Filler Technology Research Articles

Foreword: Introduction to Restylane SubQ, a novel non-animal stabilized hyaluronic acid tissue filler (NASHA)

This special supplement to Aesthetic Surgery Journal provides an in-depth discussion of the clinical characteristics and technique of using Restylane SubQ (Q-Med, Uppsala, Sweden) as a surgical tissue filler. Within the Restylane family of stabilized non-animal hyaluronic acid (NASHA) gels, there exists a technology to tailor the gel particle size to allow for differential applications as a tissue filler, from very superficial to deep-tissue locations. Filler technology has evolved considerably from simple filling of rhytids to a more advanced approach that allows …

Development of Novel Filler Technology for No-Flow and Wafer Level Underfill Materials

Flip chip technology is one of the fastest growing segments of electronic packaging with growth being driven by the demands such as cost reduction, increase of input/output density, package size reduction and higher operating speed requirements. Unfortunately, flip chip package design has a significant drawback related to the mismatch of coefficient of thermal expansion (CTE) between the silicon die and the organic substrate, which leads to premature failures of the package. Package reliability can be improved by the application of an underfill. In this paper, we report the development of novel underfill materials utilizing nano-filler technology, which provides a previously unobtainable balance of low CTE and good solder joint formation.

Cast electrical insulation quality enhancements through improved filler technology

There has been a significant amount of work documenting the benefits of using silane coupling agents in polymer composites. One intention of this article is to provide a brief overview of performance improvements they provide with respect to electrical insulation applications. However, the value of selecting the best method of silane usage has not received sufficient awareness in the marketplace. Therefore, more emphasis is placed on the implications of using both methods. The second major intention of this article is to offer ways to take advantage more effectively of the available benefits of specifying the filler system properties at the level of attention it deserves.

New High Yield, High Reliability Materials System for Silver Multilayer Construction

Complex mixed metallurgy multilayers require a very robust dielectric to withstand shorting or blistering effects, together with high density for long‐term reliability in humid environments. The development and performance of a new multilayer dielectric which meets these needs is presented here. A dielectric frit chemistry has been developed with a view to eliminating short circuits and blistering induced by the proximity of dissimilar metallurgies on multiple refiring. Appropriate filler technology has also been developed to optimise dielectric density, toughness and laser‐trim properties. High density has yielded excellent HBT (High Bias Temperature) and HHBT (High Humidity Bias Test) performance. Data on multilayer circuit bowing are presented which take account of the interaction of conductor frit and the dielectric on firing. Silver conductor is employed in inner layers to optimise conductivity and cost. A new 1:3 PdAg conductor for termination of components and resistors also permits heavy Al wire bonding with good aged performance. 25 µm Au and 37 µm Al wire bonding is facilitated by gold conductor on dielectric. The laser trim characteristics of a new resistor series on dielectric are described. The materials system has been tested in a complex multilayer structure which, with the use of a new silver via fill conductor, resulted in defect‐free circuits with zero yield loss.