Channel Of Field Effect Transistor Research Articles

Amplification‐free sub-femtomolar monitoring of SARS-CoV-2-RNA in serum samples using cDNA-modified MoS2 field-effect transistor

The rapid spread of infectious diseases, exemplified by the well-known case of COVID-19, which has led to a global pandemic, has garnered increasing attention toward the development of simple and efficient biosensors for diagnosis. In this study, a field-effect transistor (FET)-based biosensor offers an alternative and promising solution for the diagnosis of clinical COVID-19. Molybdenum disulfide (MoS2) in a channel FET modified with a probe complementary DNA (cDNA) can sensitively detect selected specific sequences from SARS-CoV-2 through hybridization. MoS2 was modified with probe cDNA and exhibited a linear concentration range of 1 fM to 0.1 nM in both phosphate-buffered saline (PBS) and serum samples, with low limits of detection (LOD) of 0.21 and 0.73 fM, respectively. In addition, it demonstrated a rapid response time of 3 min in clinical samples. The developed biosensor is capable of analyzing RNA from 19 clinical samples. These results indicate that the biosensor successfully distinguished between healthy and infected samples, which is consistent with the RT-PCR results (kappa coefficient = 1). Additionally, a notable difference was observed between the RdRp samples of SARS-CoV-2 and SARS-CoV. Therefore, we believe that this study offers a reliable and appealing option for the diagnosis of COVID-19.

Characterization of bulk trap density using fully I–V-based optoelectronic differential ideality factor in multi-layer MoS2 FETs

Abstract Molybdenum disulfide (MoS2) has excellent optoelectronic properties, chemical stability, and a two-dimensional (2D) structure, making MoS2 a very versatile field-effect device material. Herein, we characterize MoS2 and utilize a photo-responsive I–V technique for extracting the energy distribution of the bulk traps in multi-layer MoS2 field effect transistors (FET). This method uses the differential ideality factor in both dark and light conditions. The differential ideality factor enables the efficient quantitative extraction of the device trap density by considering the nonlinear characteristics of the subthreshold region (V ON < V GS < V T). To accurately differentiate between the sub-bandgap traps and the interface traps near the conduction band, near-infrared light (λ= 1530 nm) optical illumination was used for the light state characterization. The bulk trap densities under dark state and light state conditions were derived for multi-layer (7-layer and 9-layer) MoS2 FET channels, and the influence of light illumination and overall multi-layer thickness on the bulk trap density was confirmed. The accurate extraction of the trap density enables the design of MoS2 FETs with long-term stability and high optoelectronic performance.

Characterizing parameter variations for enhanced performance and adaptability in 3 nm MBCFET technology

With the continuous scaling down of semiconductor devices, traditional transistor architectures face significant challenges in maintaining performance and power efficiency. Multi-bridge channel field-effect transistors (MBCFETs) are promising candidates for next-generation of transistors, enabling significant size reduction while preserving high performance. This paper investigates both n-type and p-type 3-nm MBCFETs with a focus on their behavior under diverse operating conditions. The study examines the influence of doping concentration, sheet thickness, temperature, device width, and the number of sheets, on the device's functionality aiming for high-performance applications. Doping concentrations of acceptors and donors ranging from 1 × 10 15 cm−3 - 9 × 10 17 cm−3 and 1 × 10 17 cm−3 - 9 × 10 19 cm−3, respectively, to observe their impact on device performance. Similarly, sheet thicknesses from 1 nm to 2 nm and device widths from 3 nm to 30 nm are analyzed to understand the scaling effects. The temperature varies from 273.15 K to 573.15 K to simulate different operational environments, while the number of sheets, ranging from 1 to 7, is adjusted to evaluate structural effects on device behavior. By extracting the subthreshold swing (SS), threshold voltage (Vth), ON-current (ION), OFF-current (IOFF), and the ION/IOFF ratio, the study offers valuable insights into the suitability and potential applications of N-MBCFET and P-MBCFET devices at the ultra-scaled 3 nm dimension. At room temperatures, the SS achieves 60 mV dec⁻1 for n-type and 64 mV dec⁻1 for p-type which indicates proper switching speed, with corresponding ON/OFF ratios of 2 × 106 and 1 × 105 for n-type and p-type, respectively. This study makes notable contributions to the field of nanoscale transistor technology, aiding in the design and optimization of future electronic devices.

