Flagship Conference Research Articles

Deep learning approaches on computer vision

In recent years, deep learning technology has made remarkable achievements in the field of computer vision, promoting the rapid development of image recognition, image generation, image understanding and other tasks. The combination of deep learning and computer vision has brought revolutionary changes to tasks such as image recognition, image generation and image understanding. This paper systematically introduces the development of deep learning and computer and the evolution of key technologies. Further, in order to give readers a deeper understanding of the field of computer vision, this article details the latest research results of some well-known scholars in computer vision, which are published in flagship conferences. The main contribution of this paper is to review the latest research results of computer vision in detail, and look forward to the future research direction and space in this field.

Preface

3nd ASEAN International Conference on Energy and Environment (AICEE) Nusa Dua Bali, Indonesia, 24 August 2023 Accelerating a Just, Secure, and Resilient Energy Transition in ASEAN through Innovation and Interconnectivity Introduction ASEAN Centre for Energy (ACE) is an intergovernmental organization within ASEAN structure that represents the 10 ASEAN Member States’ (AMS) interests in the energy sector. With their growing population and economic growth, AMS are expected to be a new global epicentrum of energy market in the future. This trend pushes energy security as one of the highest priorities in energy development in the region. On the other hand, the ASEAN Plan of Action for Energy Cooperation (APAEC) Phase II: 2021-2025, a regional blueprint on energy cooperation, has a theme and sub-theme in which embracing energy transition is one of the key elements to achieve regional energy security and environmental sustainability. To further accelerate the progress towards a sustainable future, enhance collaboration among various sectors, and bridge the gap between academia, policymakers, and businesses, we are delighted to announce that the ASEAN Centre for Energy (ACE) will be hosting the 3rd ASEAN International Conference on Energy and Environment (AICEE) in conjunction with The ASEAN Energy Business Forum (AEBF) 2023 and The 41st ASEAN Ministers on Energy Meeting (AMEM) on August 24-25, 2023. These events will offer a platform for academics, practitioners, and stakeholders to network, exchange ideas, and explore innovative solutions to address the challenges of energy and the environment. The conference will take place in Bali, a stunning island renowned for its breathtaking scenery and rich cultural heritage. This unique location will provide participants with a memorable and immersive experience, allowing them to explore the fascinating local culture and gain a deeper understanding of the region’s energy and environmental issues. The event promises to be a remarkable occasion fostering collaboration and driving progress towards a sustainable future. This year’s AICEE is the third edition of the annual flagship conference held by ACE. Under the 3rd AICEE, we received 145 extended abstracts, accepted 96 extended abstracts to be compiled as Conference Proceeding and invited 76 authors to submit their full papers. To proceed with the publication, 59 papers are recommended to be the IOP Publishing process, and 44 papers are accepted for the IOP Publication of 2023 AICEE Volume. The 3rd AICEE was convened in-person presentation in partnership with Universitas Pendidikan Nasional (UNDIKNAS), Universiti Teknologi Malaysia (UTM), Energy Research Institute (ERI) Chulalongkorn University, National Energy Technology Center-National Science and Technology Development Agency (ENTEC-NSTDA), (ASEAN Climate Change and Energy Project (ACCEPT), Universitas Indonesia (UI), Institut Teknologi Bandung (ITB), Hawaii University, Universiti Tenaga Nasional (UNITEN). List of Theme, Topic, Key Dates, Participants, Agenda, Steering Committee, Scientific Committee, Organizing Committee and Documentation are available in this Pdf.

Organizing the Big Flagship Conference: Connect +: The International Conference on Robotics and Automation 2024 [Conference Highlights

Organizing the Big Flagship Conference: Connect +: The International Conference on Robotics and Automation 2024 [Conference Highlights

