GaN Cap Research Articles

Boosting the two-dimensional electron gas density of Al0.20Ga0.80N/GaN heterostructures by regrowth of an epitaxial Sc0.18Al0.82N layer

Sc-alloyed AlN epilayers were grown on commercial GaN/sapphire templates by molecular beam epitaxy (MBE) to validate the Sc composition of 18% and in-plane lattice matching with GaN. As-grown Sc0.18Al0.82N/GaN heterostructure exhibits a two-dimensional electron gas (2DEG) density of 3.58 × 1013 (2.96 × 1013) cm−2 and a mobility of 241 (295) cm2⋅V−1⋅s−1 at 300 (77) K, demonstrating the feasibility of employing its high spontaneous polarization toward high 2DEG density and highlighting detrimental impurity scattering due to the regrowth interface. Implementation of AlN impurity blocking layers boosts 2DEG mobility to 1290 (8730) cm2 V−1⋅s−1at 300 (77) K. In addition, we have engineered a surface-treatment strategy to selectively decompose the 2.5-nm-thick GaN cap layer of commercial GaN(2.5 nm)/Al0.20Ga0.80N(22 nm)/GaN heterostructure epi-wafers at high temperature prior to MBE regrowth of Sc0.18Al0.82N to eliminate impurity incorporation at the regrowth interface. Regrowth of a Sc0.18Al0.82N layer on the pristine Al0.20Ga0.80N surface increases 2DEG density from 7.89 × 1012 to 9.57 × 1012 cm−2, together with a slight reduction in mobility from 2160 to 1970 cm2⋅V−1⋅s−1 at 300 K, reducing the sheet resistance by 10%. Our calculation implies that it is practical to boost 2DEG density to over 2.0 × 1013 cm−2 by thinning Al0.20Ga0.80N down to 4 nm.

Growth and performance of n++ GaN cap layer for HEMTs applications

Apart from providing high-quality ohmic contacts to III-N devices, n++ GaN cap layers can eliminate surface-related current collapse effects in high-electron-mobility transistors (HEMTs). Various metal-organic chemical vapor deposition conditions and n-type doping are tested in GaN growth on sapphire by using triethylgallium as a Ga precursor, replacing more conventional trimethylgallium. Consequently, despite relatively low temperature of the growth at 800 °C to facilitate InAlN barrier capping, optimized growth conditions and SiH4 flow provided free electron concentration of 7.2 × 1019 cm−3 and mobility of 103 cm2/Vs. Moreover, electron concentration in the range of 1020 cm−3 is demonstrated by using flow modulation epitaxy. On the other hand, as calibration growths indicated, excessive SiH4 flow alone can lead to high density of edge dislocations and surface undulations without enhancing free electron concentration. 6 nm (Si: 4.2 × 1019 cm−3) and 8 nm thick (Si: 7.2 × 1019 cm−3) n++ GaN cap is implemented in normally-off n++ GaN/InAlN/AlN/GaN HEMTs grown on Si, with a collapse-free performance for the latter case. By calculating energy band and free carrier concentration profiles of the heterostructures it is shown, that free electrons of a sufficiently thick and doped n++ GaN cap can shield the channel from the unstable surface potential.

Enhanced device performance of GaN high electron mobility transistors with in situ crystalline SiN cap layer

In this paper, a ∼2 nm in situ SiN cap layer on AlGaN barrier layer is grown, which is revealed to be crystalline using high-resolution cross-sectional transmission electron microscopy. Benefitting from superior interface quality of epitaxial crystalline SiN/AlGaN interface, the gate diodes with in situ SiN cap layer feature lower interface trap state density than that with GaN cap layer. By comparing the GaN high electron mobility transistors (HEMTs) with the conventional GaN cap layer, the GaN HEMTs with in situ SiN cap layer exhibit improved device performance, showing higher electron mobility, higher drain current, larger on/off current ratio, and higher transconductance. For breakdown characteristics, the devices with in situ crystalline SiN cap layer show prominent advantages over the GaN cap layer with a 30% breakdown voltage increase to 810 V.

