GaN Templates Research Articles

Wafer-scale vertical injection III-nitride deep-ultraviolet light emitters

A ground-breaking roadmap of III-nitride solid-state deep-ultraviolet light emitters is demonstrated to realize the wafer-scale fabrication of devices in vertical injection configuration, from 2 to 4 inches. The epitaxial device structure is stacked on a GaN template instead of conventionally adopted AlN, where the primary concern of the tensile strain for Al-rich AlGaN on GaN is addressed via an innovative decoupling strategy, making the device structure decoupled from the underlying GaN template. Moreover, the strategy provides a protection cushion against the stress mutation during the removal of substrates. As such, large-sized wafers can be obtained without surface cracks, even after the removal of the sapphire substrates by laser lift-off. Wafer-scale fabrication of 280 nm vertical injection deep-ultraviolet light-emitting diodes is eventually demonstrated, where a light output power of 65.2 mW is achieved at a current of 200 mA, largely thanks to the significant improvement of light extraction. This work will definitely speed up the application of III-nitride solid-state deep-ultraviolet light emitters featuring high performance and scalability.

Elimination of V‐Shaped Pits in Thick InGaN Layers via Ammonia‐Assisted Face‐to‐Face Annealing

InGaN, a group‐III nitride semiconductor, is expected to be widely used in the field of optoelectronics, owing to its excellent physical properties. However, InGaN has various limitations. This study reports face‐to‐face annealing (FFA) using vapor‐phase and in‐plane mass transport to improve the surface flatness of an InGaN template. InGaN layers are grown on a GaN template that is grown on a c‐plane sapphire substrate using metal–organic vapor‐phase epitaxy. NH3‐assisted FFA is performed at 1050 °C for 20 min, causing V‐pits to vanish from the InGaN template despite their initial density of 3.3 × 108 cm−2. The surface condition of the lower InGaN layer is worse than that of the upper InGaN layer due to the FFA‐induced upward mass transport from the lower layer, thereby eliminating the V‐pits. Compositional analysis of the upper layer through Auger electron spectroscopy and energy‐dispersive X‐ray spectroscopy reveals In peaks despite high‐temperature annealing, thus confirming the presence of InGaN. The results of this study offer possibilities for future InGaN crystal growth and InGaN‐based device fabrication.

Pinpointing lattice-matched conditions for wurtzite ScxAl1−xN/GaN heterostructures with x-ray reciprocal space analysis

Using comprehensive x-ray reciprocal space mapping, we establish the precise lattice-matching composition for wurtzite ScxAl1−xN layers on (0001) GaN to be x = 0.14 ± 0.01. 100 nm thick ScxAl1−xN films (x = 0.09–0.19) were grown in small composition increments on c-plane GaN templates by plasma-assisted molecular beam epitaxy. The alloy composition was estimated from the fit of the (0002) x-ray peak positions, assuming the c-lattice parameter of ScAlN films coherently strained on GaN increases linearly with Sc-content determined independently by Rutherford backscattering spectrometry [Dzuba et al., J. Appl. Phys. 132, 175701 (2022)]. Reciprocal space maps obtained from high-resolution x-ray diffraction measurements of the (101¯5) reflection reveal that ScxAl1−xN films with x = 0.14 ± 0.01 are coherently strained with the GaN substrate, while the other compositions show evidence of relaxation. The in-plane lattice-matching with GaN is further confirmed for a 300 nm thick Sc0.14Al0.86N layer. The full-width-at-half-maximum of the (0002) reflection rocking curve for this Sc0.14Al0.86N film is 106 arc sec and corresponds to the lowest value reported in the literature for wurtzite ScAlN films.

