Heat Dissipation Issues Research Articles

A strategy for enhancing interfacial thermal transport in Ga2O3-diamond composite structure by introducing an AlN interlayer

Heat dissipation issues have emerged in power devices due to miniaturization and high power density, particularly for materials like low-thermal-conductivity gallium oxide (Ga2O3). Increasing interfacial heat transfer has been identified as a critical strategy for tackling these issues. This study first explored the thermal transport of Ga2O3-diamond interfaces in composite structures containing an AlN interlayer. First-principles calculations revealed that the AlN interlayer improved interfacial bonding between Ga2O3 and diamond. Subsequently, Ga2O3 membranes were deposited on diamond substrates with and without interlayers using pulsed laser deposition (PLD), and the structural and thermal characteristics were examined. The interlayer strategy was shown to be effective in improving the quality of Ga2O3 thin films, including improved crystallinity, a smoother surface, and fewer oxygen vacancies. The thermal characteristics were accordingly improved: the thermal conductivity of Ga2O3 increased from 5.5±0.3–6.0±0.3 W/m·K, and the thermal boundary conductance of Ga2O3-diamond interface (TBCGaO-dia) increased from 46.1±2.3–60.9±3.0 MW/m2·K. Molecular dynamics (MD) analysis further revealed that the enhancement in phonon transmission was due to the increase in the low-frequency phonon participation rate. Additionally, the electro-thermal simulation using COMSOL confirmed the effectiveness of the AlN interlayer in mitigating the self-heating effect. These findings offer a new route for improving interface heat transport and pave the way for the optimization and design of reliable Ga2O3-based devices.

A steady-state distributed parameter ultrathin heat pipe model considering the unsaturated wick

Ultrathin heat pipes have become mainstream to address the heat dissipation issues of small electronic devices. Numerous numerical studies based on the saturated wick assumption have been proposed to analyze their heat transfer performance. In order to achieve a more accurate assessment, this study presents a three-dimensional model that quantitatively reflects the relationship between capillary pressure and medium volume, along with a corresponding correlation. Based on this, a steady-state distributed parameter ultrathin heat pipe model considering the retreating of medium volume in the wick and the unsaturation vapor-liquid interface was developed, whose accuracy was verified by the experimental data. The results demonstrated that the capillary pressure increased with the decrease of medium volume and contact angle. The evolution of the overall meniscus with medium volume was categorized into two stages, where capillary pressure dependent on the main and micro meniscus at different stage. The medium volume distribution, corresponding to capillary pressure, will automatically adjust to match the overall medium pressure drop. Comparative analysis against experimental data, the proposed model reduced the maximum temperature difference error by 8.43 % compared to the saturated wick assumption at a heat load of 6 W, revealing that the unsaturated liquid wick model exhibited higher accuracy.

Experimental study of an aluminum based three-dimensional thermosyphon heat sink with microscale enhancement structure

One of the most significant limitations to the advancement of electronics is the issue of heat dissipation. Currently, air cooling remains the most widely used method for heat dissipation due to the advantages of low cost and ease of maintenance. However, the traditional air-cooling method based on an all-solid heat sink is unable to keep pace with the rapid advancement in thermal power of electronics due to its limitation in area expansion by only solid fins. This study proposes an aluminum-based three-dimensional thermosyphon (3D-TS) coupling boiling-condensation heat transfer and forced air cooling as a means of overcoming the limitations of conventional air-cooling methods. Additionally, the incorporation of micro pin-fins enhances the boiling heat transfer and the overall performance of the three-dimensional thermosyphon. The performance of the three-dimensional thermosyphon is experimentally studied and analyzed under different volumetric flow rates using the environmentally friendly refrigerant R1233zd(E) as the working fluid. The results indicate that the total thermal resistance exhibits a biphasic response to heating power, with a decrease initially followed by an increase. This response is primarily attributed to the boiling mode on the substrate. Moreover, the micro pin-fins significantly enhance the boiling heat transfer on the substrate of the three-dimensional thermosyphon, enabling the three-dimensional thermosyphon to reach a minimum thermal resistance of 0.075 K/W and a maximum thermal dissipating power of 650 W with the temperature of the heating source below 85 °C. The three-dimensional thermosyphon proposed in this work is capable of meeting the cooling requirements of the majority of high-performance chips. This paper offers a valuable reference and guidance for the design and optimization of the phase-change devices.