From the Editor-in-Chief

Welcome everybody to the third issue of 2024! Some of us are already in holiday, some are still at work; surely, many of us will meet in the forthcoming conferences, mostly our flagship conference (LICS). In the meanwhile, I invite you to read the present issue of SIGLOG News, whose contents are the following: -The SIGLOG Chair introduces this year edition of LICS and reports on the current situation of SIGLOG. -We present the outcome of the 2024 Alonzo Church Award. This prize was established in 2015 by SIGLOG, by the European Association for Theoretical Computer Science (EATCS), by the European Association for Computer Science Logic (EACSL), and by the Kurt Goedel Society (KGS). In 2022 the KGS was dissolved and, since then, the award has been sponsored by EACSL, EATCS and SIGLOG. The award is for an outstanding contribution represented by a paper or by a small group of papers published within the past 25 years. This year's recipients are Thomas Ehrhard and Laurent Regnier. -Then, you can read a new semantics column, edited by Prakash Panangaden and written by Samson Abramsky and Luca Reggio, on Game comonads ; these offer a categorical view of a number of model-comparison games central to model theory and provide a new bridge between categorical methods developed for semantics, and the combinatorial and algorithmic methods of resource-sensitive model theory. -To conclude, we wrap up this number with the latest issue of SIGLOG Monthly, prepared by Elli Anastasiadi.

Chair's Letter

This year, SIGLOG's flagship conference, the ACM-IEEE Symposium on Logic in Computer Science (LICS), will be held in Tallin, Estonia, during 8--11 July 2024. It will feature invited talks by Martin Escardo and Alexandra Silva, and invited tutorials by Sam Buss and Alex Simpson. Many thanks to Ugo Dal Lago and Javier Exparza (PC chairs), Pawel Sobocinski (Local Organizer), Sam Staton (Publicity and Proceedings chair), Valentin Blot (Proceedings chair) and all the other people who are contributing to make it a top conference. I am sure it will be an exciting and unmissable event, and I hope to see many of you there.

Conference Reports

After the pandemic, it is great that conferences and workshops are more or less "back to normal". I really enjoy meeting colleagues - some of them for the first time after four years - in person, listening to their talks, having entertaining chats, and nice dinners. Thanks to Daniele, Igor and Marco, this SIGLOG newsletter includes two conference reports. Daniele reports on CADE-29 and FSCD 2023 that were jointly held in Rome in early July. It was the first time that these conferences were co-located and this joiner was a success; I am sure that more of such joint events will happen in the near future. Igor and Marco report on LICS 2023 that was held end of July in Boston. This was the 38th edition of LICS, the flagship conference of SIGLOG.

Managing Icc and Globecom Flagship Conferences of Comsoc Interview with Luis M. Correia, Chair of The Globecom/icc Management & Strategy (gims) Standing Committee

Managing Icc and Globecom Flagship Conferences of Comsoc Interview with Luis M. Correia, Chair of The Globecom/icc Management & Strategy (gims) Standing Committee

From the Editor-in-Chief

After a summer full of scientific events, we are now at the last issue of 2023. This issue is quite rich, with two interesting technical columns and the report of the conference organizers of LICS'23, the SIGLOG flagship conference, and of CADE/FSCD.

IEEE Consumer Technology Society Awards Presented At ICCE 2023

The IEEE Consumer Technology Society (CTSoc) would like to congratulate the following winners of the IEEE awards and various CTSoc awards. The awards were presented at the society's flagship conference, the 41st IEEE International Conference on Consumer Electronics (ICCE 2023), in Las Vegas, Nevada, USA, from January 5–8, 2023.

An Interview with John Grundy - 2023 SIGSOFT Awardee

John Grundy received the 2023 SIGSOFT Distinguished Service Award for continued outstanding service to the software engineering community, including the repeated successful organization of flagship conferences, and leadership in the Australasian research and education community. He received a Ph.D. in computer science from the University of Auckland (New Zealand), and he is currently Australian Laureate Fellow and Professor of Software Engineering at Monash University. Beyond this, John Grundy is also Fellow of Automated Software Engineering, Fellow of Engineers Australia, Certified Professional Engineer, Engineering Executive, Senior Member of the ACM and Senior Member of the IEEE.

IEEE Society Interaction, Industry Engagement, and Young Professionals Are the Future of the MTT-S [President’s Column