Characterizations of Subbandgap Optical Absorption in Undoped‐GaN and 90 nm‐Thick Al1−xInxN Thin Film on Sapphire Substrates Grown by Metal–Organic Chemical Vapor Deposition

Subbandgap optical absorption (SOA) in undoped GaN and 90 nm‐thick Al1−xInxN thin films grown on sapphire substrates is investigated using photothermal deflection spectroscopy (PDS) and photoluminescence (PL). An Al1−xInxN alloy (x = 0.17) is grown on a GaN/sapphire template by metal–organic chemical vapor deposition (MOCVD), and the SOA is observed using PDS. To develop an estimation method for the absorption coefficient (α) of SOA in GaN and Al1−xInxN thin films, the use of a thick GaN substrate is proposed, which is grown by hydride vapor‐phase epitaxy, as a converter of the PDS signal intensity to α, and the accuracies of the estimated α are discussed. Comparing the PDS and PL results, it is revealed that nonradiative recombination centers leading to the reduction of the near‐band‐edge PL intensity are not the dominant sources of SOAs in GaN. Other in‐gap states formed by impurities and/or their complexes with vacancy‐type defects are possible sources of a large SOA in the MOCVD‐grown GaN template. Considering the PDS results and reported peak reflectivity of Al1−xInxN/GaN distributed Bragg reflectors, the α value of sub‐100 nm‐thick Al1−xInxN alloy grown on GaN/sapphire template is expected to be ≈100 cm−1 or less below 3.0 eV.

Investigation of crystalline and band alignment properties of NiO/GaN and Ni0.5Co0.5O/GaN heterojunctions using synchrotron radiation based techniques

Epitaxial layers of NiO and Ni0.5Co0.5O have been deposited on GaN templates using RF magnetron sputtering deposition technique. The epitaxial relationship in out-of-plane and in-plane directions for NiO and Ni0.5Co0.5O layers with respect to GaN is [111]NiO(Ni0.5Co0.5O)∥[0001]GaN and [1̅10]NiO(Ni0.5Co0.5O)∥[1̅21̅0]GaN, respectively. The epi-layers are found to have two triangular domain structures oriented along [111] direction with an in-plane rotation of 60° with respect to each other. Photoelectron spectroscopy (PES) has been used to determine the valence band offset (∆EV) and the band alignment at the heterojunctions (HJs). The ∆EV at NiO/GaN and Ni0.5Co0.5O/GaN HJs are 1.2 ± 0.2 eV and 1.8 ± 0.2 eV, respectively. The conduction band offsets (∆EC) have also been estimated using the determined values of optical band gap (NiO: Eg = ∼ 3.5 eV; Ni0.5Co0.5O: Eg = ∼ 3.3 eV) from optical transmission measurements. The values of ∆EC are found to be 1.5 ± 0.2 eV and 1.9 ± 0.2 eV at NiO/GaN and Ni0.5Co0.5O/GaN HJs, respectively. A type-II band alignment is observed at both the HJs. Higher values of valence band and conduction band offsets are observed at Ni0.5Co0.5O/GaN HJ in comparison to NiO/GaN. These experimentally determined values of band offsets can be used to design wide band gap HJ based devices like photodetectors, where higher values of band off-set at the Ni0.5Co0.5O/GaN HJ can be utilized to confine the carriers.

Fabrication of free-standing GaN substrates using electrochemically formed porous separation layers

We have developed a pore-assisted separation (PAS) method for the fabrication of free-standing GaN substrates, where bulk GaN crystals were separated from seed GaN templates at electrochemically formed porous layers. The pore size was controlled by the electrochemical process conditions and must be greater than 100 nm to realize separation within whole wafers. A 2 inch free-standing GaN substrate having a low dislocation density of ∼2.7 × 106 cm−2 was realized by growth of an 800 μm thick GaN layer on the porous GaN template. A 3 inch free-standing GaN substrate was also fabricated by the PAS method, indicating its good scalability.