Electro-thermal co-simulation of high-frequency structure of staggered double-grating traveling wave tube based on finite difference time domain

The heat dissipation issue of a Traveling Wave Tube (TWT) affects its stability and reliability. In this paper, the particle-in-cell (PIC) code based on the finite difference time domain (FDTD) method and the thermal analysis program are closely combined to realize the electro-thermal co-simulation of the high-frequency circuit of the staggered double-grating TWT. Two types of heat sources, including the ohmic losses inside the high-frequency structure and the energy loss caused by electron collision, can be analyzed by the code providing significant guidance for the design of TWT.

Diamond-Reinforced Al(H2PO4)3@Epoxy Hybrid Thermal Adhesive With Ultra-High Thermal Conductivity and Bonding Strength.

The miniaturization, integration, and increased power of electronic devices have exacerbated serious heat dissipation issues. Thermally conductive adhesives, which effectively transfer heat and firmly bond components, are critical for addressing these challenges. This paper innovatively proposed a composite comprising inorganic phosphate/alumina as a matrix and diamond as filler. The composite achieved an isotropic thermal conductivity (TC) of up to 18.96Wm-1K-1, significantly surpassing existing reports while maintaining electrical insulation. First-principles calculations and experimental tests confirmed that the high TC of phosphate and excellent interface contact ensured efficient heat transfer. To optimize bonding performance, a modified-diamond/Al(H2PO4)3@epoxy hybrid composite is subsequently developed using an organic modification method. The unique hybrid structure, combining inorganic thermal pathways and an organic adhesive network, enabled the hybrid composite to simultaneously possess a high TC (3.23Wm-1K-1) and strong adhesion (14.35MPa). Compared to previous reports, the comprehensive performance of this hybrid thermally conductive adhesive is exceptionally remarkable. The superior heat dissipation capability of the hybrid thermal adhesive is demonstrated in chip cooling scenarios. This organic/inorganic hybrid approach offered a new direction for obtaining advanced thermal interface materials, demonstrating significant application potential in chip soldering, packaging, and heat dissipation.

Comparative Study of Simulation of Temperature Rise in Ring Main Unit.

The Ring Main Unit (RMU) is a critical device in power distribution systems used for connecting and distributing electricity. However, due to its compact internal structure and high current load, heat dissipation issues are particularly prominent. To address this problem, this study innovatively proposes a simplified RMU model, employing finite element simulation methods to accurately solve for the ohmic losses of conductors under actual operating conditions and obtain ohmic loss data for various components. This is the first in-depth investigation of the RMU's temperature rise problem using such a comprehensive approach. Subsequently, the temperature field was solved using two different temperature field analysis modules, with a detailed comparison and analysis of the simulation results to identify similarities, differences, and trends in temperature distribution. The results indicate that the temperature field solution model, which considers convective heat transfer, is more accurate and aligns with actual operating conditions. This research provides an innovative approach and practical solutions for the design and optimization of RMUs. Future research can further explore multiphysics coupling analysis methods to address structural design and mandatory validation issues for high and ultra-high voltage RMUs and other electrical equipment, thereby providing important insights for engineering design.

Enhancement of Thermal Management Performance of Copper Foil Using Additive-Free Graphene Coating.

Advanced thermal interface materials with high thermal conductivity are crucial for addressing the heat dissipation issue in high-power, highly integrated electronic devices. One great potential way in this field is to take advantage of cooling copper foil (Cu) materials based on graphene (G). However, the current manufacturing of these cooling copper foil materials is accompanied by high cost, process complexity, and environmental problems, which limit their development and application. In this work, a simple, low-cost, environmentally friendly graphene-copper foil composite film (rGO/G-Cu) with high thermal conductivity was successfully prepared using graphene oxide directly as a dispersant and binder of graphene coating. The microstructure characterization, thermal conductivity and thermal management performance tests were carried out on the composite films. The results demonstrate that compared to pure copper foil (342.47 W·m-1·K-1) and 10% PVA/G-Cu (367.98 W·m-1·K-1) with polyvinyl alcohol as a binder, 10% rGO/G-Cu exhibits better thermal conductivity (414.56 W·m-1·K-1). The introduction of two-dimensional graphene oxide effectively enhances the adhesion between the coating and the copper foil while greatly improving its thermal conductivity. Furthermore, experimental results indicate that rGO/G-Cu exhibits excellent heat transfer performance and flexibility. This work is highly relevant to the development of economical and environmentally friendly materials with high thermal conductivity to meet the increasing demand for heat dissipation.

