High‐temperature‐withstanding TiO2‐reinforced cyanate ester composites are developed by mechanical stirring, followed by curing at elevated temperatures. The uniform dispersion of the filler is confirmed using scanning electron microscopy and electron dispersive spectroscopy. All composites, up to a filler fraction of 30 vol%, exhibit a density of more than 90% while it reduces significantly after that. A high relative permittivity of 7.6 and a low loss tangent of 0.0112 are observed for the optimally filled 30 vol%. The addition of the filler further improves the temperature‐withstanding capability of the cyanate ester matrix. Moreover, a high thermal conductivity of 0.543 W mK−1, improved hardness of 24.88 HV, ultimate tensile strength of 11.68 MPa, and a low coefficient of thermal expansion of 36.44 ppm °C−1 are also shown by the optimally filled sample. A moisture absorption of 0.072 vol% observed for the optimal filled sample comes within the limit for microwave substrate applications. Thus, the developed composites are suitable candidates for high‐temperature microwave electronic applications.