Photoluminescence Emission Efficiency Analysis Methodology by Integrating Raman Spectroscopy of the A1(LO) and E2(high) Phonons in a GaInN/GaN Heterostructure

Microscopic lattice vibration images of the E2(high) mode (E2H) and another mode of A1(LO) (A1L) or the higher energy branch of LO‐phonon−plasmon coupling mode (LOPC+) in a Ga0.95In0.05N film on a GaN template are obtained by Raman scattering spectroscopy using a 325 nm laser. The increase in temperature by increasing the laser power is obtained from the decrease in the energy of E2H and the theoretical formula comprising two terms based on the mode energy variation of the bulk material and the thermal strain effect. Using the obtained temperature and the energy shift of the LOPC+, the mapping images of the temperature and electron density in the x–y plane are simultaneously obtained. This image provides the spatial variation of photoluminescence (PL) emission efficiency, given as PL intensity per electron. This method enables the quantitative discussion on photo‐emission efficiency even in the regions of low or high carrier density affected by carrier transport. In the investigated area, a region with a lower PL efficiency is found despite a higher electron density and lower temperature increase than the surrounding region. This imaging analysis is feasible in integrating the carrier and thermal energy transports and recombination processes in carrier dynamics study.

Spatially correlated stress-photoluminescence evolution in GaN/AlN multi-quantum wells

In the manufacture of semiconductor devices, cracking of heterostructures has been recognized as a major obstacle for their post-growth processing. In this work, we explore cracked GaN/AlN multi-quantum wells (MQWs) to study the influence of pressure on the recombination energy of the photoluminescence (PL) from the polar GaN QWs. We grow GaN/AlN MQWs on a GaN(0001)/sapphire template, which provides 2.4% tensile strain for epitaxial AlN. This strain relaxes through the generation and propagation of cracks, resulting in a final inhomogeneous distribution of stress throughout the film. The crack-induced strain variation investigated by micro-Raman spectroscopy and X-ray diffraction mapping revealed a correlation between the spacing of the cracks and the amount of strain between them. We have developed a 2D model that allows us to calculate the spatial variation of the in-plane strain in the GaN and AlN layers. The measured values of compressive in-plane strain in the GaN QWs vary from -0.4 % away from cracks, to -0.7 % near cracks. PL from the GaN QWs exhibits a clear correlation to the varying strain resulting in an energy shift of ∼ 140 meV. As a result, we can experimentally calculate a pressure coefficient of PL energy of ∼ -60.4 meV/GPa for the ∼ 7 nm thick polar GaN QWs. This agrees well with the previously predicted theoretical results by Kaminska et al. in 2016 [DOI: 10.1063/1.4962282], which were demonstrated to break down for such wide QWs. We will discuss this difference with respect to the reduction in both the expected point defects and extended defects resulting from not doping and growth on a GaN template, respectively. As a result, our work indicates that cracks can be utilized for investigating some fundamental material properties related to strain effects.

Demonstration of GaN-channel high electron mobility transistors with regrown InAs/GaAs source and drain

We demonstrated the crystal growth of group-III arsenides (III-As) on GaN via an arsenidation layer and GaN-channel electron mobility transistors (HEMTs) with a regrowth InAs/GaAs source and drain (S/D) region. By annealing under an AsH3 atmosphere, the surface of a GaN (0001) template is arsenided. We grew ⟨111⟩ oriented InAs and GaAs on arsenided GaN. Silicon-doped n-type InAs with a carrier mobility of over 1500 cm2/V s and a carrier concentration of over 1 × 1019 cm−3 was successfully obtained. The fabrication process and direct-current characteristics of GaN-channel HEMTs with the regrown Si-doped InAs/GaAs S/D region were demonstrated for the first time. A maximum transconductance estimated from transfer characteristics was as high as ∼195 mS/mm for the HEMT with a gate length of 2 μm without passivation, which is comparable to those for the HEMT without any S/D regrowth. The impact of the InAs/GaAs S/D region on the on-resistance of the fabricated HEMTs was estimated to be ∼0.9 Ω mm, which can be reduced by optimizing the device structures and process conditions. These results indicate that the process of GaN arsenidation and III-As regrowth can be used without any device performance degradation. Therefore, further lowering the ohmic contact resistivity and on-resistance of GaN-channel HEMTs is possible by maturing the manufacturing-process technology of III-As-contained GaN-channel HEMTs.