Investigating thermal transport across the AlN/diamond interface via the machine learning potential

Aluminum nitride (AlN) is an ultrawide-bandgap semiconductor with excellent potential for high-power applications. However, the heat dissipation issue remains a huge challenge for the use of AlN in high-power devices. A promising solution for this problem is to integrate AlN with the diamond heat sink. Therefore, interfacial thermal transport has become a significant bottleneck in thermal management. In this work, one neuroevolution potential is developed based on neural networks, which significantly improves the accuracy of predicting thermal properties compared to traditional potentials and address the issue of inaccurate thermal performance prediction of AlN/diamond heterostructures using traditional potentials. Molecular dynamics simulations based on NEP is adopted to investigate the crystal-orientation-dependent and interfacial-atom-dependent thermal boundary resistance of the AlN/diamond heterostructures after the interfacial bonding. Compared to bonding with Al and C atoms, the TBR decreases by approximately 50 % after bonding with N and C atoms at the interface. Especially for the AlN (0001)-N-diamond (100) heterostructure, the TBR is 0.95 m2·K·GW−1, very close to the theoretical limit of 0.8 m2·K·GW−1 through the diffuse mismatch model (DMM) theory. Finally, the insightful optimization strategies are proposed in this work which could pave the way for better thermal design and management of AlN/diamond heterostructures.

The copper matrix composite with "sandwich" structure and three-dimensional networks, showcasing significantly improved thermal conducting performance

Copper matrix composites can be used to address the issue of heat dissipation in electronic devices. Nevertheless, the thermal conductivity (TC) of carbon fiber (CF)/copper (Cu) composites falls significantly below expectations. This is primarily attributed to the challenge of achieving a well-ordered arrangement of CF within the matrix, coupled with the issue of low interfacial bonding strength. A highly effective and uncomplicated approach to fabricate copper matrix composites featuring a "sandwich structure" of Cu-CF-Cu is introduced in this paper. This configuration, achieved through structural design facilitated by hot-press sintering and vacuum suction filtration, exhibited a three-dimensional graphene-like networks (3D-GLNs) and meticulously ordered CF layers over long distances. More importantly, in comparison to pure copper (350 W m−1 K−1), the laminated composite with 40 vol% CF of the CF layer had an in-plane TC of 510 W m−1 K−1, which was approximately 1.5 times greater than that of pure copper. Additionally, the coefficient of thermal expansion (CTE) of the laminated composite with 45 vol% was 9.98 ppm/K. The in-plane TC of the composite was comparable to that of the graphene/Cu composites with the same content. This underscores the advantages of the structural design, even in cases where the TC of the reinforced phase differs by a factor of two. The aforementioned findings demonstrate that this methodology for developing a unique "sandwich" structure can effectively enhance in-plane TC in CF/metal composites, presenting potential for utilization in electronic packaging requiring efficient directional heat transfer.

Comparison of SiNx Dielectric Layer Grown by Plasma‐Enhanced Chemical Vapor Deposition, Low‐Pressure Chemical Vapor Deposition, and Metal‐Organic Chemical Vapor Deposition in Diamond‐ and GaN‐Based Integrated Devices

To address the issue of heat dissipation caused by the high output power density of gallium nitride (GaN) devices, using diamond‐integrated devices is an effective solution. Recent studies have suggested that incorporating a dielectric layer, such as silicon nitride (SiNx), between diamond and GaN can improve adhesion while also reducing thermal boundary resistance (TBR). In this study, plasma‐enhanced chemical vapor deposition (CVD), low‐pressure CVD, and metal‐organic CVD (MOCVD) techniques are utilized to grow the SiNx layer. The interface behavior of diamond/SiNx/GaN is analyzed through scanning electron microscopy, transmission electron microscopy (TEM), scanning TEM, and energy‐dispersive X‐ray spectroscopy, while time‐domain thermoreflectance measurement is used to characterize thermal properties. After analyzing the impact of the growth dielectric layer on the interface thermal resistance of the three growth modes, it is concluded that the dielectric layer produced by the MOCVD technique exhibits a smoother surface and lower TBR compared to the other two methods. Therefore, the use of the MOCVD technique is recommended to achieve optimal thermal performance in diamond/SiNx/GaN systems.