Breakdown voltage enhancement and specific on-resistance reduction in depletion-mode GaN HEMTs by co-modulating electric field

In this letter, a depletion-mode GaN high electron mobility transistors (GaN HEMTs) with high breakdown voltage and low on-resistance are designed and experimentally demonstrated. It combines the gate field plate and partial unintentionally doped GaN (u-GaN) cap layer (gate field plate and partial u-GaN cap HEMTs: GPU-HEMTs) to co-modulate the surface electric field distribution, which results in the electric field peak being far away from the gate edge, thus improving the breakdown voltage and decreasing the on-resistance. The optimized GPU-HEMTs exhibit a larger output current (I DS) of 495 mA mm−1 and a correspondingly smaller specific on-resistance of 4.26 mΩ·cm2. Meanwhile, a high breakdown voltage of 1044 V at I DS = 1 mA mm−1 compared to the conventional GaN HEMTs of 633 V was obtained. This approach is highly effective in simultaneously optimizing the breakdown voltage and the specific on-resistance of GaN HEMTs, while maintaining a large output current.

Effect of temperature on the stability and performance of III-nitride HEMT magnetic field sensors

The study aimed to investigate the underlying physics limiting the temperature stability and performance of non-surface passivated Al0.34Ga0.66N/GaN Hall effect sensors, including contacts, under atmospheric conditions. The results obtained from analyzing the microstructural evolution in the Al0.34Ga0.66N/GaN Hall sensor heterostructure were found to correlate with the electrical performance of the Hall effect sensor. High-resolution x-ray photoelectron spectroscopy studies revealed the signature of surface oxidation in the GaN cap layer, as well as a slight out-diffusion of “Al” from the AlGaN barrier layer. To prevent the formation of a bumpy surface morphology at the Ohmic contact, we investigated the impact of “Pt” top Ohmic contacts. The application of a top “Pt” contact stack resulted in a smooth Ohmic contact surface and provided evidence that the bumpy surface morphology in Au-based Ohmic contacts is due to the formation of an Al-Au viscous alloy during rapid thermal annealing. In the early stages of thermal aging, the small drop in contact resistivity stabilized with subsequent thermal aging past the initial 550 h at 200 °C. The outcome is that the Al0.34Ga0.66N/GaN Hall effect sensors, even without surface passivation, exhibited a stable response to applied magnetic fields with no sign of significant degradation after 2800 h of thermal aging at 200 °C under atmospheric conditions. This observed stability in the Hall sensor without surface passivation can be attributed to a self-imposed surface oxidation of the cap layer during the early stages of aging, which serves as a protective layer for the device during subsequent extended periods of thermal aging at 200 °C.

Investigation of High-Sensitivity pH Sensor Based on Au-Gated AlGaN/GaN Heterostructure

A high-sensitivity pH sensor based on an AlGaN/GaN high-electron mobility transistor (HEMT) with a 10 nm thick Au-gated sensing membrane was investigated. The Au nanolayer as a sensing membrane was deposited by electron-beam evaporation and patterned onto the GaN cap layer, which provides more surface-active sites and a more robust adsorption capacity for hydrogen ions (H+) and hydroxide ions (OH−) and thus the sensitivity of the sensor can be significantly enhanced. A quasi-reference electrode was used to minimize the sensing system for the measurement of the microliter solution. The measurement and analysis results demonstrate that the fabricated sensor exhibits a high potential sensitivity of 58.59 mV/pH, which is very close to the Nernstian limit. The current sensitivity is as high as 372.37 μA/pH in the pH range from 4.0 to 9.18, under a 3.5 V drain-source voltage and a 0 V reference-source voltage. Comparison experiments show that the current sensitivity of the Au-gated sensor can reach 3.9 times that of the SiO2-gated sensor. Dynamic titration experiments reveal the pH sensor’s ability to promptly respond to immediate pH variations. These findings indicate that this pH sensor can meet most application requirements for advanced medical and chemical analysis.

Presence of High Density Positive Fixed Charges at ALD–Al2O3/GaN (cap) Interface for Efficient Recovery of 2‐DEG in Ultrathin‐Barrier AlGaN/GaN Heterostructure

The ultrathin‐barrier (UTB) AlGaN/GaN heterostructure exhibits great promise as a technology for manufacturing high‐performance normally OFF GaN metal–insulator–semiconductor high‐electron‐mobility transistors (MIS–HEMTs) due to its unique gate recess‐free feature. However, a critical challenge in UTB MIS–HEMTs is the recovery of the 2D electron gas in the access region, particularly with regard to achieving low ON resistance. In this study, a new approach is proposed to address this issue by utilizing a low‐thermal‐budget Al2O3 film grown through atomic layer deposition (ALD). By analyzing the capacitance–voltage characteristic and correlating it with the threshold voltage shift versus dielectric thicknesses for SiNx and Al2O3, high density of positive fixed charges (≈2.382 × 1013 cm−2) is confirmed to be induced at the interface between ALD–Al2O3 and GaN (cap), which is also in good agreement with 1D Poisson simulations of energy band diagrams. The positive charges are probably originated from the interface AlAl bonds revealed by X‐Ray photoelectron spectroscopy analysis.