High-speed performance self-powered short wave ultraviolet radiation detectors based on κ(ε)-Ga2O3

High-speed solar-blind short wavelength ultraviolet radiation detectors based on κ(ε)-Ga2O3 layers with Pt contacts were demonstrated and their properties were studied in detail. The κ(ε)-Ga2O3 layers were deposited by the halide vapor phase epitaxy on patterned GaN templates with sapphire substrates. The spectral dependencies of the photoelectric properties of structures were analyzed in the wavelength interval 200–370 nm. The maximum photo to dark current ratio, responsivity, detectivity and external quantum efficiency of structures were determined as: 180.86 arb. un., 3.57 A/W, 1.78 × 1012 Hz0.5∙cm∙W−1 and 2193.6%, respectively, at a wavelength of 200 nm and an applied voltage of 1 V. The enhancement of the photoresponse was caused by the decrease in the Schottky barrier at the Pt/κ(ε)−Ga2O3 interface under ultraviolet exposure. The detectors demonstrated could functionalize in self-powered mode due to built-in electric field at the Pt/κ(ε)-Ga2O3 interface. The responsivity and external quantum efficiency of the structures at a wavelength of 254 nm and zero applied voltage were 0.9 mA/W and 0.46%, respectively. The rise and decay times in self-powered mode did not exceed 100 ms.

Optical and Electrical Properties of AlxGa1-xN/GaN Epilayers Modulated by Aluminum Content.

AlGaN-based LEDs are promising for many applications in deep ultraviolet fields, especially for water-purification projects, air sterilization, fluorescence sensing, etc. However, in order to realize these potentials, it is critical to understand the factors that influence the optical and electrical properties of the device. In this work, AlxGa1-xN (x = 0.24, 0.34, 0.47) epilayers grown on c-plane patterned sapphire substrate with GaN template by the metal organic chemical vapor deposition (MOCVD). It is demonstrated that the increase of the aluminum content leads to the deterioration of the surface morphology and crystal quality of the AlGaN epitaxial layer. The dislocation densities of AlxGa1-xN epilayers were determined from symmetric and asymmetric planes of the ω-scan rocking curve and the minimum value is 1.01 × 109 cm-2. The (101¯5) plane reciprocal space mapping was employed to measure the in-plane strain of the AlxGa1-xN layers grown on GaN. The surface barrier heights of the AlxGa1-xN samples derived from XPS are 1.57, 1.65, and 1.75 eV, respectively. The results of the bandgap obtained by PL spectroscopy are in good accordance with those of XRD. The Hall mobility and sheet electron concentration of the samples are successfully determined by preparing simple indium sphere electrodes.

Electrical properties and structural optimization of GaN/InGaN/GaN tunnel junctions grown by molecular beam epitaxy

The InGaN films and GaN/InGaN/GaN tunnel junctions (TJs) were grown on GaN templates with plasma-assisted molecular beam epitaxy. As the In content increases, the quality of InGaN films grown on GaN templates decreases and the surface roughness of the samples increases. V-pits and trench defects were not found in the AFM images. p++-GaN/InGaN/n++-GaN TJs were investigated for various In content, InGaN thicknesses and doping concentration in the InGaN insert layer. The InGaN insert layer can promote good interband tunneling in GaN/InGaN/GaN TJ and significantly reduce operating voltage when doping is sufficiently high. The current density increases with increasing In content for the 3 nm InGaN insert layer, which is achieved by reducing the depletion zone width and the height of the potential barrier. At a forward current density of 500 A/cm2, the measured voltage was 4.31 V and the differential resistance was measured to be 3.75 × 10−3 Ω·cm2 for the device with a 3 nm p++-In0.35Ga0.65N insert layer. When the thickness of the In0.35Ga0.65N layer is closer to the “balanced” thickness, the TJ current density is higher. If the thickness is too high or too low, the width of the depletion zone will increase and the current density will decrease. The undoped InGaN layer has a better performance than n-type doping in the TJ. Polarization-engineered tunnel junctions can enhance the functionality and performance of electronic and optoelectronic devices.

