Fe Plate Research Articles

Surface nanocrystallization of iron induced by ultrasonic shot peening

A nanocrystalline surface layer was fabricated on a pure Fe plate by using an ultrasonic shot peening (USSP) technique. The USSP induced surface nanocrystallization products were characterized by means of X-ray diffraction (XRD) and transmission electron microscope (TEM). Experimental evidences showed that after USSP treatments, the initial coarse-grained structure in the surface layer was refined into equiaxed ultrafine grains (about 10nm) with random crystallographic orientations. The grain refinement mechanism during USSP treatments is discussed.

新型マグネトロンプラズマによるレジストエッチング

Ring-shaped permanent magnets are placed on the back of both the cathode and the anode electrodes in a parallel-plate reactive ion etching device (RIE) and magnetron plasmas with axial symmetry are produced. The S pole of the magnets is directed to the plasma. An Al plate is placed on the cathode and its thickness is varied in order to adjust the distance between the magnet and the cathode surfaces. A cone shaped Fe plate is also tried to be placed between the magnet and the Al plate. The spatial distribution of the magnetic field near the cathode is controlled. A photoresist is etched with the new developed magnetron device. The etch rate of photoresist is about 5 times as large as that by reactive ion etching. The etch rate uniformity is below 22% within the radial distance of 27 mm. Line and space patterns with good side wall profiles are etched successfully.

The magnetic properties of Tb-Fe-(B) thin films fabricated by rf magnetron sputtering

The magnetic properties of giant magnetostrictive TbFe and TbFeB thin films are systematically investigated. The films were fabricated by rf magnetron sputtering using a composite target which consists of an Fe plate and Tb chips. The introduction of B to the films was done by using an Fe plate containing B. The microstructure, examined by X-ray diffraction, mainly consists of an amorphous phase and, at high Tb contents, a pure Tb phase also exists. A progressive change in the direction of anisotropy from the perpendicular to in-plane occurs as the Tb content increases from 35 to 68 at.% for the B-free TbFe films and from 44 to 67 at.% for the TbFeB thin films. The boundary at which the anisotropy change occurs shifts significantly towards to higher Tb contents when B is introduced to the films. The saturation magnetization exhibits a maximum at the Tb contents of 42 and 48 at.% and the values are about 5800 and 5100 G for the TbFe and TbFeB thin films, respectively. The coercive force, measured in the easy direction, decreases monotonically with the Tb content and ranges from 7.5 to 100 Oe when the films with in-plane anisotropy are considered. The magnetic softness of the present film which exhibits the coercive force of below 10 Oe and a typical squared-loop shape, and saturates at a low field of 1 kOe, is considered to be the best, to our knowledge, among this kind of thin films.

ＨＩＰ圧下における反応および焼結を利用したβ−ＦｅＳｉ２焼結体の作製

In order to obtain sintered FeSi2, the mixed powder of Fe and Si has been hipped at below the decomposition temperature of 986°C. In this process, the reaction and the densification have been proceeded simultaneously. Before the hipping of powders, the reaction of Fe plate and Si plate was examined to understand the reaction of Fe and Si under hipping condition. It was found that high temperature and low pressure accelerated the reaction. Based on the results, hipping conditions of the powder were decided. Single phase of FeSi2 was obtained under the hipping condition of 850 - 900°C, 50MPa and 30min -4hours. However, the relative densities of the hipped specimens were 82 - 90%. To obtain higher density, the mixed powder was hipped under 50 MPa to be caused the reaction completely, and then was densified under high pressure of 200MPa. Applying this 2 stage hipping, the relative density increased up to 98%. It is concluded that HIP technique is useful for the materials which transform at high temperature.

無電解Ｃｏ‐Ｎｉ‐Ｐ合金めっきの防食特性

The corrosion protective properties of electroless Co-Ni-P alloy plating were examined in 5% NaCl solution. The corrosion resistance of Co-P film was better than that of Ni-P film. The corrosion potential of the films was less noble in the order Ni-P, Co-P, Co-Ni-P, and contact corrosion current density in circuits constructed of deposited film and an Fe plate decreased in the same order.Thus the amount of dissolution of Fe substrate in the corrosive solution decreased and the corrosion protective properties of the depositions on the Fe substrates improved in the same order.

