Flow boiling of dielectric fluids in copper microchannel heat sinks is highly desirable for cooling large-sized insulated gate bipolar transistor (IGBT) power electronic modules. However, dielectric fluids present challenges in flow boiling because of their unfavorable thermophysical properties. These factors make it difficult to enhance critical heat flux (CHF) without precooling. To address this, we developed a large copper heat sink (10 cm × 5 cm) with Tesla microchannels designed to suppress vapor backflow and promote intense fluid mixing. The microchannels have a high length to hydrodynamic diameter ratio of approximately 220, significantly higher than those in previous studies. Flow boiling experiments using HFE-7100 were conducted for both Tesla and plain-wall microchannels. Tesla channels demonstrated a 26.2 % increase in CHF and a 120 % improvement in heat transfer coefficient (HTC). These enhancements are attributed to the vapor backflow suppression and improved fluid mixing. Moreover, the standard deviation of wall temperature in plain-wall microchannels was 10 times higher than in Tesla channels, highlighting the effectiveness of the periodic Tesla valves in reducing two-phase flow instabilities. Flow pattern visualization was conducted to further understand the mechanism behind vapor regulation, clarifying the role of Tesla valves in controlling vapor backflow. This study demonstrates the potential of dielectric fluids in Tesla microchannels for flow boiling applications, offering a promising solution for cooling large electronics.
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