With the advancement of semiconductor technology, advanced electronic devices have become increasingly efficient, highly integrated and multifunctional, producing a large amount of heat during operation, thus decreasing the device efficiency and increasing the requirements for thermal interface materials. The use of a magnetic field to prepare pitch-based carbon fibers (CFs) with ultrahigh axial thermal conductivities and aspect ratios is a promising method for preparing thermal interface materials. However, past methods are not adequately simple or effective. Herein, we propose a simple, efficient method for preparing a novel thermally conductive CF interface material with a superoriented and closely arranged structure. The thermal conductivity of the vertical plane can reach 82.026 W m-1 K-1, which is higher than that of many other alloys. During the experiment, we prove that the torsional vibration of the vibrating plate can greatly resolve the issue of powder bridging generated during preparation. In addition, we discover and explain the heat return conduction phenomenon through numerical simulation. Our innovative preparation process and our analysis of thermal conduction can provide a new method and unique view for the design of thermal interface materials.