Digital etching of AlGaN/GaN heterostructures with GaN cap using inductively coupled oxygen plasma process combined with wet chemical treatment

In this work, AlGaN with a GaN cap has been etched in a cyclical process with ICP-RIE O2 plasma oxidation and wet etching in dilute HCl. The oxygen plasma ICP-RIE etching of the AlGaN at an ICP plasma power of 200 W and radio frequency bias power of 100 W led to an etch depth of ∼1.5 nm per digital cycle with increased surface roughness. The AlGaN remained unaffected by the wet etching process alone without any ICP-RIE O2 plasma oxidation, maintaining a surface roughness similar to that of the substrate. AlGaN was etched to a depth of ∼12 nm after six cycles of digital etching with an etch rate of 1.9–2.1 nm/cycle showing an improved surface roughness. The XPS analysis at each stage of the etching process reveals that the O2 plasma oxidation initially oxidizes the GaN cap and the AlGaN layer and is later effectively removed by the HCl solution. The digital etching method has proven effective in controlling etch depth and surface roughness, which are needed to fabricate AlGaN high electron mobility transistors.

High-efficiency green light emission from InGaN/GaN using localized surface plasmon resonance tuned by combination of Ag nanoparticles and dielectric thin film

We achieved significant enhancements in green light emission (550 nm) from InGaN/GaN quantum wells (QWs) by tuning the localized surface plasmon resonance (LSPR) of self-assembled Ag nanoparticles (NPs) through the application of a SiO2 thin film. The LSPR wavelength of Ag NPs was shifted towards shorter wavelengths by 80 nm using a 5 nm SiO2 layer to separate Ag NPs from GaN surface, thereby aligning it effectively with the green region. This strategic placement of Ag NPs and a 5 nm SiO2 film resulted in significant enhancements of photoluminescence (PL) by 15- and 8.8-fold with 5 and 11 nm GaN cap layers, respectively. The LSPR of Ag NPs on a SiO2 thin film facilitated a longer possible distance for the coupling between surface plasmons (SPs) and excitons in a QW. Traditionally, the distance between SPs-generating metal and a QW has been maintained at 10 nm to achieve substantial enhancements. Remarkably, even with a 25 nm cap layer, Ag NPs on a 5 nm SiO2 film boosted PL by 3.1-fold. The enhancements attributable to Ag NPs on SiO2 films were superior, reaching up to 4.8 times greater than those of Ag NPs on GaN surfaces. Additionally, the PL enhancement factors calculated using the finite differential time domain (FDTD) method aligned closely with experimental results.

Demonstration of HCl-Based Selective Wet Etching for N-Polar GaN with 42:1 Selectivity to Al0.24Ga0.76N

A wet-etching technique based on a mixture of hydrochloric (HCl) and nitric (HNO3) acids is introduced, demonstrating exceptional 42:1 selectivity for etching N-polar GaN over Al0.24Ga0.76N. In the absence of an AlGaN etch stop layer, the etchant primarily targets N-polar unintentionally doped (UID) GaN, indicating its potential as a suitable replacement for selective dry etches in the fabrication of GaN high-electron-mobility transistors (HEMTs). The efficacy and selectivity of this etchant were confirmed through its application to a gate recess module of a deep-recess HEMT, where, despite a 228% over-etch, the 2.6 nm AlGaN etch stop layer remained intact. We also evaluated the proposed method for the selective etching of the GaN cap in the n+ regrowth process, achieving a contact resistance matching that of a BCl3/SF6 ICP process. These findings underscore the applicability and versatility of the etchant in both the electronic and photonic domains and are particularly applicable to the development of N-polar deep-recess HEMTs.

Effect of GaN Cap Thickness on the DC Performance of AlGaN/GaN HEMTs.

We prepared AlGaN/GaN high electron mobility transistors (HEMTs) with GaN cap thicknesses of 0, 1, 3, and 5 nm and compared the material characteristics and device performances. It was found that the surface morphology of the epitaxial layer was effectively improved after the introduction of the GaN cap layer. With the increase of the GaN cap thickness, the carrier concentration (ns) decreased and the carrier mobility (μH) increased. Although the drain saturation current (IdSat) of the device decreased with the increasing GaN cap thickness, the excessively thin GaN layer was not suitable for the cap layer. The thicker GaN layer not only improved the surface topography of the epitaxial layer but also effectively improved the off-state characteristics of the device. The optimal cap thickness was determined to be 3 nm. With the introduction of the 3 nm GaN cap, the IdSat was not significantly reduced. However, both the off-state gate leakage current (IgLeak) and the off-state leakage current (IdLeak) decreased by about two orders of magnitude, and the breakdown voltage (BV) increased by about 70 V.