From my perspective in June 2023, the IEEE Microwave Theory and Technology Society (MTT-S) is a vibrant Society, with many activities ongoing related to our technical field. Several conferences have occurred with a significant impact on our members; those include the International Microwave and Antenna Symposium (IMAS), in Cairo, Egypt ( <xref ref-type="fig" rid="fig1" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">Figure 1</xref> ); the IEEE Wireless and Microwave Technology Conference, in Florida, USA; the IEEE Texas Symposium on Wireless and Microwave Circuits and Systems, in Texas, USA; the IEEE MTT-S International Wireless Symposium, in Qingdao, China; and the IEEE Workshop on Signal and Power Integrity, in Aveiro, Portugal. For June, we have an entire month of events, including the brand-new Wireless Power Transfer and Exhibition, in San Diego, CA, USA; the IEEE RF Radio Frequency Integrated Circuits Symposium; our flagship conference, the IEEE MTT-S International Microwave Symposium; and the Automatic Radio Frequency Techniques Group Microwave Measurement Conference, all co-located in San Diego. At the end of the month, the International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization will be held in Winnipeg, MB, Canada. At all these events, we have a vibrant number of Young Professionals (YPs) events planned along with our industry colleagues, creating an excellent opportunity for academic, industry, and government interaction, impacting the future of microwaves and technology worldwide.

A Look at the June Issue [From the Editor’s Desk

Welcome to the 2023 International Microwave Symposium (IMS2023) and the June issue of <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">IEEE Microwave Magazine</i> . IMS2023, our flagship conference, is meeting this month in San Diego with several other colocated conferences, all part of Microwave Week. In last month’s issue, we provided you with an advanced look at the many activities, such as the technical sessions, workshops, and networking events, as part of our IMS2023 focus issue. As we have done in years past, copies of both the May and June issues of <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">IEEE Microwave Magazine</i> can be found in your delegate bags and at various locations on the exhibit floor. I hope to see you there!

The European Flagship Conferences ESSDERC and ESSCIRC Merge to Become ESSERC [Society News

The European Flagship Conferences ESSDERC and ESSCIRC Merge to Become ESSERC [Society News

See You in San Diego in June! [From the Editor’s Desk

The International Microwave Symposium (IMS) is the IEEE Microwave Theory and Technology Society’s (MTT-S’s) flagship conference, and this major MTT-S event is right around the corner. With a wide range of technical sessions, panel sessions, networking sessions, receptions, and, of course, the huge exhibition, IMS2023 will truly be, as the conference slogan states, where you will find <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">The Coolest Ideas Under the Sun</i> in microwave engineering. You can find the latest about IMS2023 at the conference link, <uri xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">https://ims-ieee.org/</uri> , and later in this issue, you will find a preview of the events at IMS2023.

From the chair

This first issue of 2023 picks up where we left off with follow-ups from our flagship conference, SC22. There, SIGHPC Awards Chair, Bernd Mohr (Jülich Supercomputing Center), and I met Didem Unat (Koç University), the winner of the 2021 SIGHPC Emerging Woman Leader in Technical Computing (EWL/TC) Award. Dr. Unat was unable to travel to receive the award in SC21 due to you-know-what, so we remedied that at SC22. Speaking of, the call for the 2023 EWL/TC Award is now open with nominations due by June 30. Please take this opportunity to nominate a colleague!

Guest Editorial—Selected Papers From the 2022 IEEE International Symposium on Circuits and Systems

The IEEE International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits and Systems (CAS) Society and the world's premiere forum for researchers in the fields of theory, design and implementation of circuits and systems. The IEEE TRANSACTIONS ON BIOMEDICAL CIRCUITS AND SYSTEMS (TBioCAS) highlights selected papers from ISCAS on topics related to biological and healthcare applications. This special section features four selected papers from ISCAS 2022, held in Austin, Texas, USA from May 28 to June 1, 2022.

Special Section on InterPACK2021

The International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) is a flagship conference of ASME Electronic and Photonic Packaging Division (EPPD). It has served as an international forum within the ASME society to share and exchange latest progresses in the research, development, and applications of electronic and photonic packaging since 1992. The aim of ASME Journal of Electronic Packaging (JEP) Special Section for InterPACK is to publish outstanding papers from technical tracks of InterPACK2021, which was held virtually amid COVID-19 pandemic worldwide. This Special Section of the ASME JEP publishes nine papers presented at the InterPACK2021 in the areas of electronics and photonics packaging, micro-electronics reliability, and advanced thermal management from the silicon, package, to data center level. All nine papers published in this JEP Special Section for InterPACK2021 went through a standard peer-review process for journal papers published by ASME.The micro-electronics industry is facing challenges to meet demanding performance and functional needs of high-performance computing (HPC), artificial intelligence (AI), 5 G/mm Wave, and power electronic devices. In order to close this gap, in parallel with new breakthroughs in advancing silicon node, the semiconductor industry is also embracing advanced integrated circuits (IC) packaging technologies, including heterogeneous integration, 2.5D/3D IC packaging, chiplet, additive manufacturing, novel modeling and characterization techniques, and others. This Special Section reflects latest progresses in the IC packaging by publishing nine papers presented at ASME InterPACK2021. We gratefully acknowledge all the authors who have revised their original conference papers for this Special Section and the reviewers who have spent tremendous time and efforts to help improve overall quality of the papers for this Special Section. We also would like to thank the ASME JEP Editor-in-Chief (EIC), Professor Shi-Wei Ricky Lee for his guidance and support, and the assistant to EIC, Dr. Jeffery Lo for his help in this journey.