Surface structure of ultra-thin Fe films on a Rh(100)surface.

The structure and growth mode of ultra-thin Fe films on a Rh(100) single crystal surface were investigated by angle-resolved Auger electron spectroscopy (ARAES) and lowenergy electron diffraction(LEED) in an ultra high vacuum system. Fe films were prepared by evaporation on an Rh substrate kept at room temperature from an Fe plate heated by a tungsten filament. The angular distributions of the Rh and Fe Auger electrons were measured along the two azimuth, [010] and [110] of the (100) surface. The results show that Fe films grow via a layer-by-layer growth mode and have an fcc structure on the Rh surface.

ChemInform Abstract: A New Electrochemical Synthesis of Iron Spinel Oxide in LiOH

Abstractis carried out galvanostatically in 4 M KOH, 4 M LiOH, and their mixture using a Fe plate, a Ni plate, and Hg/HgO as working‐, counter‐, and reference electrodes.

Structure of Ti–Fe Alloy Films Prepared by Composite-Cathode Sputtering

Films of the binary alloy TixFe1-x (0<x<1) of uniform composition, from 500 Å to 1 µm thick, were prepared by d.c. sputtering with a composite cathode containing a Ti plate and Fe wires, or an Fe plate and Ti wires. Analyses of the films by EPMA and Auger electron spectroscopy showed that the composition was uniform over an area of about 20×20 mm2. X-ray and electron diffraction analyses of the the films showed the existence of amorphous phases at 0.05<x<0.30, 0.35<x<0.50 and 0.55<x<0.83 and a β-Ti (b.c.c.) phase at 0.80<x<0.94, in addition to an α-Fe (b.c.c.) phase at 0<x<0.30, a TiFe2 (hexagonal) Laves phase at 0.25<x<0.35, a TiFe (CsCl type) phase at 0.45<x<0.55 and an α-Ti (h.c.p.) phase at 0.83<x<1.

Activity and diffusivity measurements of copper in γ and δ Fe by equilibration between solid Fe and liquid Ag

The activities of Cu in solid Fe for 1323 <=T <= 1773 K have been determined by equilibrating the surface of initially pure Fe plates with liquid Ag-Cu alloys and by using the literature values of the Cu activity in Ag-Cu alloys. The equilibrations have been confirmed by the agreement of surface compositions between an initially pure Fe plate and an Fe-Cu alloy plate having more content of Cu than the surface concentration. The equilibrated Fe plates were essentially binary Fe-Cu alloys, because no Ag was detected by an electron probe analyzer in the Fe plates. Interdiffusivities in solid Fe-Cu alloys for the same temperature range have also been determined from penetration profiles of Cu in the plates. The ternary phase diagram for the Ag-Cu-Fe system at 1480 K has been determined from solubility measurements of Fe in liquid Ag-Cu alloys.

軟ろう付用フラックスの作用機構に関する研究(第6報)

In previous paper, the flux action of various inorganic metal salts (chloride, sulfate and nitrate) for soldering was reported about the relation between the reaction of flux with molten Sn solder and spreadability of Sn solder on Cu plate.In this report, authors have studied the relation between the reaction of base plate (Ni, Fe) or Sn solder with flux and spreading phenomenon of Sn solder on Fe plate or Ni plate in the case of various silver salts and copper salts as flux.The results obtained were as follows:(1) The corrosion rate increases from Ni, to Cu and to Fe.(2) The effects of corrosion products on spreadability increased from FeCl3, to FeCl2, to NiCl2, and to CuCl2.(3) FeSn2 coated on Sn solder obstructs spreading of Sn solder.(4) FeSn2 produced by the reaction of molten Sn with Fe salt is controlled in proportion to the amount of Ag or Cu in Sn solder.(5) Spreading of Sn solder on Fe plate is affected by FeSn2 produced at interface of Sn solder and base plate.(6) When Ni plate is used, Ni dissolves little in Sn solder and spreadability depends on the reactivity of Sn with flux.