WS2 Nanotube Transistor for Photodetection and Optoelectronic Memory Applications.

Nanotube and nanowire transistors hold great promises for future electronic and optoelectronic devices owing to their downscaling possibilities. In this work, a single multi-walled tungsten disulfide (WS2) nanotube is utilized as the channel of a back-gated field-effect transistor. The device exhibits a p-type behavior in ambient conditions, with a hole mobility µp ≈ 1.4 cm2V-1s-1 and a subthreshold swing SS ≈ 10 V dec-1. Current-voltage characterization at different temperatures reveals that the device presents two slightly different asymmetric Schottky barriers at drain and source contacts. Self-powered photoconduction driven by the photovoltaic effect is demonstrated, and a photoresponsivity R ≈ 10 mAW-1 at 2V drain bias and room temperature. Moreover, the transistor is tested for data storage applications. A two-state memory is reported, where positive and negative gate pulses drive the switching between two different current states, separated by a window of 130%. Finally, gate and light pulses are combined to demonstrate an optoelectronic memory with four well-separated states. The results herein presented are promising for data storage, Boolean logic, and neural network applications.

Nanotransistor-based gas sensing with record-high sensitivity enabled by electron trapping effect in nanoparticles

Highly sensitive, low-power, and chip-scale H2 gas sensors are of great interest to both academia and industry. Field-effect transistors (FETs) functionalized with Pd nanoparticles (PdNPs) have recently emerged as promising candidates for such H2 sensors. However, their sensitivity is limited by weak capacitive coupling between PdNPs and the FET channel. Herein we report a nanoscale FET gas sensor, where electrons can tunnel between the channel and PdNPs and thus equilibrate them. Gas reaction with PdNPs perturbs the equilibrium, and therefore triggers electron transfer between the channel and PdNPs via trapping or de-trapping with the PdNPs to form a new balance. This direct communication between the gas reaction and the channel enables the most efficient signal transduction. Record-high responses to 1–1000 ppm H2 at room temperature with detection limit in the low ppb regime and ultra-low power consumption of ~\\documentclass[12pt]{minimal} \\usepackage{amsmath} \\usepackage{wasysym} \\usepackage{amsfonts} \\usepackage{amssymb} \\usepackage{amsbsy} \\usepackage{mathrsfs} \\usepackage{upgreek} \\setlength{\\oddsidemargin}{-69pt} \\begin{document}$$\\sim$$\\end{document}300 nW are demonstrated. The same mechanism could potentially be used for ultrasensitive detection of other gases. Our results present a supersensitive FET gas sensor based on electron trapping effect in nanoparticles.

Ultrathin LiF Insertion and Ensued Contact Resistance Reduction in MoS2 Channel Transistors

Molybdenum disulfide (MoS2) is a representative 2D n‐type semiconductor for various electron devices, but its lateral conduction performances are still restricted, which are mainly attributed to the contact resistance (Rc) in field‐effect transistors (FETs). Low‐enough Rc value must be realized toward practical device fabrications. Herein, 2D MoS2 FETs using chemical vapor deposited (CVD) MoS2 channels with and without the ultrathin LiF interlayer are fabricated, to demonstrate the practical benefits of LiF. In addition, LiF is also applied to Al metal which is known to be more Earth abundant than Au, expecting the similar positive effects of the inserted LiF. When 35 CVD‐grown MoS2 channel FETs with Au are characterized on an identical gate dielectric substrate, the higher value of mobility ranging 55–60 cm2 V s−1 is achieved with the inserted LiF than that without LiF (≈20 cm2 V s−1). In the case of another MoS2 FET with exfoliated flake channel and Al contact, its field‐effect mobility with LiF insertion appears to be ≈35 cm2 V s−1, approaching to an almost Rc‐free mobility (42 cm2 V s−1).