A Two-Decade Odyssey: My Journey with the Bombay Orthopaedic Society

Introduction: In the fall of 1993, I arrived at King Circle station, a young orthopaedic graduate from the strife-ridden town of Jammu. Bombay, as it was known then, offered me the opportunity to work in one of the finest trauma centers in the country, a dream come true for someone displaced by the violent turmoil in Kashmir. Early Years and Professional Marvel (1993-2001): Working alongside esteemed colleagues such as NS Laud, VT Ingalhalikar, Joy Patankar, Ajay Puri, Ram Chaddha, and Arvind Goregaonkar felt like wielding a magic wand that turned everything to gold. Joining Sion Hospital, a professional marvel, was a significant leap for me. It was during this time that my friend, Ajay Puri, introduced me to the Bombay Orthopaedic Society (BOS), marking the beginning of a profound association. Executive Committee Member (2001-2003): Becoming an executive committee member in 2001 opened doors within BOS’s inner circles. The society, free from bias and politics, focused on nurturing the orthopaedic fraternity. Its unique selling point was enhancing orthopaedic surgery and promoting holistic development. Organising WIROC2003: The pinnacle of my involvement came when I organized WIROC2003, despite the personal adversity of losing my father. This flagship conference became a milestone, setting new standards in organization and academic excellence. From revolutionary conference organizing paradigms to creating academic events, BOS provided the freedom to unleash unrestrained creativity. Secretaryship and Refining Programs (2016-2018): Elected as Secretary in 2016, my role was to refine existing programs and introduce fresh academic activities, maintaining BOS’s academic dominance. Initiatives such as PG classes, the launch of the Journal of Clinical Orthopaedics, and more showcased a burning desire to contribute to the society. Presidency and Innovations (2023)): Now, as the President, I’ve introduced new programs like “Rising Star” and “Student of the Year” to recognize and inspire young talents. Tying it all together is WIROC 2023, with the theme “Brevis Longus Magnus,” aiming to solidify its status as the apex of orthopaedic education. Future Aspirations and Legacy: After relinquishing my office, I envision BOS exploring areas like orthopaedic advocacy, motivating the younger generation, and fostering empathy for patients. BOS, with its unbiased education and commitment to excellence, stands as a beacon for orthopaedic education and treatment. Conclusion: This two-decade journey from a reluctant newcomer to the President’s seat reflects the unique ethos of BOS. With a legacy of unwavering guidance from figures like LN Vora and Anand Thakur NS Laud, D D Tanna and many more who always stood up for BOS and it’s ethos. I shall leave with the confidence that BOS will continue to flourish, and maintain its place in exploring new frontiers in orthopaedic education and advocacy.

Guest Editorial

This Special Issue of IEEE Transactions on Microwave Theory and Techniques (TMTT) is comprised of the extended papers from the 2022 IEEE Microwave Theory and Technology Society (IEEE MTT-S) International Microwave Symposium (IMS2022), held in Denver, CO, USA, in June 2022. The IEEE MTT-S International Microwave Symposium is the world’s major event on microwave technologies annually organized by the IEEE MTT-S as the society’s premier flagship conference. The conference represents a unique opportunity to bring together researchers and practitioners with diverse technical backgrounds to share the most recent advances in MHz-to-THz technologies and systems. After two years of the COVID-19 pandemic, IMS2022 came back to being an in-person-only event that was held on June 19–24, 2022, at the Colorado Convention Center, Denver.

The European Flagship Conferences ESSDERC and ESSCIRC Merge to Become ESSERC [Conference Reports

The European Flagship Conferences ESSDERC and ESSCIRC Merge to Become ESSERC [Conference Reports