In contrast to monotonic load studies, the engagement with a cyclic time dependent processes of small volume material response has been restrained. Crack tolerance in thin films almost by definition is restricted. Nevertheless, in terms of structural stability the fatigue resistance remains a critical concern regardless the scale. The cyclic displacement amplitudes can be enhanced by remote mechanical stress/strain or thermal origins resulted in similar outcome of cumulative irreversible micro-plasticity damage. Thus, the cyclic life in nano applications is mainly dominated by the crack nucleation controlled process. The current study is centered on the fatigue crack initiation stage as a first order design pillar and therefore require additional experimental input. Activities in elastic-plastic polycrystalline and single crystal systems in various crystal structures are described. Beside findings regarding the fatigue cracks initiation life, the role of compressive residual stress on the cyclic response has been also analyzed. The fatigue crack initiation criteria have been associated to other constitutive assessments that are related mainly to the crack stability equation elements. In addition, completely different insights are introduced into the concept of the critical film thickness, indicating the susceptibility to the crack formation. As addressed in heteroepitaxial layers, specific analogous characterization exists either in dislocation activities or by triggering crack formation. The physical aspects of threading dislocations growth and glide behavior and local decohesion ramifications are highly dependent on the layer thickness. Experimentally based, under strain control conditions at ambient temperatures the aforementioned fatigue crack initiation stage in small volume segments, obeyed a cumulative damage mechanism. It was also established that the low energy dislocation structures and the initiation life were dramatically dependent on the strain amplitude range. The role of compressive residual stress in prolonging the fatigue initiation life was also consistent. Even in silicon based materials, dislocation activities prevailed. It became apparent that categorical generalization in nano-silicon thin film fatigue behavior is beyond the susceptibility to the native oxide or environmental interaction. Issues like film processing methodology, film/substrate interfaces, residual stresses and micro-cracking feasibility occurrence as wall as critical sites still require further design insights.
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