Piezoresistive sensitivity enhancement below threshold voltage in sub-5 nm node using junctionless multi-nanosheet FETs

In this paper, the piezoresistive sensitivity is enhanced by applying uniform mechanical stress (MS) on the multi-nanosheet (NS) channels of sub-5 nm junctionless field-effect transistors. The piezoresistivity of the sensing device is boosted by narrowing channel conductivity using low gate biasing and reducing physical channel width, resulting in the maximum (∼6 times higher) sensitivity observed in the subthreshold regime compared to the ON-state condition. In addition, the sensitivity is extensively increased by ∼30.3% near the threshold voltage with horizontally multi-NS stacking due to the uniform MS distribution on the multi-NS channels, which can sense slight deflection of pressure on the circular diaphragm. These results show that the tunable sensitivity of junctionless multi-channel devices is superior to the inversion mode, a consequence of the less scattering effect, better thermal stability, and low electronic noise.

Toward Ideal Low-Frequency Noise in Monolayer CVD MoS2 FETs: Influence of van der Waals Junctions and Sulfur Vacancy Management.

The pursuit of sub-1-nm field-effect transistor (FET) channels within 3D semiconducting crystals faces challenges due to diminished gate electrostatics and increased charge carrier scattering. 2D semiconductors, exemplified by transition metal dichalcogenides, provide a promising alternative. However, the non-idealities, such as excess low-frequency noise (LFN) in 2D FETs, present substantial hurdles to their realization and commercialization. In this study, ideal LFN characteristics in monolayer MoS2 FETs are attained by engineering the metal-2D semiconductor contact and the subgap density of states (DOS). By probing non-ideal contact resistance effects using CuS and Au electrodes, it is uncovered that excess contact noise in the high drain current (ID) region can be substantially reduced by forming a van der Waals junction with CuS electrodes. Furthermore, thermal annealing effectively mitigates sulfur vacancy-induced subgap density of states (DOS), diminishing excess noise in the low ID region. Through meticulous optimization of metal-2D semiconductor contacts and subgap DOS, alignment of 1/f noise with the pure carrier number fluctuation model is achieved, ultimately achieving the sought-after ideal LFN behavior in monolayer MoS2 FETs. This study underscores the necessity of refining excess noise, heralding improved performance and reliability of 2D electronic devices.

Comparative Study of Field-Effect Transistors Based on Graphene Oxide and CVD Graphene in Highly Sensitive NT-proBNP Aptasensors.

Graphene-based materials are actively being investigated as sensing elements for the detection of different analytes. Both graphene grown by chemical vapor deposition (CVD) and graphene oxide (GO) produced by the modified Hummers' method are actively used in the development of biosensors. The production costs of CVD graphene- and GO-based sensors are similar; however, the question remains regarding the most efficient graphene-based material for the construction of point-of-care diagnostic devices. To this end, in this work, we compare CVD graphene aptasensors with the aptasensors based on reduced GO (rGO) for their capabilities in the detection of NT-proBNP, which serves as the gold standard biomarker for heart failure. Both types of aptasensors were developed using commercial gold interdigitated electrodes (IDEs) with either CVD graphene or GO formed on top as a channel of liquid-gated field-effect transistor (FET), yielding GFET and rGO-FET sensors, respectively. The functional properties of the two types of aptasensors were compared. Both demonstrate good dynamic range from 10 fg/mL to 100 pg/mL. The limit of detection for NT-proBNP in artificial saliva was 100 fg/mL and 1 pg/mL for rGO-FET- and GFET-based aptasensors, respectively. While CVD GFET demonstrates less variations in parameters, higher sensitivity was demonstrated by the rGO-FET due to its higher roughness and larger bandgap. The demonstrated low cost and scalability of technology for both types of graphene-based aptasensors may be applicable for the development of different graphene-based biosensors for rapid, stable, on-site, and highly sensitive detection of diverse biochemical markers.