Investigation on the thermal and hydraulic characteristics of the micro heat sinks with grooves and pin fins by Taguchi-based sensitivity analysis

The heat dissipation issue of the micro electronic devices seriously restricts their application in the aerospace, national defense, communication, etc. The novel heat sinks with trapezoidal grooves and rectangular pin fins are proposed to meet the cooling requirement of the high-power devices. The cooling effect, thermohydraulic characteristics, total efficiency and thermodynamic performance of the heat sinks are studied by three-dimensional numerical simulation. Firstly, the influence of the relative position between the grooves and the pin fins on the thermohydraulic performance is explored in detail. Secondly, Taguchi optimization and analysis of variance are adopted to quantitatively analyze the impact degree of the pin fin width, length and height on the Nusselt number, friction factor and total performance index. The optimal structures are obtained for different objectives. Lastly, the temperature performance, total performance and the irreversibility of the optimal structures are compared thoroughly. New findings include that: the best arrangement of the grooves and pin fins is obtained, which enhances the Nusselt number by 1.5 times compared to the smooth heat sink. The fin width is the most critical factor for the heat transfer and flow, while the fin length shows the greatest importance in the overall performance. The optimized heat sink with the fin width of 50 μm, length of 60 μm and height of 150 μm reduces the peak temperature by 12.3 ℃ compared to the smooth heat sink for Reynolds number of 303. This heat sink yields the highest total performance index with 1.43 for Reynolds number of 368 and significantly reduces the irreversible loss. Moreover, the optimized heat sink with the fin width of 10 μm, length of 60 μm and height of 100 μm reduces the friction factor by 61.39 % compared to the original structure for Reynolds number of 635, which is beneficial to reduce the energy consumption. The quantitative analysis of the parameter sensitivity for novel heat sinks reveals the mechanism of the heat transfer enhancement by modifying the geometric parameters and provides an effective solution for thermal management of the high-power devices.

Improving Thermal Performance in Data Centers Based on Numerical Simulations

Improving Thermal Performance in Data Centers Based on Numerical Simulations

Highly reflective TiO2 layer on AlN substrate: Enabling high quality laser lighting

Phosphors in glass films (PiFs) is considered ideal conversion materials for laser lighting, but heat dissipation issue is the main challenge limiting its development. Therefore, it is urgent to find more excellent heat dissipation materials. Herein, we proposed to use AlN with high thermal conductivity as the substrate, and innovatively introduced TiO2 coating to improve the interface reflection ability and solve the possible problems of shedding and cracking. After a series of optimizations, the LSN PiG-TiO2-AlN (PTA) color converter obtained a high thermal conductivity of 29W m−1k−1 and a low surface temperature. At an input power of 5.2W, the luminous efficiency can reach 175 lm/W and the relative initial intensity can still be maintained by 95.3% at 200 °C. Benefiting from the extremely strong heat dissipation capacity of the AlN substrate, the LSN PTA color converter maintains its relative luminous intensity at 95 % of the initial intensity after 24 h of continuous illumination, which is the best value recorded so far. In addition, LSN PTA is combined with CaAlSiN3:Eu2+ phosphor to achieve high-quality white light with a CRI of 82.5. The above results indicate that LSN PiG-TiO2-AlN color converters have a promising research prospect in the field of laser lighting.

