply voltage of 5 V and 3.5 V, the linear gain of the PA chip reaches 39.4 dB and 38.7 dB, respectively; the output power at 1 dB compression point (P1dB) reaches 37.5 dBm and 35.1 dBm, respectively; the saturated output power (Psat) reaches 38.2 dBm and 36.2 dBm, respectively; the power added efficiency (PAE) reaches 51.7% and 48.2%, respectively; and the higher harmonic suppression ratios are less than -62 dBc and -65 dBc, respectively. The size of the PA chip is only 6 × 4 × 1 mm3. The results also show that the PA chip has high gain, high efficiency, and high linearity under both output power conditions, which has obvious advantages over similar PA chip designs and can meet the short message function of the BDS-3 terminal in various application scenarios.

Small-signal behavioral-level modeling of InP HBT based on SO-BP neural network

In this paper, Snake Optimizer-Back Propagation (SO-BP) neural network algorithm has been proposed to model the small-signal characteristic of InP heterojunction bipolar transistors (HBTs). The SO algorithm can effectively improve the problem of local optima encountered by the BP neural network algorithm. The InP HBT small-signal models have been constructed by using Back Propagation (BP) algorithm, the Genetic Algorithm-Back Propagation (GA-BP) algorithm and the Snake Optimizer-Back Propagation (SO-BP) algorithm. The experimental results verify that the proposed SO-BP neural network algorithm model has the lowest error rate between simulated and measured data. Hence, the SO-BP algorithm is a more effective approach for modeling the small-signal characteristic of InP HBT. The accurate small-signal behavioral-level model of HBT has significant reference value for the application of microwave and millimeter-wave integrated circuits (MMICs).