Enhancing the Performance of GaN-Based Light-Emitting Diodes by Incorporating a Junction-Type Last Quantum Barrier

In this paper, an n-i-p-type GaN barrier for the final quantum well, which is closest to the p-type GaN cap layer, is proposed for nitride light-emitting diodes (LEDs) to enhance the confinement of electrons and to improve the efficiency of hole injection. The performances of GaN-based LEDs with a traditional GaN barrier and with our proposed n-i-p GaN barrier were simulated and analyzed in detail. It was observed that, with our newly designed n-i-p GaN barrier, the performances of the LEDs were improved, including a higher light output power, a lower threshold voltage, and a stronger electroluminescence emission intensity. The light output power can be remarkably boosted by 105% at an injection current density of 100 A/cm2 in comparison with a traditional LED. These improvements originated from the proposed n-i-p GaN barrier, which induces a strong reverse electrostatic field in the n-i-p GaN barrier. This field not only enhances the confinement of electrons but also improves the efficiency of hole injection.

High-efficiency InGaN red light-emitting diodes with external quantum efficiency of 10.5% using extended quantum well structure with AlGaN interlayers

In this study, we have demonstrated a high-efficiency InGaN red (625 nm) light-emitting diode (LED) with an external quantum efficiency (EQE) of 10.5% at a current density of 10 A/cm2. To achieve this, we introduced GaN cap layers on InGaN quantum wells and AlGaN interlayers. The introduction of these layers resulted in a red shift of the wavelength. The AlGaN interlayer caused band bending, while the GaN cap layer modulated the electron wavefunction, thus helping to achieve the wavelength red shift of the InGaN red LED with high EQE. This technology is crucial for the realization of discrete or monolithic full-color micro-LED displays.

Effect of GaN cap layer towards ohmic contact of open-gate Cr AlGaN/GaN high electron mobility transistor

Effect of GaN cap layer towards ohmic contact of open-gate Cr AlGaN/GaN high electron mobility transistor

High-performance enhancement-mode GaN-based p-FETs fabricated with O3-Al2O3/HfO2-stacked gate dielectric

In this letter, an enhancement-mode (E-mode) GaN p-channel field-effect transistor (p-FET) with a high current density of −4.9 mA/mm based on a O3-Al2O3/HfO2 (5/15 nm) stacked gate dielectric was demonstrated on a p++-GaN/p-GaN/AlN/AlGaN/AlN/GaN/Si heterostructure. Attributed to the p++-GaN capping layer, a good linear ohmic I−V characteristic featuring a low-contact resistivity (ρ c) of 1.34 × 10−4 Ω·cm2 was obtained. High gate leakage associated with the HfO2 high-k gate dielectric was effectively blocked by the 5-nm O3-Al2O3 insertion layer grown by atomic layer deposition, contributing to a high I ON/I OFF ratio of 6 × 106 and a remarkably reduced subthreshold swing (SS) in the fabricated p-FETs. The proposed structure is compelling for energy-efficient GaN complementary logic (CL) circuits.

Strategy for reliable growth of thin GaN Caps on AlGaN HEMT structures

This paper presents the growth of thin GaN capping layers on standard AlGaN HEMT structures. It has been found that the reliable growth of thin (≤5nm) GaN capping layers by organometallic vapour phase epitaxy is challenging as GaN is unstable at high growth temperatures even in atmospheres with high ammonia partial pressure. To overcome this challenge a growth strategy based on the controlled desorption of GaN has been adopted. By intentionally growing thicker than desired capping layers and controlling the desorption during the cool down after growth it is feasible to reliably grow high quality GaN capping layers with a specific target thickness. The development of the controlled desorption process has been simplified by predicting the desorption based on the computer controlled cooling ramp and the temperature dependent GaN desorption rate. The latter was obtained by analysing in-situ reflectance traces for relevant growth conditions. Moreover, examples on how to identify exposed AlGaN barriers, i.e. without intact GaN caps, by TEM and AFM are presented.

