This investigation presents an analytical model optimized for predicting the curve of Flexible Printed Circuits (FPCs), aiming to enhance design precision within the burgeoning realm of flexible electronics. By modifying the bending Mises stresses derived from the finite element model (FEM), an almost linear relationship was established between the deformed FPC curvature and its length. The analytical model, based on the trend of the FPC curve, integrates differential equations, the Jacobian matrix, and an iterative process. The model's performance, marked by its remarkable efficiency, is rigorously compared with Finite Element Method simulations. The results show a negligible error between the two methods, with the predicted results for different types of FPC curves proving to be highly accurate. The study's insights advocate for the model's adoption in practical applications, suggesting a paradigm shift towards more agile and efficient design methodologies in flexible electronics engineering.