Research Status of Heat Dissipation Technology for Electric Vehicle Drive Motors

Background:: The application of electric vehicles in daily life is becoming increasingly widespread. However, the heat dissipation issues of the electric motors directly impact electric vehicles' stability and safety. Thus, research on the heat dissipation of the electric motor is conducive to improving the reliability of the drive motor and ensuring the overall stability and safety of electric vehicles; there is a growing emphasis on the development trends of heat dissipation technologies for electric vehicle drive motors. Objective:: In order to meet the increasing requirements of electric vehicles for stability and safety and to solve the problems of low heat dissipation efficiency of electric vehicle drive motors, the size of heat dissipation devices, and the short life span caused by the high temperature of drive motors, the heat dissipation of drive motors is optimized and the heat dissipation structure is improved. Methods:: Based on the structural characteristics of heat dissipation of electric vehicle drive motors, various representative patents related to the current heat dissipation technology of electric vehicle drive motors are summarized. Results:: By summarizing a large number of patents on electric vehicle drive motor heat dissipation technology, it is concluded that the current research on electric vehicle drive motor heat dissipation mainly focuses on liquid heat dissipation or gas heat dissipation and that the main reason for the heat dissipation problem of electric vehicle drive motors is the low heat dissipation efficiency due to over-reliance on a single heat dissipation method, and the reliability is poor due to failure to reasonably control heat dissipation according to the need for heat dissipation. This paper proposes a new idea of heat dissipation for electric vehicle drive motors, which effectively combines liquid heat dissipation and gas heat dissipation. Moreover, the heat dissipation efficiency will be significantly higher than the existing heat dissipation scheme, and the proposed heat dissipation concept of "ondemand distribution" will effectively improve the utilization rate of the heat dissipation medium and reduce the heat dissipation cost and the reasonable heat dissipation structure will reduce the volume of the heat dissipation device. The reasonable heat dissipation structure will also reduce the volume of the heat dissipation device. In addition, the future development of heat dissipation technology for electric vehicle drive motors is also discussed. Conclusion:: The heat dissipation scheme proposed in this paper will effectively improve the heat dissipation problem of electric vehicle drive motors. Compared with the existing heat dissipation methods, the heat dissipation efficiency of the heat dissipation scheme proposed in this paper will be improved by more than 8.5%, and the service life of the drive motor will be extended by more than 5.1%, while the size of the electric vehicle drive motor will be reduced by 6%. More related patents will be invented in the future.

The mechanism of boiling heat transfer of polycarboxylate superplasticizer modified stereotaxically constructed graphene water-based nanofluid: Experiment and molecular dynamics simulation

The issue of heat dissipation is currently a challenge in industries such as manufacturing and microelectronics. The use of nanofluid for boiling heat transfer is an approach to solving this problem. However, the mechanism of heat transfer remains uncertain. In this study, stereotaxically constructed graphene (SCG) was modified with polycarboxylate superplasticizer (PS) to obtain modified graphene (PSG). PSG/water nanofluid (PSGNF) with high stability and excellent dispersibility was prepared. Boiling heat transfer (BHT) experiments were performed on PSGNF at three mass concentrations (0.01 wt%, 0.03 wt%, 0.06 wt%) and the corresponding boiling heat transfer coefficient (HTC) was calculated. The results show that, at a heat flux of about 300 kW m−2, HTC can achieve an enhancement of 332.0 % at the concentration of 0.06 wt%. To analyze the mechanisms, we combine experiments and molecular dynamics simulations. It is found that (1) the PSG particles deposited on the heated surface. The thinner deposited layer will promote heat transfer, while a thicker one will deteriorate it; (2) PSG particles can inhibit the merging of bubbles; (3) PSG particles can promote bubble formation.

Strategy to solve the thermal issue of ultra-wide bandgap semiconductor gallium oxide field effect transistor

Gallium Oxide (Ga2O3) holds significant potential for the next generation of electronic devices following SiC and GaN due to its ultra-wide bandgap of approximately 4.5 eV - 4.9 eV and high theoretical critical breakdown field strength of 8 MV/cm. Nonetheless, Ga2O3 has a naturally low thermal conductivity, resulting in limited device output performance and hindering Ga2O3 devices from reaching their full theoretical potential. In this study, we demonstrate that the appropriate thermal management strategy can solve the above challenges. By comparing the thermal control schemes including the Ga2O3 FET devices on the original substrate, the thinned Ga2O3 substrate, the high thermal conductivity substrate, the heat sink packaging, and the flip-chip packaging, it is demonstrated that the flip-chip model is the most effective strategy to improve the heat dissipation performance of the Ga2O3 device. By utilizing the appropriate carrier in flip-chip packaging, the temperature elevation of the device at 2 W/mm power density will be diminished by around 91% in contrast to the initial basic device. Furthermore, the output performance of the device demonstrates significant enhancement. This thermal management technique successfully resolves the severe heat dissipation issue prevalent in Ga2O3 devices and eliminates primary obstacles concerning the industrialization of Ga2O3 RF and power devices.

