The epitaxial growth of Si and Si1−xGex alloys from molecular beams of gaseous Si (Si2H6) and Ge (GeH4) hydrides on Si(001) substrates (Si gas-source molecular-beam epitaxy) has been studied using reflection high-energy electron diffraction (RHEED). Diffraction patterns reveal that Ge deposited on Si results in a Stranski–Krastanow growth mode with a change in surface reconstruction prior to the onset of three-dimensional growth. RHEED intensity oscillations measured during Si1−xGex alloy growth indicate that below 600 °C, the addition of GeH4 flux to the substrate results in an enhanced growth rate (GR), but above 600 °C this phenomenon is not observed and the GR remains proportional to the Si2H6 flux. Further, a temperature and flux dependent change in the growth rate, ΔGR, is observed at the Si/Si1−xGex interface. At low temperatures (<580 °C), the growth of several monolayers precedes the establishment of a constant alloy GR, indicative of a graded Ge composition in the interface region. This phenomenon is discussed in terms of the temperature dependent reaction kinetics in this system during growth between 520–640 °C.
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