Transition metal dichalcogenides (TMDs) are 2D materials in which the layers are stacked together by van der Waals forces. Although TMDs are expected to be promising for electronic applications, forming a uniform electrode on them is challenging because of the low adhesion forces between metals and TMDs. This study focuses on improving the quality of metal electrodes by introducing atomic H to create surface defects, using Ni on WS2 as an example. The detailed effects of H etching and subsequent Ni growth were investigated using scanning tunneling microscopy (STM) and synchrotron-based X-ray photoemission (XPS) techniques. Our studies reveal that introducing point defects of ∼3.05 × 1011 cm-2 on the WS2 surface, results in a significant shift in Ni growth from the Volmer-Weber to a near Frank-van der Merwe mode. The origin of the change is the bond formation between the Ni and W atoms, which is expected to realize ohmic contact. The optimization of metal-TMD interfaces offers valuable insights for advanced applications.