Experimental and numerical study to optimize building integrated photovoltaic (BIPV) roof structure

The study addresses the issue of heat dissipation in Building Integrated Photovoltaic (BIPV) roofs by proposing a novel PV module and establishing its testbed in Beijing, China, which is extended to more structures by the validated numerical model. The validation reveals MBD (mean bias difference）values of 10.24% for electricity production and 9.32% for temperature, accompanied by corresponding RMSD (root mean square difference) values of 23.97% and 10.46%, respectively. Taguchi method and Computational Fluid Dynamics (CFD) numerical simulation were employed to design and simulate orthogonal schemes, optimizing BIPV roof structure for the first time by considering three factors: air gap thickness, PV panel spacing and heating power. The results indicate that the air gap thickness impacts most on PV panel temperature, followed by meteorological parameters and PV panel spacing. The optimal BIPV roof structure, featured an air gap of 68 mm and a PV panel spacing of 30 mm, exhibits a 25.35% reduction in PV panel temperature, an 8.78% increase in signal-to-noise (S/N) ratio and a 2.49% growth in electricity production compared to the performance of the intermediate level scheme.

Optimizing the performance of the thermal transistor based on negative differential thermal resistance

Thermal transistors have significant potential in thermal management due to their ability to precisely control the heat fluxes. However, the current design has a limited working temperature range and cannot meet the demand for heat control. In this work, we optimize the performance of a thermal transistor based on negative differential thermal resistance using a modified Lorentz gas model, focusing on the effects of gate control and thermal conductance. We find that the control of the gate has an asymmetrical property, and the sufficient control can expand the working region by more than 1.5 times. In addition, the switching and amplifying functions of the thermal transistor are inversely dependent on thermal conductance, and an increase in thermal conductance can lead to a 27 times amplification in heat flux. The synergistic regulation of the two factors results in the optimal performance of a 44% working region and a 33 times amplification in heat flux. These findings refresh the understanding of the performance limits of thermal transistors, promoting efficient thermal management and addressing heat dissipation issues.

Analysis of factors influencing heat transfer performance based on ship spray cooling system

The increasingly prominent issue of equipment heat dissipation has seriously hindered the further development of ship engineering. The heat exchange of traditional heat dissipation technology is limited, resulting in insufficient heat dissipation capacity and difficulty in meeting the heat dissipation needs of ships. Given these problems, this study constructs to use spray cooling technology to solve the heat dissipation problem of ships, and on this basis, the reason causing the heat transfer performance of R134a spray cooling system are analyzed. As there is lubricating oil in the spray cooling system, this study also partially explores such type of system with lubricating oil. The experimental data validate that when the heat flux densities are 30.0 W/cm2, 45.0 W/cm2, and 55.0 W/cm2, the heat transfer coefficients are 19.23?103 W/m2?), 24.02?103 W/m2?C, and 18.70?103 W/m2?C, respectively, and the surface temperature of the heat source is 29.13?C, 38.21?C, and 48.23?C. When the lubricating oil concentration is fixed at 1.47%, during the process of increasing the heat flux density from 10 W/cm2 to 50 W/cm2, the surface temperature rises from 32.33?C to 55.28?C, and the heat transfer coefficient increases from 7.54?103W/m2?) to 9.46?103W/m2?C. In conclusion, the proposed mass-flow rate, heat flow density, and evaporation chamber pressure have a significant impact on the heat transfer performance of the ship?s spray cooling system, on the contrary, the lubricating oil has a significant impact on the system performance.

Visualization-assisted study of a new wickless pulsating vapor chamber

With the improvement and miniaturization of electronic devices, the issue of heat dissipation is becoming increasingly prominent. In this paper, a novel wickless pulsating vapor chamber (VC) plate with Tesla valves is designed to address this problem. With the purpose to achieves continuous internal fluid circulation for heat transfer by harnessing the pulsating force generated from pressure differentials across various regions, in conjunction with the unidirectional nature of the Tesla valve structure.The working fluid used in this vapor chamber plate was perfluorohexanone. To assess the feasibility and temperature homogeneity of the design, a visualization-assisted study was conducted. The results showed that the working fluid within the vapor chamber formed a stable unidirectional circulation during heat dissipation. This circulation is crucial for effectively transferring heat away from the heat source. Furthermore, the study found that the overall average temperature difference across the vapor chamber was minimal. The average thermal resistance of the vapor chamber ranged from 0.076 to 0.105 W/K with a heat dissipation power ranging from 60 to 100 W (equivalent to a heating heat flux of 60–100 W/cm2). These research findings suggest that the new wickless pulsating vapor chamber (VC) plate, equipped with Tesla valves, is an efficient solution for heat dissipation. Its simplicity in manufacturing and low cost are crucial advantages, potentially broadening its applicability to various scenarios.