Stability of Interface Morphology and Thermal Boundary Conductance of Direct Wafer Bonded GaN|Si Heterojunction Interfaces Annealed at Growth and Annealing Temperatures

The properties of thin (~2 um) GaN templates on a silicon support substrate were studied to assess the stability of the direct wafer bonded GaN / Si interface. EVG® ComBond® equipment was used for bonding under high vacuum (~10-8 mtorr) at room temperature to remove unwanted native surface oxides [1,2]. For the bonded samples, the [1010] GaN edge was aligned parallel to the Si [110] edge. An X-ray diffraction reciprocal space map of the (004) Si and (0004) GaN revealed that there is a ~0.2° tilt between the GaN and Si layers and is simply due to the relative miscut between the two wafers. The treatment of the surfaces prior to bonding produces an amorphous region at the bonded interface that has been seen in many other bonded systems [3-5]. In the as-bonded sample, high resolution scanning transmission electron microscopy revealed a ~2 nm amorphous region on the Si side of the bonded interface, as confirmed by energy dispersive x-ray spectroscopy (EDX). Subsequent annealing was performed in an effort to recrystallize the amorphous interface. Previous work has shown that recrystallization between Si|Si wafer bonded samples occurred when annealed at 450 °C for 12 hours [3]. However, in the GaN|Si system, we found that the amorphous interface did not recrystallize when annealed under those conditions. Annealing at temperatures up to 450 °C and 120 hours showed only initial stages of interdiffusion and a stable interface. However, after annealing at 700 °C for 24 hours, high resolution EDX revealed the formation of amorphous SiN as well as the diffusion of gallium into silicon.Preliminary thermal results show that the thermal boundary conductance (TBC) of the as bonded sample is ~140 MW/(m2K). The TBC results of wafer bonded GaN|Si reported here is higher than previously reported TBC values of epitaxially grown interfaces such as GaN on Si [6], GaN on SiC [7], and GaN on diamond [8]. The TBC for the annealed interface is degraded by a factor of two compared to the as-bonded interface for the sample that was annealed at 700 °C for 24 hours. These results demonstrate that high TBC can be achieved through wafer bonding of GaN with materials such as silicon and that such interfaces are stable even up to device operation up to 300 °C. However, chemically rough interfaces formed due to high temperature annealing are detrimental to thermal transport across these interfaces. V. Dragoi, et al., ECS Trans., 86(5), 23 (2018)C. Flötgen, et al., ECS Trans., 64(5), 103 (2014)M.E. Liao, et al., ECS Trans., 86(5), 55 (2018)Y. Xu, et al., Ceramics International, 45, 6552 (2019)F. Mu, et al., Appl. Surf. Sci., 416, 1007 (2017)L. Yates, et al., ASME InterPACK (2015)J. Cho, et al., Phys. Rev. B, 89, 115301 (2014)H. Sun, et al., APL, 106(11), 111906 (2015) Figure 1

2D-Material-Assisted GaN Growth on GaN Template by MOCVD and Its Exfoliation Strategy.