Linearity improvement in graded channel AlGaN/GaN HEMTs for high-speed applications

AlGaN HEMTs are popular devices for high-frequency applications. At higher frequencies, nonlinearity effects are major concerns and need serious attention. In this work, we have attempted to improve the linearity performance of graded channel Al x Ga1−x N/GaN HEMTs in comparison with abrupt channel GaN HEMTs through Technology Computer Aided (TCAD) simulation. In graded channel HEMTs, linearly grading of Al composition in the AlGaN layer, reduces the local carrier densities and provides improvement in the carrier saturation velocity. This provides an avenue to improve the overall linearity performance. A complete set of figures of merits (FOMs) such as and for both devices are presented. The simulation results have been calibrated with reported experimental results available in the literature. The graded devices are observed to have better transconductance (g m ) and drain current for gate voltages greater than −2 V. The drop in g m is reduced by nearly 50% at the higher gate-to-source voltages. Moreover, the RF figure of merits such as the current gain cutoff frequency (f T) and a maximum frequency of oscillation (f max) have been calculated for both devices. Due to the graded channel f T increases by 20% and f max becomes twice which makes it a better choice for high-voltage and high-power applications. The impact of interface trap and leakage current performance on the graded channel device are also reported. The cutoff frequency reduces by 25% with an increase in trap charge concentration from 9e17 cm−2 to 1e19 cm−2. Also, it has been found that the graded channel device shows better linearity and lower intermodulation distortion in comparison to the abrupt device which has been calculated from the linearity parameters. The high gate leakage current in the case of the graded channel device can be reduced by adding a thin GaN cap layer on the AlGaN channel which can be a future prospect of improving the performance of the graded GaN device.

N-type conducting AlInN/GaN distributed Bragg reflectors with AlGaN graded layers

We obtained a 40-pair Si-doped n-type conducting AlInN/GaN distributed Bragg reflector (DBR) with a low surface pit density, 3.0 × 106 cm−2, by introducing 5 nm Si-doped Al0.39Ga0.61N graded layers grown at high temperature, 1150 °C. A combination of a 0.6 nm GaN cap layer on AlInN and a subsequent thermal cleaning during a temperature increase process up to 1150 °C for the following AlGaN graded layer growth was effective for a suppression of pit/threading dislocation generations at the interfaces of the AlInN layers and the AlGaN graded layers in the DBRs without any additional cleaning processes. We also found that an initial AlN mole fraction of 0.39 in the graded AlGaN layers provided the lowest vertical resistance of the Si-doped AlInN/GaN DBRs with the Si-doped AlGaN graded layers, suggesting that Al0.39Ga0.61N provides the lowest potential spike in the conduction band of the interface with Al0.82In0.18N among AlGaN alloys.

Metal-semiconductor direct-current triboelectric nanogenerator based on depletion mode u-GaN/AlGaN/AlN/GaN HEMT

The urgent need for renewable energy source has led to a significant interest in triboelectric nanogenerators (TENGs) as a new energy technology. In contrast to traditional polymer TENGs, semiconductor direct-current TENGs are more suitable for miniaturization and integration with electronic devices. This study proposes a friction material made of depletion mode GaN high electron mobility transistors (HEMTs), which exhibit superior properties such as high two-dimensional electron gas concentration. By sliding a titanium sheet on a depletion mode GaN-based heterostructure, we have designed a metal-semiconductor direct-current triboelectric nanogenerator that achieved voltage up to 45.5 V and a peak power density of 2.32 W/m2. This generator can be used to supply DC power to 14 LEDs in series and drive a digital watch directly. In particular, the generation of direct current is predominantly influenced by the surface states of the undoped GaN cap that produce a large number of electrons and are associated with an additional electric field in the direction of the two-dimensional electron gas created in the u-GaN/AlGaN/AlN/GaN heterostructure of depletion mode GaN-based HEMTs. This research not only introduces a nitride semiconductor material of GaN-based HEMTs for the metal-semiconductor interface friction in the DC TENGs but also elucidates the current generation mechanism of GaN-based HEMT TENGs.

Effects of a GaN cap layer on admittance characteristics of AlGaN/GaN MIS structures

GaN caps are commonly used to reduce sheet charge modulation induced by AlGaN/GaN surface potential. However, the details on how GaN caps affect C–V and G–V characteristics are still unclear. In this paper, we report a difference between these characteristics with and without GaN caps, and we discovered a mechanism in which GaN caps act as quantum wells to affect the charging and discharging of interface states. Finally, we developed a numerical model to simulate admittance characteristics of AlGaN/GaN MIS structures with a GaN cap in high accuracy.