Effect of fabrication process on contact resistance and channel in graphene field effect transistors

Contact resistance, as one of the main parameters that limits the performance of graphene-based transistors, is highly dependent on the metal-graphene contact fabrication processes. These processes are investigated and the corresponding resistances are measured based on the transfer length method (TLM). In fabrication processes, when annealing is done on chemical vapor deposition (CVD)-grown graphene samples that are transferred onto SiO2/Si substrates, the adhesion of graphene to the substrate is improved, and poly methyl methacrylate (PMMA) residues are also reduced. When the metal deposition layer is first applied to the graphene, and then, the photolithography process is performed to define the electrodes and graphene sheet, the graphene-metal contact resistance is better than that in other methods due to the removal of photoresist residues. In fact, by changing the sequence of the fabrication process steps, the direct contact between photoresist and graphene surface can be prevented. Thus, the contact resistance is reduced and conductivity increases, and in this way, the performance of graphene transistor improves. The results show that the fabrication process has a noticeable effect on the transistor properties such as contact resistance, channel sheet resistance, and conductivity.‌ Here, by using the annealing process and changing the order of photolithography processes, a contact resistance of 470 Ω μm is obtained for Ni-graphene contact, which is relatively favorable.

Direct Assessment of Defective Regions in Monolayer MoS2 Field-Effect Transistors through In Situ Scanning Probe Microscopy Measurements.

Implementing two-dimensional materials in field-effect transistors (FETs) offers the opportunity to continue the scaling trend in the complementary metal-oxide-semiconductor technology roadmap. Presently, the search for electrically active defects, in terms of both their density of energy states and their spatial distribution, has turned out to be of paramount importance in synthetic transition metal dichalcogenides layers, as they are suspected of severely inhibiting these devices from achieving their highest performance. Although advanced microscopy tools have allowed the direct detection of physical defects such as grain boundaries and point defects, their implementation at the device scale to assess the active defect distribution and their impact on field-induced channel charge modulation and current transport is strictly restrained. Therefore, it becomes critical to directly probe the gate modulation effect on the carrier population at the nanoscale of an FET channel, with the objective to establish a direct correlation with the device characteristics. Here, we have investigated the active channel in a monolayer MoS2 FET through in situ scanning probe microscopy, namely, Kelvin probe force microscopy and scanning capacitance microscopy, to directly identify active defect sites and to improve our understanding of the contribution of grain boundaries, bilayer islands, and defective grain domains to channel conductance.

A comparative study on 2D materials with native high-[formula omitted] oxides for sub-10 nm transistors

Two-dimensional (2D) transition metal dichalcogenides (TMDs) with native high-κ oxides have presented a new avenue towards the development of next-generation ultra-scaled field-effect transistors (FETs). These materials have been experimentally shown to form a natively compatible oxide layer with a high dielectric constant, which can help scale down both the transistor size and the supply voltage. We present a material and device performance study into the use of several of these materials – namely HfS2, HfSe2, ZrS2, ZrSe2 – as channels in sub-10 nm FETs. All four materials exhibit isotropic transport at 10 nm channel length with ON currents over 1000 μA/μm but show anisotropic transport and degraded ON currents at 5 nm channel length. In general, the sulfide family excels in terms of subthreshold characteristics at sub-10 nm channel lengths. HfS2, in particular, surpasses all the other materials in terms of ON currents and subthreshold swing (SS), allowing it to also achieve excellent intrinsic performance. We have identified HfS2 as a superior material within this TMD family for sub-10 nm FETs.

Removing Conjugated Polymers from Aligned Carbon Nanotube Arrays.

Aligned carbon nanotube (A-CNT) with high semiconducting purity and high-density have been considered as one of the most promising active channels for field-effect transistors (FETs), but conjugated polymer dispersant residues on the surface of A-CNT have become the main obstacle for its further development in electronics applications. In this work, a series of removable conjugated polymers (CPs) are designed and synthesized to achieve favorable purification and alignment for CNT arrays with a high density of ≈360 CNTs/µm. Furthermore, a removal process of CPs on the CNT array film is developed. Raman spectra show that the CNTs in array film are almost not damaged after the removal process, and the G/D ratio is as high as 35. The field-effect transistors (FETs) are fabricated with a saturation current density up to 600µAµm-1 and a current on-off ratio of ≈105, even with a relatively long channel length of ≈3µm.