The production of freestanding membranes using two-dimensional (2D) materials often involves techniques such as van der Waals (vdW) epitaxy, quasi-vdW epitaxy, and remote epitaxy. However, a challenge arises when attempting to manufacture freestanding GaN by using these 2D-material-assisted growth techniques. The issue lies in securing stability, as high-temperature growth conditions under metal-organic chemical vapor deposition (MOCVD) can cause damage to the 2D materials due to GaN decomposition of the substrate. Even when GaN is successfully grown using this method, damage to the 2D material leads to direct bonding with the substrate, making the exfoliation of the grown GaN nearly impossible. This study introduces an approach for GaN growth and exfoliation on 2D material/GaN templates. First, graphene and hexagonal boron nitride (h-BN) were transferred onto the GaN template, creating stable conditions under high temperatures and various gases in MOCVD. GaN was grown in a two-step process at 750 and 900 °C, ensuring exfoliation in cases where the 2D materials remained intact. Essentially, while it is challenging to grow GaN on 2D material/GaN using only MOCVD, this study demonstrates that with effective protection of the 2D material, the grown GaN can endure high temperatures and still be exfoliated. Furthermore, these results support that vdW epitaxy and remote epitaxy principle are not only possible with specific equipment but also applicable generally.

Enhancing microstructure and device performance of InGaN quantum dot micro-LEDs through substrate off-cut angle modulation

InGaN quantum dots (QDs) are regarded as a compelling candidate material for the fabrication of high-quality GaN-based micro-LEDs. In this work, to study the impact of a substrate structure on InGaN QDs and QD-based micro-LEDs, GaN-on-sapphire substrates with off-cut angles toward the a-axis of 0.2°, 0.4°, and 0.7° were utilized as templates for the fabrication of InGaN QDs and InGaN QDs-based micro-LEDs. Experimental results show that GaN template with 0.4° off-cut angle exhibits the narrowest terrace width and enables InGaN QDs to be higher and more uniform. The InGaN QD sample grown on 0.4° substrate has a very small wavelength shift of 2.5 nm with temperature increasing and owns the longest photoluminescence peak wavelength implying the highest In content. Furthermore, electroluminescence (EL) spectra demonstrate that QD-based micro-LED array has excellent wavelength stability under various injection currents, and the stability can be improved further on a GaN template with narrower terraces. The results indicate that altering the terrace width of GaN template is a feasible scheme for improving the properties of GaN-based micro-LEDs.

Ultrahigh density InGaN/GaN nanopyramid quantum dots for visible emissions with high quantum efficiency

In this study, the selective area epitaxy (SAE) of InGaN/GaN nanopyramid quantum dots (QDs) on a block copolymer patterned (BCP) GaN template using metalorganic chemical vapor deposition is reported. The pattern transfer process and SAE process are developed to enable a ultrahigh density of 7–9 × 1010 cm−2 QD formation with a feature size of 20–35 nm. The growth mechanism and geometrical properties of the QDs were investigated by scanning electron microscopy and cross-sectional transmission electron microscopy, showing the nanopyramid QD structure with InGaN grown on semipolar {101¯1} planes. The optical characteristics of the nanopyramid QDs were examined by microphotoluminescence measurements. We observed QD emission centered at 488 and 514 nm, depending on the growth temperature employed. These emissions were found to be longer wavelength than those from a planar quantum well structure. This can be attributed to the combined effects of higher indium incorporation along the semipolar plane and a larger InGaN thickness. Furthermore, we also found that the QD emission intensity increases as the number of InGaN layers increases without wavelength shift, indicating a constant growth rate and indium incorporation along the semipolar plane after the formation of the nanopyramid structure. The internal quantum efficiency is estimated to be over 60% by comparing the photoluminescence (PL) intensity of QDs at low temperature and room temperature. PL emission wavelength shows an 11 nm blue shift, while the full width at half maximum decreases from 68 (351 meV) to 56 nm (303 meV) from room temperature to low temperature. By employing BCP lithography and SAE technique, we successfully demonstrated that ultrahigh density, small size InGaN/GaN nanopyramid QDs with visible emission were achieved, which could be a potential active region for QD light-emitting diodes and/or lasers.

Large-Area MoS2 Films Grown on Sapphire and GaN Substrates by Pulsed Laser Deposition.

