The copper matrix composite with "sandwich" structure and three-dimensional networks, showcasing significantly improved thermal conducting performance

Abstract

Copper matrix composites can be used to address the issue of heat dissipation in electronic devices. Nevertheless, the thermal conductivity (TC) of carbon fiber (CF)/copper (Cu) composites falls significantly below expectations. This is primarily attributed to the challenge of achieving a well-ordered arrangement of CF within the matrix, coupled with the issue of low interfacial bonding strength. A highly effective and uncomplicated approach to fabricate copper matrix composites featuring a "sandwich structure" of Cu-CF-Cu is introduced in this paper. This configuration, achieved through structural design facilitated by hot-press sintering and vacuum suction filtration, exhibited a three-dimensional graphene-like networks (3D-GLNs) and meticulously ordered CF layers over long distances. More importantly, in comparison to pure copper (350 W m−1 K−1), the laminated composite with 40 vol% CF of the CF layer had an in-plane TC of 510 W m−1 K−1, which was approximately 1.5 times greater than that of pure copper. Additionally, the coefficient of thermal expansion (CTE) of the laminated composite with 45 vol% was 9.98 ppm/K. The in-plane TC of the composite was comparable to that of the graphene/Cu composites with the same content. This underscores the advantages of the structural design, even in cases where the TC of the reinforced phase differs by a factor of two. The aforementioned findings demonstrate that this methodology for developing a unique "sandwich" structure can effectively enhance in-plane TC in CF/metal composites, presenting potential for utilization in electronic packaging requiring efficient directional heat transfer.