Multilayer WS2 for low-power visible and near-infrared phototransistors

Mechanically exfoliated multilayer WS2 flakes are used as the channel of field effect transistors for low-power photodetection in the visible and near-infrared (NIR) spectral range. The electrical characterization as a function of the temperature reveals devices with n-type conduction and slightly different Schottky barriers at the drain and source contacts. The WS2 phototransistors can be operated in self-powered mode, yielding both a current and a voltage when exposed to light. The spectral photoresponse in the visible and the NIR ranges shows a high responsivity (4.5 μA/W) around 1250 nm, making the devices promising for telecommunication applications.

Variability and high temperature reliability of graphene field-effect transistors with thin epitaxial CaF2 insulators

Graphene is a promising material for applications as a channel in graphene field-effect transistors (GFETs) which may be used as a building block for optoelectronics, high-frequency devices and sensors. However, these devices require gate insulators which ideally should form atomically flat interfaces with graphene and at the same time contain small densities of traps to maintain high device stability. Previously used amorphous oxides, such as SiO2 and Al2O3, however, typically suffer from oxide dangling bonds at the interface, high surface roughness and numerous border oxide traps. In order to address these challenges, here we use 2 nm thick epitaxial CaF2 as a gate insulator in GFETs. By analyzing device-to-device variability for about 200 devices fabricated in two batches, we find that tens of them show similar gate transfer characteristics. Our statistical analysis of the hysteresis up to 175oC has revealed that while an ambient-sensitive counterclockwise hysteresis can be present in some devices, the dominant mechanism is thermally activated charge trapping by border defects in CaF2 which results in the conventional clockwise hysteresis. We demonstrate that both the hysteresis and bias-temperature instabilities in our GFETs with CaF2 are comparable to similar devices with SiO2 and Al2O3. In particular, we achieve a small hysteresis below 0.01 V for equivalent oxide thickness (EOT) of about 1 nm at the electric fields up to 15 MV cm−1 and sweep times in the kilosecond range. Thus, our results demonstrate that crystalline CaF2 is a promising insulator for highly-stable GFETs.

Suppression of plasmonic interference in helicity sensitive broadband terahertz detectors

The recently observed helicity-sensitive response, occurring in graphene based field-effect transistors (FETs) is interpreted as a result of the intrinsic phase asymmetry of these devices and interference of plasmons in the FET channel. The graphene-based plasmonic interferometers presented in this work enable the room temperature detection of THz radiation as well as allows us to distinguish between the rotation direction of circular polarized waves. To illustrate the broadband nurture of the observed effects, similar measurements were carried out at both THz and mid-infrared frequencies. The precise control of the carriers type and their concentration throughout the channel length allows us to demonstrate the helicity-sensitive response over a wide range of the gate potentials (from negative to positive values). We experimentally show that the formation of p–n junction inside the graphene channel leads to additional scattering of excited plasma waves, resulting in the suppression of their interference and consequent reduction of the helicity-sensitive contribution.

Ballistic performance and overshoot effects in gallenene nanoribbon field-effect transistors

Gallenene is a novel metallic 2D material that can provide a semiconducting counterpart if patterned into quasi-one-dimensional (quasi-1D) nanostructures, i.e., gallenene nanoribbons (GaNRs). We investigate semiconducting GaNRs as a potential channel material for future ultrascaled field-effect transistors (FETs) by employing quantum transport simulations based on Green's functions and tight-binding Hamiltonians with the orbital resolution calibrated on ab initio calculations. The impact of GaNR width downscaling from ∼6 nm down to ∼0.2 nm on the electronic, transport, and ballistic device properties is investigated for the FET channel length of 15 nm. We report current enhancement and injection velocity overshoot effects for sub-1.2 nm-wide nFETs and pFETs, with a maximum current increase of 53% in the 1.2 nm-wide GaNR pFET in comparison to the widest device. In addition, promising current-driving capabilities of n- and p-channel GaNR FETs are observed with top ballistic currents of more than 2.2 mA/μm and injection velocities of up to 2.4 × 107 cm/s. The reported data are explained by analyzing the evolution of band structure and related parameters such as injection velocity, quantum capacitance, effective transport mass etc., with increasing quantum confinement effects in ultranarrow GaNRs. Generally, we find that quasi-1D gallenene is a promising channel material for future nanoscale FETs, especially for transistor architectures based on stacked nanosheets.