In this paper, we present the preparation of few-layer MoS2 films on single-crystal sapphire, as well as on heteroepitaxial GaN templates on sapphire substrates, using the pulsed laser deposition (PLD) technique. Detailed structural and chemical characterization of the films were performed using Raman spectroscopy, X-ray photoelectron spectroscopy, X-ray diffraction measurements, and high-resolution transmission electron microscopy. According to X-ray diffraction studies, the films exhibit epitaxial growth, indicating a good in-plane alignment. Furthermore, the films demonstrate uniform thickness on large areas, as confirmed by Raman spectroscopy. The lateral electrical current transport of the MoS2 grown on sapphire was investigated by temperature (T)-dependent sheet resistance and Hall effect measurements, showing a high n-type doping of the semiconducting films (ns from ~1 × 1013 to ~3.4 × 1013 cm-2 from T = 300 K to 500 K), with a donor ionization energy of Ei = 93 ± 8 meV and a mobility decreasing with T. Finally, the vertical current injection across the MoS2/GaN heterojunction was investigated by means of conductive atomic force microscopy, showing the rectifying behavior of the I-V characteristics with a Schottky barrier height of ϕB ≈ 0.36 eV. The obtained results pave the way for the scalable application of PLD-grown MoS2 on GaN in electronics/optoelectronics.

Construction of organic/GaN heterostructures for DUV-to-NIR broadband photodetection.

Herein, a broadband photodetector (BPD) is constructed with consistent and stable detection abilities for deep ultraviolet to near-infrared spectral range. The BPD integrates the GaN template with a hybrid organic semiconductor, PM6:Y6, via the spin-coating process, and is fabricated in the form of asymmetric metal-semiconductor-metal structure. Under an optimal voltage, the device shows consistent photoresponse within 254 to 850 nm, featuring high responsivity (10 to 60 A/W), photo-to-dark-current ratio over 103, and fast response time. These results show the potential of such organic/GaN heterojunctions as a simple and effective strategy to build BPDs for a reliable photo-sensing application in the future.

Regrowth characteristics of semipolar (11–22) GaN epitaxial film on corroded semipolar GaN template

Semipolar (11–22) GaN epitaxial film was grown by metal-organic chemical vapor deposition (MOCVD) on a prismatic structure corroded (11–22) GaN template prepared by wet chemical etching method. The X-ray rocking curves (XRCs) of on-axis and off-axis (11–22) GaN reflection planes were measured, and the results demonstrate that (11–22) GaN epitaxial film grown on the corroded GaN template can improve the crystal quality by reducing the defects such as basal stacking faults (BSFs) and partial dislocations (PDs). The SEM analysis for the semipolar GaN epitaxial film grown on the corroded GaN template and untreated GaN template also show that the mosaic grain size of GaN epitaxial film grown on the corroded GaN template is larger than that untreated one. The photoluminescence (PL) spectrum of the semipolar GaN epitaxial film grown on the corroded GaN template may also indicate better crystal quality. Besides, we found that the recombination mechanism in BSFs defects was dominated by radiative recombination. In our case, our research demonstrates that the crystal quality of semipolar GaN epitaxial films can be improved by regrowing GaN film on corroded GaN template.

Role of inserting an InGaN strain release interlayer in AlGaN growth

AlGaN grown on a GaN template usually suffers tensile stress, and the accumulated tensile stress may cause formation of cracks. In this paper, a method to reduce the tensile stress during AlGaN growth by inserting an InGaN interlayer is proposed. Although InGaN has a larger in-plane lattice constant, it will not cause the subsequent growth of AlGaN to be subject to greater tensile stress if InGaN is coherently grown on AlGaN. On the contrary, due to the low thermal expansion coefficient of InGaN, the subsequent growth of AlGaN will suffer less tensile stress through an asymmetric temperature varying process. The validity of this method was verified by in-situ curvature monitor, reciprocal space mapping and temperature-dependent Raman spectral observation. In addition, it is found by atomic force microscopy and scanning electron microscopy that the insertion of InGaN interlayer introduces V-shaped pits into the AlGaN structure which can be refilled by later AlGaN growth. It is inferred that they may play additional role in stress release similar to what the patterned substrate usually does.