Recent advances in the computational fluid dynamics and heat transfer (CFD/HT) modeling of flow boiling have enabled a more detailed analysis and understanding of thermal management in relatively complex microsystems. Most advanced modeling approaches allow the transient analysis of two-phase flow and phase-change processes, providing the capability to post-process in detail the temperature, phase and pressure distributions in microscale applications with the use of moderate computational resources. Although these models have significantly evolved in recent years, there are still several idealizations and assumptions that have yet to be improved or better justified, the boiling incipience treatment being a commonly questioned topic. In the present investigation, a boiling incipience model is incorporated into an existing CFD/HT model for the analysis of flow boiling mechanisms, where the superheat temperature is derived from fundamental thermodynamic relations and compared to the original CFD/HT model that does not account for such effects. Results are compared using a non-trivial case of a silicon micro-cooling layer with variable density of pin fins that has been demonstrated to be an efficient thermal control device in high-power applications. The dielectric fluid HFE-7200 is used as the coolant in flow boiling conditions. The two-phase flow regimes and heat transfer results for both models are compared.
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