The effect of external magnetic field on the instability of THz plasma waves in nanoscale graphene field-effect transistors

Abstract The instability of plasma waves in the channel of field-effect transistors will cause the electromagnetic waves with THz frequency. Based on a self-consistent quantum hydrodynamic model, the instability of THz plasmas waves in the channel of graphene field-effect transistors has been investigated with external magnetic field and quantum effects. We analyzed the influence of weak magnetic fields, quantum effects, device size, and temperature on the instability of plasma waves under asymmetric boundary conditions numerically. The study results show that the magnetic fields, quantum effects, and the thickness of the dielectric layer between the gate and the channel can increase the radiation frequency. Additionally, we observed that increase in temperature leads to a decrease in both oscillation frequency and instability increment. The numerical results and accompanying images obtained from our simulations provide support for the above conclusions.

Ultrafast switching in spin field-effect transistors based on borophene nanoribbons.

Borophene, owing to the high mobility and long spin coherent length of its carriers, presents significant opportunities in ultrafast spintronics. In this research, we investigate the spin-dependent conductance of a Datta-Das field-effect transistor (FET) based on an armchair β12-borophene nanoribbon (BNR) using the tight-binding (TB) Hamiltonian in combination with the non-equilibrium Green's function (NEGF) method. The spin FET electrodes are magnetized by ferromagnetic (FM) insulators arranged in both parallel and anti-parallel configurations. This device acts as a controllable spin filter in the presence of Rashba spin-orbit coupling (SOC) for both configurations and its spin current is well modulated by a gate voltage and the strength of the Rashba SOC. For anti-parallel configurations, an energy gap emerges within a certain range of incoming electron energy which can disappear for electrons with flipped spin under the Rashba SOC. Furthermore, our findings indicate that the electron-electron (e-e) interaction helps the spin precession of electrons injected into the spin FET channel, thereby strengthening the Rashba SOC effect. Notably, a gate voltage can adjust the current-voltage (I-V) characteristics of this device. Finally, our calculations demonstrate that under the same conditions, the current magnitude and Ion/Ioff ratio of borophene spin FETs are several times higher than those of graphene and silicene spin FETs.

TCAD based investigation of junctionless phototransistor for UVC radiation detection

In this study, a gallium oxide gated junctionless phototransistor has been proposed for the first time for deep ultraviolet (210–280 nm) solar blind radiation (UVC) detection. The inherent optical property of gallium oxide has been utilized here to absorb deep ultraviolet radiation. It is designed as a photo absorber layer over the complete channel of the junctionless field effect transistor. Here, the conduction material is silicon (source, channel, and drain), which is entirely separated by the photo absorber (gallium oxide) layer with an intermediate silicon dioxide insulation layer, resulting in MOS-based architecture. The design optimization has been done using the SILVACO ATLAS-2D TCAD simulations by first calibrating the experimentally fabricated junctionless transistor. The study of the proposed gallium oxide gated junctionless phototransistor shows that the gallium oxide thickness of 30 nm is the best-optimized thickness with a maximum responsivity of 4.38 × 104 A/W and detectivity of 1.1 × 1012 Jones achieved at a very less required Vgs = −0.03 V. The spectral response has been performed and it has been calculated that the proposed architecture is best sensitive for 210 nm wavelength and sensitivity reduces significantly outside the deep UV solar spectrum. The time response analysis has also been presented, and it is concluded that the junctionless phototransistor has the advantage of less gate voltage requirements than other gallium oxide-based phototransistors with quite high responsivity in the deep UV solar spectrum.